FPC flattening jig and FPC flattening method

Patent metadata

Field	Value
Publication number	US-10575409-B2
Application number	US-201615168797-A
Country	US
Kind code	B2
Filing date	May 31, 2016
Priority date	Sep 28, 2015
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

A FPC flattening jig and a FPC flattening method. The FPC flattening jig includes a pressurization mechanism and a heating mechanism; a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped FPC to exert pressure thereon; the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the FPC. The FPC flattening jig heats the pressurization mechanism by a heating mechanism, and then the heated planar base surface of the pressurization mechanism contacts the warped FPC and exerts pressure thereon. Therefore, the FPC can be flattened. As such, the FPC can be reused, facilitating the improvement on the recycling rate of FPC.

First claim

The invention claimed is:

1. A Flexible Printed Circuit (FPC) flattening jig comprising:
a pressurization mechanism and a heating mechanism;
wherein a bottom of the pressurization mechanism has a planar base surface which is used to contact a warped Flexible Printed Circuit (FPC) to exert pressure on the Flexible Printed Circuit (FPC);
the heating mechanism is used to heat the pressurization mechanism, such that the planar base surface of the pressurization mechanism has a predefined temperature when exerting pressure on the Flexible Printed Circuit (FPC); and
the Flexible Printed Circuit (FPC) flattening jig further includes a security contact lever which is mounted directly to the pressurization mechanism and at least a surface of which is made of thermal insulation material and the security contact lever is configured to first contact a hand or arm of an operator before the planar base surface of the pressurization mechanism reaches the hand or arm.

2. The Flexible Printed Circuit (FPC) flattening jig according to claim 1 , wherein the Flexible Printed Circuit (FPC) flattening jig further includes a drive mechanism which is used to drive the pressurization mechanism to ascend or descend.

3. The Flexible Printed Circuit (FPC) flattening jig according to claim 2 , wherein the drive mechanism includes a motor, a gear wheel and a gear rack, wherein a drive shaft of the motor is connected to the gear wheel, the gear wheel engages with the gear rack, and the pressurization mechanism is fixed to the gear rack.

4. The Flexible Printed Circuit (FPC) flattening jig according to claim 3 , wherein the gear rack is a rigid rod which is formed with teeth for engaging with the gear wheel and which is fixedly connected to the pressurization mechanism at one end.

5. The Flexible Printed Circuit (FPC) flattening jig according to claim 2 , wherein the drive mechanism includes a gear rack, a gear wheel engaged with the gear rack and a turning handle connected to the gear wheel through a connecting shaft;
the pressurization mechanism is fixed to the gear rack; and
the turning handle is able to rotate the gear wheel, such that the pressurization mechanism fixed to the gear rack ascends or descends therewith.

6. The Flexible Printed Circuit (FPC) flattening jig according to claim 5 , wherein the gear rack is a rigid rod which is formed with teeth for engaging with the gear wheel and which is fixedly connected to the pressurization mechanism at one end.

7. The Flexible Printed Circuit (FPC) flattening jig according to claim 1 , wherein the Flexible Printed Circuit (FPC) flattening jig further includes a temperature sensing mechanism which is used to detect the temperature of the pressurization mechanism.

8. The Flexible Printed Circuit (FPC) flattening jig according to claim 1 , wherein the Flexible Printed Circuit (FPC) flattening jig further includes a platform which is used to support the Flexible Printed Circuit (FPC) thereon and which is provided underneath the pressurization mechanism.

Assignees

• Boe Technology Group Co Ltd
• Hefei Boe Optoelectronics Tech

Inventors

• Hou Yongkang
• Yang Jianlei

Classifications

• B30B15/34

  Heating or cooling presses or parts thereof · CPC title

• H05K3/225

  Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence) · CPC title

• H05K2203/0278

  Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title

• H05K3/22 Primary

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title