Peeling apparatus and peeling method

Patent metadata

Field	Value
Publication number	US-10574039-B2
Application number	US-201715706802-A
Country	US
Kind code	B2
Filing date	Sep 18, 2017
Priority date	Sep 20, 2016
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2.

First claim

What is claimed is:

1. A peeling apparatus that peels an insulating film of a conductive wire material constituted by an electrical conductor coated with the insulating film,
the conductive wire material having a quadrilateral in cross-section, and including a first side surface and a second side surface respectively corresponding to one pair of opposite sides of the quadrilateral, and a third side surface and a fourth side surface respectively corresponding to the other pair of opposite sides,
the peeling apparatus comprising:
a first peeling die that peels at once the insulating film on the third side surface and the fourth side surface of the conductive wire material; and
a second peeling die installed downstream of the first peeling die in a feed direction into which the conductive wire material is fed, and which peels at once the insulating film on the first side surface and the second side surface of the same portion as the portion of the conductive wire material, the portion where peeling of the insulating film by the first peeling die has been made, wherein
the first peeling die and the second peeling die respectively include
a pair of cutting blades that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material to cut the insulating film, and
a support die that supports a side surface of the conductive wire material from a downstream side in a moving direction of the cutting blades at the time of cutting by the cutting blades, and
a portion of the support die of the first peeling die includes a convex portion protruding toward the conductive wire material, wherein the portion of the support die corresponds to the portion of the conductive wire material across which the pair of the cutting blades moves and from which the insulating film has been peeled.

2. The peeling apparatus according to claim 1 , wherein
the convex portion has a shape curved toward the conductive wire material.

3. A peeling method of peeling an insulating film of a conductive wire material constituted by an electrical conductor coated with the insulating film,
the conductive wire material having a quadrilateral cross-section, and including a first side surface and a second side surface respectively corresponding to one pair of opposite sides of the quadrilateral, and a third side surface and a fourth side surface respectively corresponding to the other pair of opposite sides,
the peeling method comprising:
a first peeling process of moving a pair of cutting blades in a direction perpendicular to an axial direction of the conductive wire material to peel at once the insulating film on the third side surface and the fourth side surface of the conductive wire material; and
a second peeling process of peeling at once the insulating film on the first side surface and the second side surface of a same portion as a portion of the conductive wire material, the portion where peeling of the insulating film by the first peeling process has been made, after the first peeling process, and
in the first peeling process, peeling the insulating film while pressing and deforming a portion of the conductive wire material across which the pair of the cutting blades moves and from which the insulating film has been peeled, toward an opposite direction to a moving direction of the cutting blades in cutting by the cutting blades.

4. The peeling method according to claim 3 , comprising:
in the first peeling process,
arranging the conductive wire material on a support die including a convex portion in a conductive wire material contact surface;
pressing the conductive wire material by a pressing member that regulates movement of the conductive wire material from a side facing the support die; and
peeling the insulating film on the third side surface and the fourth side surface while deforming the conductive wire material along a shape of the convex portion.

5. The peeling method according to claim 4 , wherein
the convex portion has a shape curved toward the conductive wire material.

Assignees

• Honda Motor Co Ltd
• Shinko Electric Ind Co

Inventors

• Shigematsu Hideki
• Saito Masafumi
• Miyashita Keita
• Sakamoto Ryuzo
• Miyajima Hiroyuki
• Komamura Akio

Classifications

• H01B15/006

  Making a longitudinal cut · CPC title

• H02G1/1256 Primary

  using wire or cable-clamping means · CPC title

• H02G1/127

  Features relating to cutting elements · CPC title

• H02G1/126 Primary

  making a longitudinal cut · CPC title

• H02G1/1285 Primary

  by friction, e.g. abrading, grinding, brushing · CPC title