LED display unit group and display panel

Patent metadata

Field	Value
Publication number	US-10573227-B2
Application number	US-201815995248-A
Country	US
Kind code	B2
Filing date	Jun 1, 2018
Priority date	May 21, 2018
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.

First claim

What is claimed is:

1. An LED display unit group, comprising a pixel unit array comprising n rows and m columns of pixel units, wherein both n and m are positive integers greater than or equal to 2;
wherein, each of the pixel units comprises three LED chips having different light-emitting colors, which are respectively a first LED chip, a second LED chip and a third LED chip; and each of the LED chips comprises an A-electrode and a B-electrode, wherein polarities of the A-electrode and B-electrode are opposite to each other;
in the i-th row of pixel units, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin of the LED display unit group;
in the j-th column of pixel units,
the B-electrodes of n first LED chips are connected together, and are electrically connected to the j-th first B-electrode pin of the LED display unit group;
the B-electrodes of n second LED chips are connected together, and are electrically connected to the j-th second B-electrode pin of the LED display unit group; and
the B-electrodes of n third LED chips are connected together, and are electrically connected to j-th third B-electrode pin of the LED display unit group; and

wherein 1≤i≤n, 1≤j≤m, and i, j are both integers;
wherein, each of the pixel units comprises a chip bonding pad, a common A-electrode pad, a first B-electrode pad, a second B-electrode pad and a third B-electrode pad;
the chip bonding pad is used to fix the first LED chip, the second LED chip, and the third LED chip;
the A-electrodes of the first LED chip, the second LED chip, and the third LED chip are connected to the common A-electrode pad, and
the B-electrodes of the first LED chip, the second LED chip, and the third LED chip are respectively connected to the first B-electrode pad, the second B-electrode pad and the third B-electrode pad;
in the i-th row of pixel units, the common A-electrode pads of the m pixel units are electrically connected together, and are electrically connected to the i-th common A-electrode pin of the LED device;
in the j-th column of pixel units,
the first B-electrode pads of the n pixel units are electrically connected together, and are electrically connected to the j-th first B-electrode pin of the LED display unit group;
the second B-electrode pads of the n pixel units are electrically connected together, and are electrically connected to the j-th second B-electrode pin of the LED display unit group; and
the third B-electrode pads of the n pixel units are electrically connected together, and are electrically connected to the j-th third B-electrode pin of the LED display unit group; and
the chip bonding pads, the common A-electrode pads, the first B-electrode pads, the second B-electrode pads, and the third B-electrode pads are formed on a front of an insulating substrate; and the n common A-electrode pins and 3m B-electrode pins are located on a back of the insulating substrate;
wherein, in each of the pixel units, at least one LED chip is a two-side-electrode LED chip, wherein the A-electrode and the B-electrode of the LED chip are located on the upper and lower sides of the LED chip, respectively.

2. The LED display unit group according to claim 1 , wherein
the n=2 and the m=2, and
the common A-electrode pad, the first B-electrode pad, the second B-electrode pad, and the third B-electrode pad are electrically connected to the corresponding pins located at the back of the insulating substrate through metal vias, or are electrically connected to one of the common A-electrode pin and the B-electrode pins located at the insulating substrate through the metal vias and metal traces located at least one of the front and the back of the insulating substrate.

3. The LED display unit group according to claim 2 , wherein
in each row of the pixel units, the common A-electrode pads of two pixel units are different parts of a metal pad, and the metal pad is directly connected to the common A-electrode pin corresponding to the row of the pixel unit through the metal via.

4. The LED display unit group according to claim 3 , wherein
in each of the pixel units, the chip bonding pad is electrically connected to the common A-electrode pad.

5. The LED display unit group according to claim 2 , wherein
the first B-electrode pin and the third B-electrode pin are located on top corners at the back of the insulating substrate, a cross-section of the metal via connected to the first B-electrode pin and the third B-electrode pin is one of ½ arc and ¼ arc, where the arc is recessed from outside to the inside of the LED display unit group, and the metal via is filled with a first insulating material.

6. The LED display unit group according to claim 5 , wherein
the first insulating material comprises one of a resin and a green oil, and the first insulating material does not exceed the upper and lower surfaces of the insulating substrate.

7. The LED display unit group according to claim 1 , wherein
the third LED chip is a two-side-electrode LED chip, and the B-electrode of the two-side-electrode LED chip is located at the upper side of the LED chip, and the chip bonding pads of two pixel units in the same row of the pixel units and the common A-electrode pad of the two pixel units are different parts of the metal pad.

8. The LED display unit group according to claim 7 , wherein in the same column of the pixel units:
the first B-electrode pad of the pixel unit in the first row is directly connected to the first B-electrode pin corresponding to the first B-electrode pad through the metal via, and the first B-electrode pad located of the pixel unit in the second row is extended to the back of the insulating substrate through the metal via, and is connected to the B-electrode pin corresponding to the first B-electrode pad through a first back metal trace located at the back of the insulating substrate;
the two second B-electrode pads are different parts of the metal pad, and the metal pad is directly connected to the B-electrode pin corresponding to the second B-electrode pad through the metal via; and
the third B-electrode pad of pixel unit in the second row is directly connected to the third B-electrode pin corresponding to the third B-electrode pad through the metal via, the third B-electrode pad of pixel unit in the first row is connected to one end of a first front metal trace located on the front of the insulating substrate, and the other end of the first front metal trace is extended to the back of the insulating substrate through the metal via, and is connected to the B-electrode pin corresponding to the third B-electrode pad through the second back metal trace located on the back of the insulating substrate.

9. The LED display unit group according to claim 1 , wherein
the third LED chip is a two-side-electrode LED chip, and the B-electrode of the two-side-electrode LED chip is located at the lower side of the LED chip, the B-electrode of the third LED chip is fixed on the chip bonding pad by a conductive adhesive, and the first LED chip and the second LED chip are fixed on the chip bonding pad by an insulating adhesive.

10. The LED display unit group according to claim 9 , wherein in the same column of pixel units:
the first B-electrode pad of the pixel unit in the first row is directly connected to a B-electrode pin corresponding to the first B-electrode pad through the metal via, and the first B-electrode pad of the pixel unit in the second row is connected to a back side of the insulating substrate through the metal via, and is connected to the B-electrode pin corresponding to the first B-electrode pad via a third back metal trace loc

Assignees

• Foshan Nationstar Optoelectronics Co Ltd

Inventors

• Gu Feng
• Liu Chuanbiao
• Qin Kuai
• Zheng Xi
• Lin Yuanbin

Classifications

• G09G3/32 Primary

  semiconductive, e.g. using light-emitting diodes [LED] · CPC title

• G09G2310/0264

  Details of driving circuits · CPC title

• G09G2300/0426

  Layout of electrodes and connections · CPC title

• G09G3/3426

  the different display panel areas being distributed in two dimensions, e.g. matrix · CPC title

• G02F2201/123

  pixel · CPC title