Polycrystalline diamond cutting element

Patent metadata

Field	Value
Publication number	US-10570667-B2
Application number	US-201414553849-A
Country	US
Kind code	B2
Filing date	Nov 25, 2014
Priority date	Oct 25, 2010
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

A polycrystalline-diamond cutting element for a drill bit of a downhole tool. The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one working surface thereof. The cutting element may be formed by positioning the diamond table on the substrate and bonding the diamond table onto the substrate such that the polycrystalline diamond segment is positioned along at least one working surface of the diamond table. A spark plasma sintering or double press operation may be used to bond the diamond table onto the substrate.

First claim

What is claimed is:

1. A method for manufacturing a polycrystalline diamond cutting element for a drill bit of a downhole tool, comprising:
creating small polycrystalline diamond particles by sintering a first polycrystalline diamond material in a first high temperature-high pressure pressing operation having a temperature higher than 1300° C. and a pressure greater than 65 KBar and forming the sintered polycrystalline diamond material into small particles of about 0.5 micron in size by crushing the sintered polycrystalline diamond material;
removing substantially all catalyzing and other metallic materials from the sintered polycrystalline diamond material;
intermixing the polycrystalline diamond particles with another diamond material to form a diamond table;
positioning the diamond table on a substrate;
bonding the diamond table onto the substrate by a second high temperature-high pressure pressing operation having a temperature higher than 1300° C. and a pressure greater than 65 KBar such that the at least a portion of the polycrystalline diamond particles are positioned along at least one working surface of the diamond table.

2. The method of claim 1 , wherein the removing comprises leaching the sintered polycrystalline diamond material.

3. The method of claim 1 , wherein the intermixing comprises intermixing at least some of the polycrystalline diamond particles with the another diamond material to form the diamond table, wherein the at least some of the polycrystalline diamond particles are selected for intermixing based upon at least one of a size or a shape of the polycrystalline diamond particle.

4. The method of claim 1 , further comprising positioning the plurality of small polycrystalline diamond particles along one or more of a top and peripheral working surface of the polycrystalline diamond cutting element.

5. The method of claim 1 , wherein the removing is performed either before or after the small, polycrystalline diamond particles are formed.

6. The method of claim 1 , wherein the polycrystalline diamond cutting element has a higher wear resistance than a polycrystalline diamond cutting element comprising a diamond table comprising no material that has been sintered prior to formation of the diamond table.

7. The method of claim 1 further comprising forming the small, polycrystalline diamond particles into a grit, and varying the size, quantity, and layer thickness of the grit to provide a polycrystalline diamond cutting element that is self-sharpening.

8. The method of claim 1 , wherein the another diamond material comprises diamond feedstock, diamond powder and combinations thereof.

9. The method of claim 1 , wherein the another diamond material comprises a second polycrystalline diamond material.

10. The method of claim 1 , wherein the polycrystalline diamond particles are positioned along at least one of a top and peripheral working surface of the polycrystalline diamond cutting element.

11. A method for manufacturing a polycrystalline diamond cutting element for a drill bit of a downhole tool, comprising:
leaching a plurality of stress engineered polycrystalline diamond shapes;
sintering a first polycrystalline diamond material in a first high temperature-high pressure pressing operation having a temperature higher than 1300° C. and a pressure greater than 65 KBar to form a first sintered polycrystalline diamond material and forming the first sintered polycrystalline diamond material into a plurality of particles with an average diameter of 0.5 microns;
removing substantially all catalyzing and other metallic materials from the first sintered polycrystalline diamond material;
subsequent to the leaching of the plurality of stress engineered shapes, intermixing the sintered first polycrystalline diamond material with the plurality of stress engineered shapes to form a diamond table;
positioning the diamond table on a substrate;
bonding the diamond table onto the substrate by a second high-temperature-high pressure pressing operation having a temperature higher than 1300° C. and a pressure greater than 65 KBar such that the at least a portion of the leached polycrystalline diamond particles are positioned along at least one working surface of the diamond table; and
subsequent the bonding, treating all or a portion of the at least one working surface in a leaching process to remove all or select portions of any catalyst that may have infiltrated during the bonding of the diamond table onto the substrate.

12. The method of claim 11 , further comprising removing a plurality of metallic material from the plurality of stress engineered shapes by leaching.

13. The method of claim 11 , further comprising removing a plurality of catalytic material from the plurality of stress engineered shapes by leaching.

14. The method of claim 11 , wherein each stress engineered shape of the plurality of stress engineered shapes was part of a previously fabricated and previously used PCD cutting element.

15. The method of claim 11 , further comprising selecting at least some stress engineered shapes of the plurality of stress engineered shapes prior to leaching based on at least one of a size or a geometry of the at least some stress engineered shapes.

Assignees

• Nat Oilwell Dht Lp

Inventors

• Setlur Deepthi Raj
• Hughes Michael D
• Francis Mark Jonathan
• Sreshta Harold A
• Zhan Guodong
• Gilleylen Russell C
• Sue Jiinjen Albert

Classifications

• Y10T428/12576

  Boride, carbide or nitride component · CPC title

• Y10T428/12174

  Mo or W containing · CPC title

• B22F7/02

  of composite layers {(B22F7/002 takes precedence)} · CPC title

• C22C19/07

  based on cobalt · CPC title

• E21B10/573

  characterised by support details, e.g. the substrate construction or the interface between the substrate and the cutting element · CPC title