Process for the generation of metallic films

US10570514B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10570514-B2
Application numberUS-201615779570-A
CountryUS
Kind codeB2
Filing dateNov 29, 2016
Priority dateNov 30, 2015
Publication dateFeb 25, 2020
Grant dateFeb 25, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is in the field of processes for the generation of thin inorganic films on substrates, in particular atomic layer deposition processes. It relates to a process for preparing metal films comprising (a) depositing a metal-containing compound from the gaseous state onto a solid substrate and (b) bringing the solid substrate with the deposited metal-containing compound in contact with a reducing agent in the gaseous state, wherein the reducing agent is or at least partially forms at the surface of the solid substrate a carbene, a silylene or a phosphor radical.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for preparing a metal film, comprising: (a) depositing a metal-containing compound from the gaseous state onto a solid substrate; and (b) bringing the solid substrate with the deposited metal-containing compound in contact with a reducing agent in the gaseous state or in solution, wherein the reducing agent is or at least partially forms at the surface of the solid substrate a carbene, a silylene or a phosphor radical, wherein the carbene is a compound of formula (I), (II), (IVa), (IVb), (Va) or (Vb); wherein R is hydrogen, an alkyl, alkenyl, aryl, or silyl group X is C, Si, or P, Y is S, NR, or CR 2 , Z is nothing, H, alkyl, halogen, an amine, PR 2 or a boron species, and n is 0, 1 or 2. 2. The process according to claim 1 , wherein the reducing agent is a compound of formula (Ia), (Ib), (Ic), (Id), (Ie), or (If): 3. The process according to claim 1 , wherein the reducing agent is a compound of formula (III): 4. The process according to claim 1 , wherein the reducing agent is a compound of formula (IVa) or a compound of formula (IVb): 5. The process according to claim 1 , wherein the reducing agent is a compound of formula (Va) or a compound of formula (Vb): 6. The process according to claim 1 , wherein the reducing agent has a vapor pressure of at least 0.1 mbar at 200° C. 7. The process according to claim 1 , wherein (a) and (b) are successively performed at least twice. 8. The process according to claim 1 , wherein the metal-containing compound comprises Ti, Ta, Mn, Mo, W, or Al. 9. The process according to claim 1 , wherein the temperature does not exceed 350° C.

Assignees

Inventors

Classifications

  • Halophosphines · CPC title

  • characterised by the deposition of metallic material · CPC title

  • containing nitrogen {having a Si-N linkage} · CPC title

  • characterized by the use of precursors specially adapted for ALD · CPC title

  • from metallo-organic compounds · CPC title

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What does patent US10570514B2 cover?
The present invention is in the field of processes for the generation of thin inorganic films on substrates, in particular atomic layer deposition processes. It relates to a process for preparing metal films comprising (a) depositing a metal-containing compound from the gaseous state onto a solid substrate and (b) bringing the solid substrate with the deposited metal-containing compound in cont…
Who is the assignee on this patent?
Basf Se
What technology area does this patent fall under?
Primary CPC classification C23C16/45553. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).