Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide
US-2016268121-A1 · Sep 15, 2016 · US
US10570514B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10570514-B2 |
| Application number | US-201615779570-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 29, 2016 |
| Priority date | Nov 30, 2015 |
| Publication date | Feb 25, 2020 |
| Grant date | Feb 25, 2020 |
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The present invention is in the field of processes for the generation of thin inorganic films on substrates, in particular atomic layer deposition processes. It relates to a process for preparing metal films comprising (a) depositing a metal-containing compound from the gaseous state onto a solid substrate and (b) bringing the solid substrate with the deposited metal-containing compound in contact with a reducing agent in the gaseous state, wherein the reducing agent is or at least partially forms at the surface of the solid substrate a carbene, a silylene or a phosphor radical.
Opening claim text (preview).
The invention claimed is: 1. A process for preparing a metal film, comprising: (a) depositing a metal-containing compound from the gaseous state onto a solid substrate; and (b) bringing the solid substrate with the deposited metal-containing compound in contact with a reducing agent in the gaseous state or in solution, wherein the reducing agent is or at least partially forms at the surface of the solid substrate a carbene, a silylene or a phosphor radical, wherein the carbene is a compound of formula (I), (II), (IVa), (IVb), (Va) or (Vb); wherein R is hydrogen, an alkyl, alkenyl, aryl, or silyl group X is C, Si, or P, Y is S, NR, or CR 2 , Z is nothing, H, alkyl, halogen, an amine, PR 2 or a boron species, and n is 0, 1 or 2. 2. The process according to claim 1 , wherein the reducing agent is a compound of formula (Ia), (Ib), (Ic), (Id), (Ie), or (If): 3. The process according to claim 1 , wherein the reducing agent is a compound of formula (III): 4. The process according to claim 1 , wherein the reducing agent is a compound of formula (IVa) or a compound of formula (IVb): 5. The process according to claim 1 , wherein the reducing agent is a compound of formula (Va) or a compound of formula (Vb): 6. The process according to claim 1 , wherein the reducing agent has a vapor pressure of at least 0.1 mbar at 200° C. 7. The process according to claim 1 , wherein (a) and (b) are successively performed at least twice. 8. The process according to claim 1 , wherein the metal-containing compound comprises Ti, Ta, Mn, Mo, W, or Al. 9. The process according to claim 1 , wherein the temperature does not exceed 350° C.
Halophosphines · CPC title
characterised by the deposition of metallic material · CPC title
containing nitrogen {having a Si-N linkage} · CPC title
characterized by the use of precursors specially adapted for ALD · CPC title
from metallo-organic compounds · CPC title
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