Locating an aperture based on a signature of an embedded conductive element

Patent metadata

Field	Value
Publication number	US-10569894-B2
Application number	US-201715784798-A
Country	US
Kind code	B2
Filing date	Oct 16, 2017
Priority date	Oct 16, 2017
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

A manufacturing method is provided. During this method, a panel is provided that includes non-conductive material and a plurality of conductive elements at least partially embedded within the non-conductive material. The conductive elements include a first conductive element. An electric current is applied to the first conductive element such that the first conductive element produces a signature. A location of the first conductive element in the panel is determined based on the signature. An aperture is formed in the panel based on the determined location of the first conductive element.

First claim

I claim:

1. A manufacturing method, comprising:
providing a panel that includes non-conductive material and a plurality of conductive elements at least partially embedded within the non-conductive material, wherein the conductive elements include a first conductive element;
applying an electric current to the first conductive element such that the first conductive element produces a signature;
determining a location of the first conductive element in the panel based on the signature; and
forming an aperture in the panel based on the determined location of the first conductive element.

2. The method of claim 1 , wherein the signature comprises a heat signature.

3. The method of claim 1 , wherein the location of the first conductive element is determined using a thermal sensor system.

4. The method of claim 1 , wherein the location of the first conductive element is determined using an infrared camera.

5. The method of claim 1 , further comprising:
applying the electric current to a second conductive element such that the second conductive element produces a second signature, wherein the conductive elements include the second conductive element, and the second conductive element is laterally adjacent the first conductive element; and
determining a location of the second conductive element in the panel based on the second signature;
wherein the aperture is formed in the panel further based on the determined second location of the second conductive element such that the aperture is laterally between the first conductive element and the second conductive element.

6. The method of claim 5 , further comprising forming a second aperture in the panel based on the determined location of the first conductive element and the determined second location of the second conductive element.

7. The method of claim 1 , wherein the aperture is formed in the panel based on the determined location of the first conductive element such that the aperture does not interfere with the first conductive element.

8. The method of claim 1 , wherein the forming of the aperture comprises drilling the aperture vertically through the panel.

9. The method of claim 1 , wherein the method is performed to manufacture a component for an aircraft propulsion system nacelle.

10. The method of claim 1 , wherein the conductive elements are configured as heater elements.

11. The method of claim 1 , wherein the panel includes a heater layer and an outer layer, the heater layer comprises the non-conductive material and the conductive elements, and the outer layer covers the heater layer.

12. The method of claim 11 , wherein the outer layer comprises conductive material.

13. The method of claim 1 , wherein the panel further includes a third layer that covers the heater layer, and the heater layer is sandwiched between the outer layer and the third layer.

14. The method of claim 13 , wherein the third layer comprises conductive material.

15. The method of claim 1 , further comprising:
disposing a cellular core between the panel and a second panel; and
attaching the cellular core to the panel and the second panel.

16. A manufacturing method, comprising:
providing a panel that includes non-conductive material and a plurality of conductive elements at least partially embedded within the non-conductive material;
heating the conductive elements;
determining element locations of at least some of the heated conductive elements in the panel using a thermal sensor system; and
determining aperture locations for a plurality of apertures to be formed in the panel based on locations of the at least some of the heated conductive elements.

17. The method of claim 16 , further comprising forming the apertures in the panel respectively at the aperture locations.

18. The method of claim 16 , wherein the aperture locations are determined so as to not coincide with the conductive elements.

19. The method of claim 16 , wherein the method is performed to manufacture a component for an aircraft propulsion system nacelle.

20. The method of claim 16 , wherein the panel includes a heater layer and an outer layer, the heater layer comprises the non-conductive material and the conductive elements, and the outer layer covers the heater layer.

Assignees

• Rohr Inc

Inventors

• Kestler Steven M

Classifications

• B64D2033/0233

  comprising de-icing means · CPC title

• B64D2033/0206

  comprising noise reduction means, e.g. acoustic liners · CPC title

• B23B35/00 Primary

  Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods · CPC title

• B64D33/02 Primary

  of combustion air intakes · CPC title

• B23B2270/48

  Measuring or detecting · CPC title