Thermally conductive substrate article

US10568233B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10568233-B2
Application numberUS-201314391459-A
CountryUS
Kind codeB2
Filing dateMar 7, 2013
Priority dateJun 28, 2012
Publication dateFeb 18, 2020
Grant dateFeb 18, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thermally conductive article including a polymeric layer comprising a nonwoven polymeric material. In particular, a flexible thermally conductive polymeric layer comprising an epoxy resin and a long-strand polymeric nonwoven material embedded in the epoxy resin. The polymeric nonwoven material may be heat stable at about 280 C.

First claim

Opening claim text (preview).

What is claimed is: 1. An article comprising: a flexible thermally conductive polymeric layer comprising an epoxy resin and a long-strand polymeric nonwoven material embedded in the epoxy resin, wherein the polymeric nonwoven material is heat stable at about 280° C., and wherein the polymeric nonwoven material is a chemically etched polymeric nonwoven material having a density less than about 7 g/m 2 . 2. The article of claim 1 being free standing. 3. The article of claim 1 having a thickness of less than about 50 μm. 4. The article of claim 1 having a thickness of about 15 to about 35 μm. 5. The article of claim 1 wherein the epoxy resin is loaded with one or both of thermally and electrically conductive particles. 6. The article of claim 5 wherein the thermally conductive particles have a thermal conductivity greater than 10 W/m·K. 7. The article of claim 5 wherein the particles have a maximum dimension of about 0.5 to about 20 μm. 8. The article of claim 5 wherein the particles comprise up to about 75 wt % of the epoxy component. 9. The article of claim 1 wherein the nonwoven material is equal to or less than about 50 μm thick. 10. The article of claim 1 wherein the nonwoven material is equal to or less than about 30 μm thick. 11. The article of claim 1 wherein the nonwoven material is equal to or less than about 20 μm thick. 12. The article of claim 1 wherein the nonwoven material is about 10 micrometers to about 20 micrometers thick. 13. The article of claim 1 wherein the nonwoven material is selected from the group consisting of meltblown nonwovens, spunbond nonwovens, and electrospun nonwovens. 14. The article of claim 1 wherein the nonwoven material has a density less than about 3 g/m 2 . 15. The article of claim 1 further comprising an electrically conductive layer on one or both sides of the polymeric layer. 16. The article of claim 15 wherein the conductive layers are selected from the group consisting of copper, aluminum and alloys thereof. 17. The article of claim 1 wherein the nonwoven material has a tensile strength of 10N or more in one direction. 18. The article of claim 1 which can be folded to 180° forming a fold line and unfolded without cracking. 19. A method of making an article comprising a flexible thermally conductive layer, the method comprising: providing a long-strand nonwoven material, the long-strand nonwoven material being heat stable at about 280° C.; chemically etching the long-strand nonwoven material in order to reduce a density of the long-strand nonwoven material and to thereby form an etched polymeric nonwoven material, the etched polymeric nonwoven material having a density less than about 7 g/m 2 ; embedding the etched polymeric nonwoven material in an epoxy resin; and curing the epoxy resin to form the thermally conductive layer. 20. The method of claim 19 , wherein the providing a long-strand nonwoven material step comprises: forming a non-crosslinked nonwoven material; and crosslinking the non-crosslinked nonwoven material to form the long-strand nonwoven material.

Assignees

Inventors

Classifications

  • Carbon, e.g. graphite particles · CPC title

  • B32B5/022Primary

    Non-woven fabric · CPC title

  • Conductive · CPC title

  • Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric] · CPC title

  • comprising epoxy resins · CPC title

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Frequently asked questions

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What does patent US10568233B2 cover?
A thermally conductive article including a polymeric layer comprising a nonwoven polymeric material. In particular, a flexible thermally conductive polymeric layer comprising an epoxy resin and a long-strand polymeric nonwoven material embedded in the epoxy resin. The polymeric nonwoven material may be heat stable at about 280 C.
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification B32B5/022. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 18 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).