Ceramic and polymer composite, and uses thereof

Patent metadata

Field	Value
Publication number	US-10568205-B2
Application number	US-201715656657-A
Country	US
Kind code	B2
Filing date	Jul 21, 2017
Priority date	Jul 27, 2016
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.

First claim

What is claimed:

1. A printed circuit board comprising a ceramic and polymer composite comprising:
a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity of from 50 to 15 vol %, based on the total volume of the composite; and
a second continuous polymer phase situated in the porosity of the sintered porous ceramic first continuous phase,
wherein the composite is a sheet having a thickness of from 10 to 100 micrometers;
wherein the printed circuit board has a frequency dielectric constant of from 2.4 to 6.7 at 10 GHz.

2. The printed circuit board of claim 1 wherein the sintered porous ceramic comprises at least one of aluminum oxide, silicon oxide, or mixtures thereof.

3. The printed circuit board of claim 1 wherein the composite has a fracture strength of from 125 and 250 MPa, and a Young's modulus of from 50 and 250 GPa.

4. The printed circuit board of claim 1 wherein the Young's modulus of the sintered porous ceramic continuous phase is from 50 to 210 GPa.

5. The printed circuit board of claim 1 wherein the composite has a stiffness of from 50 to 65 GPa.

6. The printed circuit board of claim 1 wherein the composite has a coefficient of thermal expansion (CTE) of from 11×10 −6 K −1 to 25×10 −6 K −1 in each of the x, y, and z axes.

7. The printed circuit board of claim 1 wherein the sintered porous ceramic continuous phase has an overlapping sphere structure comprised of a plurality of partially fused adjacent spherical ceramic particles of at least one of aluminum oxide, silicon oxide, or mixtures thereof.

8. The printed circuit board of claim 1 wherein the sintered porous ceramic continuous phase is non-woven.

9. The printed circuit board of claim 1 further comprising at least one of:
at least one machined surface;
at least one hole drilled partially into the printed circuit board;
at least one hole drilled through the printed circuit board, or combinations thereof.

10. A ceramic and polymer composite comprising:
a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity of from 50 to 15 vol %, based on the total volume of the composite; and
a second continuous polymer phase situated in the porosity of the sintered porous ceramic first continuous phase,
wherein the composite has:
a Young's modulus of from 50 to 250 GPa; and
a coefficient of thermal expansion (CTE) of from 11×10 −6 K −1 to 25×10 −6 K −1 in each of the x, y, and z axes.

Assignees

• Corning Inc

Inventors

• Miao Weiguo
• Ocampo Manuela
• Sorensen Michael Lesley
• Zimmermann James William

Classifications

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• C04B2111/805

  Transparent material · CPC title

• C04B35/115

  Translucent or transparent products · CPC title

• C04B41/483

  Polyacrylates · CPC title

• C04B41/48

  Macromolecular compounds · CPC title