Amplifier integrated feed array with modularized feed elements and amplifiers

Patent metadata

Field	Value
Publication number	US-10566684-B2
Application number	US-201715699909-A
Country	US
Kind code	B2
Filing date	Sep 8, 2017
Priority date	Nov 9, 2016
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

A multi-beam antenna (MBA) system for a spacecraft, the MBA system including a reflector and a feed array of radiating feed elements configured as a phased array and illuminating the reflector. The feed array includes a plurality of interchangeable modules. Each of the plurality of interchangeable modules includes a distal mounting panel and a proximal mounting panel, and at least six feed array elements. Each feed array element is electrically coupled with a respective amplifier and mechanically coupled with an exterior surface of the distal mounting panel. The respective amplifiers are thermally coupled with the proximal mounting panel and are mechanically coupled to an interior surface of the distal mounting panel and an exterior surface of the proximal mounting panel. An interior surface of the proximal mounting panel of each interchangeable module is mechanically and thermally coupled with a back plate.

First claim

What is claimed is:

1. A multi-beam antenna (MBA) system for a spacecraft, the MBA system including:
a reflector; and
a feed array of radiating feed elements configured as a phased array and illuminating the reflector, operable at a frequency having a characteristic wavelength (A), the feed array including a plurality of interchangeable modules, wherein:
each of the plurality of interchangeable modules includes a first distal mounting panel and a proximal mounting panel, and at least six feed array elements;
each feed array element is electrically coupled with a respective amplifier and mechanically coupled with an exterior surface of the first distal mounting panel;
the respective amplifiers are disposed between the proximal mounting panel and the distal mounting panel, coupled with an interior surface of the first distal mounting panel and an exterior surface of the proximal mounting panel and thermally coupled with the proximal mounting panel; and
an interior surface of the proximal mounting panel of each interchangeable module is mechanically and thermally coupled with a back plate;
wherein the feed array includes beam formers and the back plate includes a plurality of recessed portions, at least a portion of each beam former being disposed in a respective one of the plurality of recessed portions.

2. The MBA system of claim 1 , wherein the back plate is thermally coupled with one or more heat pipes.

3. The MBA system of claim 1 , wherein the portion of each beam former is disposed between the back plate and the proximal mounting panel.

4. The MBA system of claim 1 , wherein the back plate is configured to mechanically interface directly with two or more of the plurality of interchangeable modules.

5. The MBA system of claim 4 , wherein the back plate is a monolithic element configured to mechanically interface directly with each of the plurality of interchangeable modules.

6. The MBA system of claim 1 , wherein the back plate is configured to mechanically interface directly with a single one of the plurality of interchangeable modules.

7. The MBA system of claim 1 , wherein each feed element, together with the respective amplifier, is disposed in a closely packed triangular lattice such that separation between adjacent feed elements is not greater than 1.5λ.

8. The MBA system of claim 1 , wherein each amplifier, when operating dissipates approximately 1-3 watts of waste heat.

9. The MBA system of claim 1 , further comprising a second distal mounting panel disposed between the first distal mounting panel and the respective amplifiers.

10. The MBA system of claim 9 , wherein, the first distal mounting panel and the second distal mounting panel are detachably coupled together such that the first distal mounting panel, together with the feed array of radiating feed elements, is removable from the second distal mounting panel.

11. A method comprising:
fabricating a plurality of interchangeable modules for a multi-beam antenna (MBA) system wherein:
the MBA system includes a feed array of radiating feed elements configured as a phased array, operable at a frequency having a characteristic wavelength (A), the feed array including the plurality of interchangeable modules;
each of the plurality of interchangeable modules includes a distal mounting panel and a proximal mounting panel, and at least six feed array elements;
each feed array element is electrically coupled with a respective amplifier and mechanically coupled with an exterior surface of the distal mounting panel; and
the respective amplifiers are disposed between the proximal mounting panel and the distal mounting panel, coupled with an interior surface of the distal mounting panel and an exterior surface of the proximal mounting panel and thermally coupled with the proximal mounting panel;
performing functional testing of each interchangeable module; and
forming the feed array by integrating the interchangeable modules onto a back plate such that an interior surface of the proximal mounting panel of each interchangeable module is mechanically and thermally coupled with the back plate;
wherein the feed array includes beam formers and the back plate includes a plurality of recessed portions, at least a portion of each beam former being disposed in a respective one of the plurality of recessed portions.

12. The method of claim 11 , wherein the back plate is thermally coupled with one or more heat pipes.

13. The method of claim 11 , wherein integrating the interchangeable modules onto the back plate includes mechanically interfacing the back plate directly with two or more of the plurality of interchangeable modules.

14. The method of claim 13 , wherein integrating the interchangeable modules onto the back plate includes mechanically interfacing the back plate directly with each of the plurality of interchangeable modules.

15. The method of claim 11 , wherein integrating the interchangeable modules onto the back plate includes mechanically interfacing the back plate directly with a single one of the plurality of interchangeable modules.

16. A spacecraft, comprising:
multi-beam antenna (MBA) system;
a reflector; and
a feed array of radiating feed elements configured as a phased array and illuminating the reflector, operable at a frequency having a characteristic wavelength (A), the feed array including a plurality of interchangeable modules, wherein:
each of the plurality of interchangeable modules includes a distal mounting panel and a proximal mounting panel, and at least six feed array elements;
each feed array element is electrically coupled with a respective amplifier and mechanically coupled with an exterior surface of the distal mounting panel;
the respective amplifiers are disposed between the proximal mounting panel and the distal mounting panel, mechanically coupled to an interior surface of the distal mounting panel and an exterior surface of the proximal mounting panel thermally coupled with the proximal mounting panel; and
an interior surface of the proximal mounting panel of each interchangeable module is mechanically and thermally coupled with a back plate;
wherein the feed array includes beam formers and the back plate includes a plurality of recessed portions, at least a portion of each beam former being disposed in a respective one of the plurality of recessed portions.

17. The spacecraft of claim 16 , wherein the back plate is thermally coupled with one or more heat pipes.

18. The spacecraft of claim 16 , wherein the back plate is configured to mechanically interface directly with two or more of the plurality of interchangeable modules.

19. The spacecraft of claim 18 , wherein the back plate is a monolithic element configured to mechanically interface directly with each of the plurality of interchangeable modules.

Assignees

• Space Systems/Loral LLC

Inventors

• Wu Gordon
• Parman Matthew Stephen
• Jones Robert

Classifications

• H01Q21/0025

  Modular arrays · CPC title

• H01Q1/22

  by structural association with other equipment or articles · CPC title

• H01Q25/007

  using two or more primary active elements in the focal region of a focusing device (for operation on different wavebands H01Q5/22) · CPC title

• H01Q15/14

  Reflecting surfaces; Equivalent structures {(electromagnetic shields H01Q1/526)} · CPC title

• H01Q3/267

  Phased-array testing or checking devices · CPC title