Packaged electronic device having integrated antenna and locking structure

Patent metadata

Field	Value
Publication number	US-10566680-B2
Application number	US-201815911082-A
Country	US
Kind code	B2
Filing date	Mar 3, 2018
Priority date	Nov 3, 2015
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

First claim

What is claimed is:

1. A packaged electronic device having an integrated antenna comprising:
a lead frame comprising:
a conductive die attach pad;
conductive leads spaced apart from a first side of the conductive die attach pad; and
an elongated conductive body configured as a u-shaped member with an open portion of the u-shaped member disposed facing opposite to the conductive die attach pad and having a first bonding portion disposed at a first end and second bonding portion disposed at an opposing second end, wherein a first conductive lead is disposed within the open portion defined by the u-shaped member so that the elongated conductive body partially encloses the first conductive lead;

a conductive probe feed structure electrically coupled to the first conductive lead and the conductive die attach pad;
a conductive shorting structure electrically coupled to the elongated conductive body and the conductive die attach pad;
an electronic device disposed adjacent the conductive die attach pad; and
a package body encapsulating the electronic device, the conductive probe feed structure, the conductive shorting structure, at least portions of the conductive die attach pad, at least portions of the conductive leads, and at least a portion of the elongated conductive body, wherein:
the integrated antenna comprises the conductive die attach pad, the first lead, the elongated conductive body, the conductive probe feed structure, and the conductive shorting structure.

2. The device of claim 1 , wherein the elongated conductive body has a length greater than or equal to a width of the die attach pad.

3. The device of claim 1 , wherein:
the elongated conductive body comprises a middle portion disposed between the first bonding portion and the second bonding portion that is thinner than the first bonding portion and the second bonding portion; and
the package body encapsulates the middle portion.

4. The device of claim 1 , wherein:
the elongated conductive body partially encloses more than one of the conductive leads; and
the first conductive lead is disposed as a closest lead to the first bonding portion; and
the conductive shorting structure is disposed closer to the first bonding portion than the second bonding portion.

5. The device of claim 1 , wherein:
the first conductive lead is the only conductive lead partially enclosed by the elongated conductive body; and
the conductive shorting structure is disposed closer to the second bonding portion than the first bonding portion.

6. The device of claim 1 , further comprising:
a passive component electrically coupled to the elongated conductive body and the conductive die attach pad.

7. The device of claim 6 , wherein:
the passive component is disposed closer to the second bonding portion than the first bonding portion; and
the conductive shorting structure is interposed between the first bonding portion and the passive component in a top view.

8. The device of claim 6 , wherein the passive component comprises a capacitor.

9. The device of claim 8 , wherein the capacitor comprises a capacitance in a range from about 2 picofarads to about 100 picofarads.

10. The device of claim 7 , wherein the conductive probe feed structure is interposed between the conductive shorting structure and the passive component in the top view.

11. The device of claim 1 further comprising a passive component electrically coupled to a second conductive lead and the conductive die attach pad.

12. The device of claim 11 , wherein:
the second conductive lead is not partially enclosed by the elongated conductive body; and
a third conductive lead is interposed between the second conductive lead and the elongated conductive body in a top view.

13. The device of claim 1 , wherein the first bonding portion and the second bonding portion are disposed along the first side of the conductive die attach pad and exposed outside of the package body.

14. A packaged electronic device having an integrated antenna comprising:
a substrate structure comprising:
a conductive die attach pad;
conductive leads spaced apart from a first side of the conductive die attach pad; and
an elongated conductive body having a first bonding portion disposed at a first end and second bonding portion disposed at an opposing second end, wherein:
the elongated conductive body is interposed between the first side of the conductive die attach pad and the conductive leads; and
the first bonding portion, the second bonding portion, and the conductive leads terminate along an edge of the packaged electronic device;

an electronic device disposed adjacent the conductive die attach pad; and
a package body encapsulating the electronic device, at least portions of the conductive die attach pad, at least portions of the conductive leads, and at least a portion of the elongated conductive body, wherein:
the integrated antenna comprises the elongated conductive body.

15. The device of claim 14 , wherein:
the elongated conductive body is configured as a u-shaped member with an open portion of the u-shaped member disposed facing opposite to the conductive die attach pad;
a first conductive lead is disposed within the open portion defined by the u-shaped member so that the elongated conductive body partially encloses the first conductive lead; and
the conductive die attach pad, the at least one lead, the elongated conductive body, the conductive probe feed structure, and the conductive shorting structure are configured as the integrated antenna; and
the device further comprises:
a conductive probe feed structure electrically coupled to the first conductive lead and the conductive die attach pad; and
a conductive shorting structure electrically coupled to the elongated conductive body and the conductive die attach pad.

16. The device of claim 15 , wherein:
the elongated conductive body partially encloses more than one of the conductive leads; and
the first conductive lead is disposed as a closest lead to the first bonding portion; and
the conductive shorting structure is disposed closer to the first bonding portion than the second bonding portion.

17. The device of claim 14 , wherein:
the elongated body portion comprises a ground portion and a feed portion separated by a gap;
the device further comprises:
a conductive feed structure electrically coupled to the feed portion and the electronic device; and
a conductive ground structure electrically coupled to the ground portion and the electronic device; and

the device is further provided in combination with a substrate having a conductive structure electrically coupling the first bonding portion to the second bonding portion.

18. The device of claim 14 , wherein:
the elongated body portion comprises a folded structure to provide the integrated antenna comprises an integrated dipole antenna;
the first bonding portion and the second bonding portion are disposed immediately adjacent to each other along the edge of the packaged electronic device; and
the device further comprises:
a conductive feed structure electrically coupled to the first bonding portion and the electronic device; and
a conductive ground structure electrically coupled to the second bonding portion and the electronic device.

19. The device of claim 14 , wherein:
the elongated conductive body is configured as a u-shaped member with an open portion of the u-shaped member disposed facing opposite to the conductive die attach pad;
a first conductive lead is disposed within the o

Assignees

• Amkor Technology Inc

Inventors

• Mangrum Marc Alan

Classifications

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title