Latent heat storage body, method for producing latent heat storage body and heat exchange material

Patent metadata

Field	Value
Publication number	US-10563108-B2
Application number	US-201515305950-A
Country	US
Kind code	B2
Filing date	Apr 23, 2015
Priority date	Apr 24, 2014
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

In the latent heat storage body (100) according to the present invention, the surface of a core particle (10) composed of a latent heat storage material of a metal or an alloy is coated with an oxidized film of a compositional element of the core particle (10). Hence, the step of separately fabricating the core particle and the oxidized film (20) corresponding to a shell accommodating the core particle and accommodating the core particle inside the shell becomes unnecessary. Further since the core particle exhibits no expansion when transforming from a solid phase to a liquid phase, the component of the melted latent heat storage material stays inside the space covered with the oxidized film and the oxidized film is never damaged. Further, the oxidized film (20) can be made chemically stable.

First claim

The invention claimed is:

1. A latent heat storage body microcapsule, comprising:
a core particle comprising a latent heat storage material of an alloy; and
a double film, with which a surface of the core particle is coated, and comprising a compact first oxidized film of a compositional element of the core particle, and a second oxidized film, provided on an outer surface of the compact first oxidized film, of a compositional element of the core particle,
wherein the alloy of the core particle is an A-B alloy of at least one alloy component A selected from the following group A with at least one alloy component B selected from the following group B; and a standard free energy (ΔG A 0 ) of oxide formation of the alloy component A and a standard free energy)(ΔG B 0 ) of oxide formation of the alloy component B satisfy a relationship of ΔG A 0 ≥ΔG B 0 :
group A: Ca, Si, Bi, Mg, Sb, In, Sn, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Pd, Ag, Au or Pb; and
group B: Al, Cr, Mn, Si, Mg, Co or Ni; and
wherein both of the first oxidized film and the second oxidized film are α-Al 2 O 3 .

2. The latent heat storage body microcapsule according to claim 1 , wherein the alloy of the core particle is an Al—Si alloy wherein the Al—Si alloy is controllable to have a low volume expansion coefficient at melting by adjusting a content ratio of Si, which has a negative volume expansion coefficient at melting.

3. The latent heat storage body microcapsule according to claim 1 , further comprising a metal film on the surface.

4. The latent heat storage body microcapsule according to claim 1 , wherein when the latent heat storage material is in a solid phase state, a void as a buffer is present between the core particle and the oxidized film.

5. A heat exchange material, comprising:
a heat-resistive base material; and
a latent heat storage body microcapsule according to claim 1 dispersed and carried in the heat-resistive base material.

Assignees

• Univ Hokkaido Nat Univ Corp

Inventors

• Akiyama Tomohiro
• Nomura Takahiro
• Sagara Akihito
• Okinaka Noriyuki
• Zhu Chunyu

Classifications

• C09K5/063 Primary

  Materials absorbing or liberating heat during crystallisation; Heat storage materials · CPC title

• B01J21/04

  Alumina · CPC title

• C09K5/06

  the change of state being from liquid to solid or vice versa · CPC title

• B01J21/06

  Silicon, titanium, zirconium or hafnium; Oxides or hydroxides thereof · CPC title

• Y02E60/14

  Thermal energy storage · CPC title