Cutting blade

Patent metadata

Field	Value
Publication number	US-10562154-B2
Application number	US-201615240586-A
Country	US
Kind code	B2
Filing date	Aug 18, 2016
Priority date	Sep 2, 2015
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 μm to 50 μm. The average grain size of the boron compound grains is greater than ⅕ and less than or equal to ½ of the average grain size of the diamond abrasive grains.

First claim

What is claimed is:

1. A cutting blade including diamond abrasive grains and boron compound grains for cutting a quartz substrate or a glass substrate, wherein:
an average grain size of said diamond abrasive grains falls within the range of greater than or equal to 30 μm and less than or equal to 40 μm;
an average grain size of said boron compound grains is greater than 6 μm and less than or equal to 20 μm;
said diamond abrasive grains and said boron compound grains are fixed by a resin bond or a metal bond, and a percent volume of each said diamond abrasive grains and said boron compound grains in said resin bond or said metal bond is 10% to 20%; and
wherein a ratio of the average grain size of said diamond abrasive grains and the average grain size of said boron compound grains configures the cutting blade to cut into a surface of the quartz substrate or the glass substrate.

2. The cutting blade according to claim 1 , wherein said boron compound grains are selected from the group consisting of boron carbide (B 4 C) grains and cubic boron nitride (cBN) grains.

3. The cutting blade according to claim 1 , wherein a volume ratio between said diamond abrasive grains and said boron compound grains in said cutting blade is in a range between 2:1 to 1:8.

4. The cutting blade according to claim 1 , wherein the cutting blade has an annular shape.

5. The cutting blade according to claim 4 , wherein said diamond abrasive grains and said boron compound grains are fixed by the resin bond into a mixture which is pressed to form said annular shape and sintered at 180° C. to 200° C.

6. The cutting blade according to claim 4 , wherein said diamond abrasive grains and said boron compound grains are fixed by the metal bond into a mixture which is pressed to form said annular shape and sintered at 600° C. to 700° C.

7. A cutting blade including diamond abrasive grains and boron compound grains for cutting a quartz substrate or a glass substrate, wherein:
an average grain size of said diamond abrasive grains falls within the range of greater than 40 μm to less than 50 μm; and
an average grain size of said boron compound grains is greater than 8 μm and less than or equal to 25 μm;
said diamond abrasive grains and said boron compound grains are fixed by a resin bond or a metal bond, and a percent volume of each said diamond abrasive grains and said boron compound grains in said resin bond or said metal bond is 10% to 20%; and
wherein a ratio of the average grain size of said diamond abrasive grains and the average grain size of said boron compound grains configures the cutting blade to cut into a surface of the quartz substrate or the glass substrate.

Assignees

• Disco Corp

Inventors

• Maji Ryogo
• Oshima Ryuji
• Ishiai Yoshiki

Classifications

• B24D5/12 Primary

  Cut-off wheels · CPC title

• B24B41/04

  Headstocks; Working-spindles; Features relating thereto · CPC title

• B24D3/06

  metallic {or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements} · CPC title

• B24B55/00

  Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition (of general applicability for machine tools B23Q11/00; in general F16P) · CPC title

• B24B27/06 Primary

  Grinders for cutting-off · CPC title