Polyurethane CMP pads having a high modulus ratio

Patent metadata

Field	Value
Publication number	US-10562149-B2
Application number	US-201615273855-A
Country	US
Kind code	B2
Filing date	Sep 23, 2016
Priority date	Sep 25, 2015
Publication date	Feb 18, 2020
Grant date	Feb 18, 2020

Abstract

A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.

First claim

The invention claimed is:

1. A chemical-mechanical polishing pad comprising a thermoplastic polyurethane polishing layer having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more.

2. The pad of claim 1 , wherein the ratio is 100 or more.

3. The pad of claim 1 , wherein the thermoplastic polyurethane polishing layer also has a ratio of storage modulus at 40 degrees C. to storage modulus at 80 degrees C. of 50 or more.

4. The pad of claim 1 , wherein the thermoplastic polyurethane polishing layer has a Shore D hardness of 70 or more.

5. The pad of claim 1 , wherein the thermoplastic polyurethane polishing layer has a tensile elongation of 320 percent or less.

6. The pad of claim 1 , wherein the thermoplastic polyurethane polishing layer has a storage modulus at 25 degrees C. of 1000 MPa or more.

7. The pad of claim 1 , wherein the thermoplastic polyurethane polishing layer has a storage modulus at 80 degrees C. of 15 MPa or less.

8. The pad of claim 1 , wherein the pad is non-porous.

9. The pad of claim 1 , wherein the thermoplastic polyurethane has a molecular weight of less than about 100,000 g/mol.

10. The pad of claim 1 , wherein the pad has a density in a range from about 1.1 to about 1.2 g/cm3.

11. A method of chemical mechanical polishing a substrate, the method comprising:
(a) contacting the substrate with the pad of claim 1 ;
(b) moving the pad relative to the substrate; and
(c) abrading the substrate to remove a portion of at least one layer from the substrate and thereby polish the substrate.

12. A method for fabricating the pad of claim 1 , the method comprising:
(a) blending a thermoplastic polyurethane polymer resin mixture;
(b) extruding the mixture to form a solid thermoplastic polyurethane sheet;
(c) forming the polishing pad from the thermoplastic polyurethane sheet.

13. A method of chemical mechanical polishing a substrate; the method comprising:
(a) contacting the substrate with the pad of claim 1 ;
(b) moving the pad relative to the substrate; and
(c) abrading the substrate to remove a portion of at least one layer from the substrate and thereby polish the substrate.

14. A chemical-mechanical polishing pad comprising a thermoplastic polyurethane polishing layer having a storage modulus at 25 degrees C. of 1200 MPa or more and a tensile elongation of 320 percent or less.

15. A chemical-mechanical polishing pad comprising a thermoplastic polyurethane polishing layer having a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1000 MPa or more, and a storage modulus at 80 degrees C. of 20 MPa or less.

16. A chemical-mechanical polishing pad comprising a non-porous thermoplastic polyurethane polishing layer having an average molecular weight of 100,000 g/mol or less, a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and a storage modulus at 80 degrees C. of 15 MPa or less.

Assignees

• Cabot Microelectronics Corp

Inventors

• Fu Lin
• Ma Rui
• Speer Nathan
• Tsai Chen-Chih
• Bergman Kathryn

Classifications

• C08L75/04

  Polyurethanes · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/22

  characterised by a multi-layered structure · CPC title

• B24D11/00

  Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title