Small form factor transmitting device

Patent metadata

Field	Value
Publication number	US-10559941-B2
Application number	US-201816160817-A
Country	US
Kind code	B2
Filing date	Oct 15, 2018
Priority date	Jun 19, 2015
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

First claim

What is claimed is:

1. A method of implementing a photonic transceiver in a network system comprising:
packaging a photonic transceiver in a case with two transmitter devices mounted side-by-side on a PCB board and respectively coupled to a silicon photonics chip, the case comprising a first opening at a front end of the PCB board for mounting an optical input port and an optical output port respectively connected to the silicon photonics chip via optical fibers, and a second opening at a back end for the PCB board with multiple metallic stripes formed thereof as an electrical connector;
plugging the electrical connector to an electrical node of a communication network; and
connecting a pair of external optical fibers respectively to the optical input port and the optical output port, the pair of external optical fibers being connected respectively to an input path for providing incoming optical signals and output path for transmitting optical signals in the communication network,
wherein packaging the photonic transceiver comprises:
providing a base member comprising a planar part extended to an assembling part;
mounting a thermoelectric cooler module, a transmitter module, and an optical coupling lens assembly on a top surface of the planar part;
disposing an optical input port and an optical output port near the first end of the PCB board;
disposing a circuit board bended in step-shape with a first end region sitting on a top surface of the planar part and a second end region being a raised level, the first end region comprising multiple electrical connection patches respectively connected to the thermoelectric module and the transmitter module, the second end region comprising an electrical port for external connection;
disposing a cover member to a fixed position over the planar part to at least cover the thermoelectric module, the transmitter module, the optical coupling lens assembly, and the first end region of the circuit board;
assembling a cylindrical member to the assembling part, the cylindrical member enclosing an isolator aligned to the optical coupling lens assembly along its axial line and connected to a first optical fiber to output optical signal from the transmitter module; and
mounting the base member on the PCB board.

2. The method of claim 1 wherein the mounting the thermoelectric cooler module comprises:
disposing a plurality of single-stage thermoelectric units sandwiched between a hot side surface and a cold side surface;
attaching the hot side surface to a first submount inside a semi-hollow region recessed from the top surface of the planar part; and
attaching the cold side surface partially with a second submount.

3. The method of claim 2 wherein mounting the transmitter module comprises mounting a thermistor chip, a monitor photodiode chip, and a laser diode chip respectively on the second submount.

4. The photonic transceiver of claim 2 wherein mounting the optical coupling lens assembly comprises:
holding an aspherical lens with a square metal frame; and
directly mounting the square metal frame that holds the aspherical lens on the cold side surface between the second submount and the assembly part.

5. The method of claim 4 wherein holding the aspherical lens comprises configuring the aspherical lens with a first convex curve surface having a first plurality of curvatures at different surface locations relative to its central axis and a second convex curve surface having a second plurality of curvatures at different surface locations relative to its central axis, each of the first plurality of curvatures being smaller than each of the second plurality of curvatures.

6. The method of claim 5 wherein holding the aspherical lens further comprises disposing a first apex point of the first convex curve surface at a first distance away from the laser diode chip and a second apex point of the second convex curve surface at a second distance away from the isolator.

7. The method of claim 6 wherein the first distance is fixed at 0.25 mm with 0.8 mm tolerance and the second distance is adjustable within a range from 1.5 mm to 4.0 mm for achieving a coupling efficiency of at least 50%.

8. The method of claim 1 wherein the assembly part comprises a vertical portion attached to a side of the planar part above the top surface, the vertical portion having a connection plane distal to the planar part and an annular through-hole positioned near a center position of the vertical portion to allow the emitted light from the transmitter module coupled via the optical coupling lens assembly to pass into the cylindrical member.

9. The method of claim 8 wherein assembling a cylindrical member comprises:
attaching a first cylindrical body with a plane adjusting mechanism to the connection plane; and
attaching one end of a second cylindrical body with a light distance adjusting mechanism to the first cylindrical body while leaving another end of the second cylindrical body with an optical fiber connection mechanism for connecting a fiber.

10. The method of claim 9 wherein assembling a cylindrical member further comprises:
fixing the isolator to a coupling portion of the second cylindrical body;
enclosing the isolator in a disposal slot of the first cylindrical body;
using the plane adjusting mechanism to adjust the first cylindrical body against the connection plane to calibrate X-Y plane positions relative to the light out of the optical coupling lens assembly; and
using the light distance adjusting mechanism to adjust the second cylindrical body against the first cylindrical body to calibrate a Z-axis position from the optical coupling lens assembly.

11. The method of claim 10 wherein assembling a cylindrical member further comprises engaging one end of a sleeve body to an outer disposal ring of the coupling portion; and
using another end of the sleeve body to receive an optical fiber coupling channel for holding the first optical fiber.

12. The method of claim 1 wherein disposing the circuit board comprises configuring a middle region in certain angles respectively connected to both the first end region being flat on the top surface of the planar part and the second end region being flat at the raised level substantially in parallel with the first end region, the second end region being extended outside of the cover member and the base member.

13. The method of claim 12 wherein the first end region comprises a U-shape end to hold the multiple electrical connection patches.

14. The method of claim 1 , further comprises:
coupling the silicon photonics chip with the transmitter module via the first optical fiber and with inner terminals of the optical input port and the optical output port respectively via a second optical fiber and a third optical fiber; and
mounting a fiber holder on the PCB board, wherein the fiber holder holds at least the first, second, and third optical fibers.

15. The method of claim 14 wherein mounting the transmitter module comprises laying the first fiber out of the transmitter module toward the second end of the PCB board.

16. The method of claim 1 wherein the case comprises a base piece, a side piece with two vertical parts connected by a horizontal joint part, and a lid piece with a top part connected to a pair of partial-side parts; wherein the base piece is configured to couple with the two vertical parts of the side piece and the horizontal joint part leveled with the base piece, the lid piece is configured to couple with the base piece with the pair of partial-side parts joined with the two vertical parts.

Assignees

• Inphi Corp
• Luxnet Corp

Inventors

• Nagarajan Radhakrishnan L
• Li Peng-Chih
• Law Pi-Cheng

Classifications

• G02B6/4271

  with thermo electric cooling · CPC title

• G02B6/4212

  the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel · CPC title

• G02B6/4287

  Optical modules with tapping or launching means through the surface of the waveguide (G02B6/2852, G02B6/4286 take precedence) · CPC title

• H01S5/0064

  Anti-reflection components, e.g. optical isolators · CPC title

• G02B6/4215

  the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers (G02B6/4246 takes precedence) · CPC title