Interconnection system

US10559930B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10559930-B2
Application numberUS-201916373664-A
CountryUS
Kind codeB2
Filing dateApr 3, 2019
Priority dateApr 4, 2018
Publication dateFeb 11, 2020
Grant dateFeb 11, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electrical receptacle connector is mounted within a metallic cage for mating with a SFP module received within the cage. The contacts of the cable receptacle connector are arranged with two groups, of which one are connected to the printed circuit board on which the cage is mounted, and the other are connected to the wires which are further connected to a board-mount receptacle connector mounted on another printed circuit board on which the CPU (Central Processing Unit) socket is mounted. Each board-mount receptacle connector corresponds to more than one cable receptacle connector.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrical interconnection system comprising: a periphery side comprising: a first printed circuit board; a plurality of cages mounted on the first printed circuit board, a plurality of cavities formed in the corresponding cages for receiving a plurality of modules therein, respectively; a plurality of cable receptacle connectors located at rear portions of said receiving cavities, respectively; a system side comprising: a second printed circuit board; an IC chip mounted on the second printed circuit board; a plurality of board-mount receptacle connectors mounted upon the second printed circuit board; and a plurality of cables connected between the cable receptacle connectors and the board-mount receptacle connectors; wherein the board-mount receptacle connectors are arranged in an upper row and a lower row, and mounted on two opposite top and bottom surfaces of the second printed circuit board, wherein the cages and the cable receptacle connectors are arranged in an upper and a lower row, and are mounted on two opposite top and bottom surfaces of the first printed circuit board, wherein each of said cables having one end is connected to one corresponding board-mount receptacle connector, and the other end is connected to two neighboring cable receptacle connectors in the upper row and two neighboring cable receptacle connectors in the lower row, wherein said two neighboring cable receptacle connectors in the upper row are aligned with two neighboring cable receptacle connectors in the lower row in the vertical direction, respectively, wherein each of said cable includes four sets of different pair contacts, and each set includes two pairs. 2. The interconnection system as claimed in claim 1 , wherein each cable is integrally connected to the corresponding cable receptacle connectors while is detachably connected to the corresponding board-mount receptacle connector through a cable plug connector mated with the corresponding board-mount receptacle connector. 3. The interconnection system as claimed in claim 1 , wherein the upper row of board-mount receptacle connectors are offset from the lower row of board-mount receptacle connectors in a front-to-back direction. 4. The interconnection system as claimed in claim 3 , wherein the upper row of board-mount receptacle connectors and the lower row of board-mount receptacle connectors are respectively located by two sides of an IC chip heat sink set in the front-to-back direction. 5. The interconnection system as claimed in claim 1 , wherein the cables are alternately connected to the upper row of board-mount receptacle connectors and the lower row of board-mount receptacle connectors in a staggered manner in sequence. 6. The interconnection system as claimed in claim 1 , wherein the upper row of board-mount receptacle connectors and the lower row of board-mount receptacle connectors are aligned with each other in a front-to-back direction in a top view. 7. The interconnection system as claimed in claim 1 , wherein said first printed circuit board and said second printed circuit board are discrete and spaced from each other. 8. An interconnection system comprising: a periphery side comprising: a first printed circuit board; a plurality of cages mounted on the first printed circuit board, a plurality of cavities formed in the corresponding cages for receiving a plurality of modules therein, respectively; a plurality of cable receptacle connectors located at rear portions of said receiving cavities, respectively; a system side comprising: a second printed circuit board; an IC chip mounted on the second printed circuit board; a plurality of board-mount receptacle connectors mounted upon the second printed circuit board; and a plurality of cables connected between the cable receptacle connectors and the board-mount receptacle connectors; wherein each of said cable receptacle connector includes an insulative housing with a horizontal mating slot, a plurality of floor contacts retained in the housing, located by one side of the mating slot closer to the first printed circuit board and mechanically and electrically connected to the first printed circuit board, and a plurality of ceiling contacts disposed in the housing, located by the other side of the mating slot farther from the first printed circuit board and mechanically and electrically connected to the corresponding one cable, wherein the ceiling contacts are integrally formed within an insulator to form a contact module received within a receiving space in a rear portion of the housing, wherein the ceiling contacts are arranged with two groups with a space therebetween in a transverse direction, and each group has a pair of grounding contacts commonly sandwiching a differential pair contacts therebetween in said transverse direction, the ceiling contacts in each group defines a pitch and said space occupies two pitches, wherein an insulative cover is attached upon the insulator to cover joints between the able and the ceiling contacts. 9. An interconnection system comprising: a periphery side comprising: a first printed circuit board; a plurality of cages mounted on the first printed circuit board, a plurality of cavities formed in the corresponding cages for receiving a plurality of modules therein, respectively; a plurality of cable receptacle connectors located at rear portions of said receiving cavities, respectively; a system side comprising: a second printed circuit board; an IC chip mounted on the second printed circuit board; a plurality of board-mount receptacle connectors mounted upon the second printed circuit board; and a plurality of cables connected between the cable receptacle connectors and the board-mount receptacle connectors; wherein each of said cable receptacle connector includes an insulative housing with a horizontal mating slot, a plurality of floor contacts retained in the housing, located by one side of the mating slot closer to the first printed circuit board and mechanically and electrically connected to the first printed circuit board, and a plurality of ceiling contacts disposed in the housing, located by the other side of the mating slot farther from the first printed circuit board and mechanically and electrically connected to the corresponding one cable, wherein the ceiling contacts are integrally formed within an insulator to form a contact module received within a receiving space in a rear portion of the housing, wherein the ceiling contacts are arranged with two groups with a space therebetween in a transverse direction, and each group has a pair of grounding contacts commonly sandwiching a differential pair contacts therebetween in said transverse direction, the ceiling contacts in each group defines a pitch and said space occupies two pitches, wherein the floor contacts are rearwardly assembled into the housing from a front side of the housing, and the ceiling contacts are forwardly assembled into the housing form a rear side of the housing.

Assignees

Inventors

Classifications

  • H01R13/659Primary

    with plural ports for distinct connectors · CPC title

  • for mounting on PCBs · CPC title

  • Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable · CPC title

  • cooperating directly with the edge of the rigid printed circuits · CPC title

  • Non-printed connector · CPC title

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Frequently asked questions

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What does patent US10559930B2 cover?
An electrical receptacle connector is mounted within a metallic cage for mating with a SFP module received within the cage. The contacts of the cable receptacle connector are arranged with two groups, of which one are connected to the printed circuit board on which the cage is mounted, and the other are connected to the wires which are further connected to a board-mount receptacle connector mou…
Who is the assignee on this patent?
Foxconn Kunshan Computer Connector Co Ltd, Foxconn Interconnect Technology Ltd
What technology area does this patent fall under?
Primary CPC classification H01R13/659. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).