Backside integration of RF filters for RF front end modules and design structure

Patent metadata

Field	Value
Publication number	US-10559743-B2
Application number	US-201715690828-A
Country	US
Kind code	B2
Filing date	Aug 30, 2017
Priority date	Jan 20, 2012
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of the substrate to the backside of the substrate and electrically coupling the RF filter to the device.

First claim

What is claimed:

1. A method, comprising:
providing a radio frequency (RF) filter at a backside of a substrate; and
forming at least one substrate conductor through the substrate, wherein the at least one substrate conductor electrically couples the RF filter to at least one device at a front side of the substrate,
wherein the providing the RF filter comprises forming a bulk acoustic wave (BAW) filter on the backside of the substrate, and
the at least one substrate conductor comprises a first through-silicon-via connected to a first electrode of the BAW filter and a second through-silicon-via connected to a second electrode of the BAW filter.

2. The method of claim 1 , further comprising forming an encapsulating seal around the BAW filter at the backside of the substrate.

3. The method of claim 2 , wherein the forming the encapsulating seal comprises:
forming a spacer ring on the backside of the substrate around the BAW filter; and
bonding a glass plate to the spacer ring, wherein the BAW filter is structured within a cavity defined by the glass plate and the spacer ring.

4. The method of claim 2 , wherein the forming an encapsulating seal comprises:
forming a sacrificial material on and around the BAW filter;
forming a first sealing layer on the sacrificial material;
forming a vent hole in the first sealing layer;
removing the sacrificial material through the vent hole; and
forming a second sealing layer on the first sealing layer,
wherein the second sealing layer plugs the vent hole; and
the BAW filter is structured within a cavity formed by removal of sacrificial material and defined by the first sealing layer and the second sealing layer.

5. The method of claim 1 , further comprising forming a cavity that is: (i) under the BAW filter and (ii) between the BAW filter and the substrate, wherein the cavity is formed in a backside insulator layer on a backside of the substrate, and each of the first through-silicon-via and the second through-silicon-via extends through the backside insulator layer.

6. The method of claim 1 , wherein the BAW filter is encapsulated in an epoxy or polymer material.

7. The method of claim 6 , further comprising:
forming a solder connection between the at least one substrate conductor and an electrode of the BAW filter; and
forming a continuous solder ring at the backside of the substrate surrounding the solder connection.

8. The method of claim 1 , further comprising:
forming an insulator layer on the front side of the substrate covering the at least one device at the front side of the substrate;
forming contacts in the insulator layer; and
forming a backside insulator layer on the backside of the substrate;
wherein each of the first through-silicon-via and the second through-silicon-via extends completely through the insulator layer, the substrate, and the backside insulator layer, and
the first electrode of the BAW filter is formed on a surface of the backside insulator layer.

9. A method comprising:
providing a radio frequency (RF) filter at a backside of a substrate; and
forming at least one substrate conductor through the substrate, wherein the at least one substrate conductor electrically couples the RF filter to at least one device at a front side of the substrate,
wherein the providing the RF filter comprises forming a bulk acoustic wave (BAW) filter on the backside of the substrate, and
wherein the forming the BAW filter comprises:
forming a backside insulator layer on the backside of the substrate;
forming a first electrode on the backside insulator layer and in contact with a conductive material of a first one of the at least one substrate conductor;
forming a piezoelectric material on the first electrode; and
forming a second electrode on the piezoelectric material and in contact with a conductive material of a second one of the at least one substrate conductor.

10. The method of claim 9 , further comprising:
electrically coupling the conductive material of the first one of the at least one substrate conductor to a first one of the at least one device that is formed on the front side of the substrate; and
electrically coupling the conductive material of the second one of the at least one substrate conductor to a second one of the at least one device that is formed on the front side of the substrate.

11. A semiconductor structure, comprising:
a substrate having a front side and a backside opposite the front side;
a device at the front side of the substrate;
a radio frequency (RF) filter at the backside of the substrate;
a first electrode at the backside of the substrate and contacting the RF filter;
a second electrode at the backside of the substrate and contacting the RF filter;
a first substrate conductor extending through the substrate and providing an electrical path between the device and the first electrode; and
a second substrate contact extending through the substrate and electrically connected to the second electrode,
wherein the first substrate conductor comprises a first through-silicon-via that extends from the front side of the substrate to the backside of the substrate, and that contacts the first electrode, and
the second substrate conductor comprises a second through-silicon-via that extends from the front side of the substrate to the backside of the substrate.

12. The structure of claim 11 , wherein the RF filter comprises a bulk acoustic wave (BAW) filter.

13. The structure of claim 12 , wherein the BAW filter comprises a piezoelectric material sandwiched between the first electrode and the second electrode.

14. The structure of claim 12 , further comprising:
at least one sealing layer encapsulating the BAW filter at the backside of the substrate; and
an air gap between the at least one sealing layer and the BAW filter.

15. The structure of claim 14 , wherein the at least one sealing layer comprises:
a first sealing layer on a same surface as the first electrode; and
a second sealing layer on the first sealing layer and filling at least one gap in the first sealing layer.

16. The structure of claim 12 , further comprising:
a glass plate encapsulating the BAW filter at the backside of the substrate; and
an air gap between the glass plate and the BAW filter.

17. The structure of claim 12 , wherein the BAW filter is encapsulated in an epoxy or polymer material.

18. The structure of claim 17 , wherein the first electrode and the second electrode are encapsulated in the epoxy or polymer material, and further comprising:
a first solder connection between the first substrate conductor and the first electrode; and
a second solder connection between the second substrate conductor and the second electrode.

19. The structure of claim 18 , further comprising a continuous solder ring at the backside of the substrate surrounding both the first solder connection and the second solder connection.

20. The structure of claim 11 , further comprising:
an insulator layer on the front side of the substrate covering the device at the front side of the substrate;
contacts in the insulator layer; and
a backside insulator layer on the backside of the substrate;
wherein each of the first through-silicon-via and the second through-silicon-via extends completely through the insulator layer, the substrate, and the backside insulator layer,
the RF filter comprises a bulk acoustic wave (BAW) filter, and
the first electrode is formed on a surface of the backside insulator layer.

Assignees

• Globalfoundries Inc

Inventors

• Adkisson James W
• Candra Panglijen
• Dunbar Thomas J
• Gambino Jeffrey P
• Jaffe Mark D
• Stamper Anthony K
• Wolf Randy L

Classifications

• H10W20/481

  on the rear surfaces of the wafers or substrates · CPC title

• H10W20/2134

  TSVs extending from the semiconductor wafer into back-end-of-line layers · CPC title

• H10W20/218

  in silicon-on-insulator [SOI] wafers · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title