Semiconductor device and manufacturing method thereof
US-9099562-B2 · Aug 4, 2015 · US
US10559667B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10559667-B2 |
| Application number | US-201514830817-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 20, 2015 |
| Priority date | Aug 25, 2014 |
| Publication date | Feb 11, 2020 |
| Grant date | Feb 11, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor device in which a transistor has the characteristic of low off-state current is provided. The transistor comprises an oxide semiconductor layer having a channel region whose channel width is smaller than 70 nm. A temporal change in off-state current of the transistor over time can be represented by Formula (a2). In Formula (a2), I OFF represents the off-state current, t represents time during which the transistor is off, α and τ are constants, β is a constant that satisfies 0<β≤1, and C S is a constant that represents load capacitance of a source or a drain. I OFF ( t ) = C S × α × β τ β × t β - 1 × e - ( t τ ) β ( a 2 )
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a first transistor comprising: a first gate; a first gate insulating film over the first gate; a first oxide semiconductor layer over the first gate insulating film, the first oxide semiconductor layer including a channel formation region overlapping with the first gate, wherein a width of the channel formation region is smaller than 70 nm; a first conductive film and a second conductive film each over and in contact with a first region and a second region of a top surface of the first oxide semiconductor layer; a second oxide semiconductor layer over and in contact with a top surface and side surfaces of each of the first conductive film and the second conductive film, and a third region of the top surface and side surfaces of the first oxide semiconductor layer; a second gate insulating film over the second oxide semiconductor layer; and a second gate over the second gate insulating film, the second gate overlapping with the channel formation region, wherein a temporal change of off-state current of the first transistor is represented by Formula (a2): I OFF ( t ) = C S × α × β τ β × t β - 1 × e - ( t τ ) β ( a2 ) wherein I OFF represents the off-state current, t represents time during which the first transistor is off, α and τ are constants, β is a constant that satisfies 0<β≤1 , and C S is a constant that represents load capacitance of a source or a drain of the first transistor. 2. The semiconductor device according to claim 1 , wherein the off-state current at room temperature is less than 1×10 −20 A when t is 1×10 5 seconds. 3. The semiconductor device according to claim 1 , wherein each of the first and second oxide semiconductor layers comprises indium, gallium, and zinc. 4. A semiconductor device comprising: a first transistor comprising: a first gate; a first gate insulating film over the first gate; a first oxide semiconductor layer over the first gate insulating film, the first oxide semiconductor layer including a channel formation region overlapping with the first gate, wherein a width of the channel formation region is smaller than 70 nm; a first conductive film and a second conductive film each over and in contact with a first region and second region of a top surface of the first oxide semiconductor layer; a second oxide semiconductor layer over and in contact with a top surface and side surfaces of each of the first conductive film and the second conductive film, and a third region of the top surface and side surfaces of the first oxide semiconductor layer; a second gate insulating film over the second oxide semiconductor layer, the first conductive film, and the second conductive film; and a second gate over the second gate insulating film, the second gate overlapping with the channel formation region; and a capacitor having a terminal electrically connected to one of the first conductive film and the second conductive film of the first transistor, wherein a temporal change of off-state current of the first transistor is represented by Formula (a2): I OFF ( t ) = C S × α × β τ β × t β - 1 × e - ( t τ ) β ( a2 ) wherein I OFF represents the off-state current, t represents time during which the first transistor is off, α and τ are constants, β is a constant that satisfies 0<β≤1, and C S is a constant that represents capacitance of the capacitor. 5. The semiconductor device according to claim 4 , wherein the off-state current at room temperature is less than 1×10 −20 A when t is 1×10 5 seconds. 6. The semiconductor device according to claim 4 , wherein each of the first and second oxide semiconductor layers comprises indium, gallium, and zinc. 7. The semiconductor device
for testing bipolar transistors · CPC title
Measuring current only · CPC title
for testing field effect transistors, i.e. FET's · CPC title
Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.