Electron source

US10558123B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10558123-B2
Application numberUS-201816161010-A
CountryUS
Kind codeB2
Filing dateOct 15, 2018
Priority dateAug 14, 2015
Publication dateFeb 11, 2020
Grant dateFeb 11, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electron source is formed on a silicon substrate having opposing first and second surfaces. At least one field emitter is prepared on the second surface of the silicon substrate to enhance the emission of electrons. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitter using a process that minimizes oxidation and defects. The field emitter can take various shapes such as pyramids and rounded whiskers. One or several optional gate layers may be placed at or slightly lower than the height of the field emitter tip in order to achieve fast and accurate control of the emission current and high emission currents. The field emitter can be p-type doped and configured to operate in a reverse bias mode or the field emitter can be n-type doped.

First claim

Opening claim text (preview).

What is claimed is: 1. An electron source comprising: a silicon substrate having a top surface; at least one field emitter formed directly on the top surface of the silicon substrate, wherein the field emitter comprises one of a pyramid, a cone, or a rounded whisker; and a boron layer hermetically disposed on the field emitter, wherein the boron layer is greater than 75% boron, and wherein the boron layer covers the field emitter from the silicon substrate to a tip of the field emitter. 2. The electron source of claim 1 , wherein the boron layer comprises less than 10% oxygen near an interface between the boron layer and the silicon substrate. 3. The electron source of claim 1 , wherein the tip of the field emitter has a lateral dimension less than 100 nm. 4. The electron source of claim 3 , wherein the tip of the field emitter has a lateral dimension greater than 20 nm. 5. The electron source of claim 1 , wherein the tip of the field emitter has a diameter less than 100 nm. 6. The electron source of claim 1 , further comprising an electrode held at a positive voltage of less than 500 V relative to the field emitter at a distance of 2 μm or less from an apex of the field emitter. 7. The electron source of claim 1 , wherein the field emitter is p-type doped with a doping level less than about 10 14 cm −3 . 8. The electron source of claim 7 , further comprising a light source that illuminates the field emitter, wherein the light source comprises one of a laser diode or a light emitting diode and wherein the light source is configured to control the current of the primary electron beam. 9. The electron source of claim 1 , wherein the boron layer has a thickness from 2 nm to 6 nm. 10. The electron source of claim 1 , further comprising: a dielectric layer disposed on the top surface adjacent to the field emitter; and a conductive gate disposed on the dielectric layer opposite of the substrate, wherein the thickness of the dielectric layer is approximately equal to or less than a height of the field emitter. 11. The electron source of claim 1 , further comprising a plurality of the field emitters arranged in a two-dimensional periodic pattern. 12. The electron source of claim 11 , further comprising: a dielectric layer disposed on the top surface surrounding the plurality of field emitters; and a conductive gate disposed on the dielectric layer opposite of the substrate, wherein the thickness of the dielectric layer is approximately equal to or less than a height of a field emitter. 13. The electron source of claim 1 , wherein a region of the boron layer extending 100 nm from the tip of the field emitter is greater than 90% boron. 14. A device comprising: an electron source for generating a primary electron beam that is directed toward a sample, wherein the electron source comprises: a silicon substrate having a top surface; at least one field emitter formed directly on the top surface of the silicon substrate, wherein the field emitter comprises a pyramid, a cone, or a rounded whisker; and a boron layer disposed on the field emitter, wherein the boron layer is greater than 75% boron, and wherein the boron layer covers the field emitter from the silicon substrate to a tip of the field emitter; and electron optics. 15. The device of claim 14 , wherein the device is a scanning electron microscope (SEM), wherein the electron optics are configured to de-magnify and focus the primary electron beam onto the sample, and wherein the device further comprises a detector for detecting at least one of back-scattered electrons and secondary electrons from the sample. 16. The device of claim 14 , wherein the electron source further comprises: a dielectric layer disposed on the top surface adjacent to the field emitter; and a conductive gate disposed on the dielectric layer opposite of the substrate, wherein the thickness of the dielectric layer is approximately equal to or less than a height of the field emitter. 17. The device of claim 14 , wherein the device is an electron-beam lithography system, wherein the electron optics are configured to de-magnify and focus the primary electron beam onto the target, and wherein the device further comprises a modulator for modulating the intensity of the electron beam. 18. The electron source of claim 14 , wherein a region of the boron layer extending 100 nm from the tip of the field emitter is greater than 90% boron. 19. The electron source of claim 14 , further comprising a light source that illuminates the field emitter, wherein the light source comprises one of a laser diode or a light emitting diode, and wherein the light source is configured to control the current of the primary electron beam.

Assignees

Inventors

Classifications

  • of field emission cathodes · CPC title

  • Electron guns using field emission, photo emission, or secondary emission electron sources · CPC title

  • conical shaped, e.g. Spindt type · CPC title

  • Multiple source, e.g. comb or array · CPC title

  • H01J1/304Primary

    Field-emissive cathodes · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10558123B2 cover?
An electron source is formed on a silicon substrate having opposing first and second surfaces. At least one field emitter is prepared on the second surface of the silicon substrate to enhance the emission of electrons. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitter using a process that minimizes oxidation and d…
Who is the assignee on this patent?
Kla Tencor Corp
What technology area does this patent fall under?
Primary CPC classification H01J1/304. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).