Multilayer structure, method for producing the same and touch sensitive display using the same

US10558071B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10558071-B2
Application numberUS-201013634918-A
CountryUS
Kind codeB2
Filing dateSep 7, 2010
Priority dateMar 14, 2010
Publication dateFeb 11, 2020
Grant dateFeb 11, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is directed to an optical bonding apparatus with multiple layer structure including a pressure sensitive bonding layer and a thermal flow pressure sensitive bonding layer. The thermal flow pressure sensitive bonding layer is used for bonding to a rough surface of an object and superposing on the pressure sensitive bonding layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A touch sensitive display comprising: a touch panel; a liquid crystal display (LCD) panel facing the touch panel, wherein either the touch panel or the LCD panel has a rough surface; and an optical bonding apparatus placed between the touch panel and the LCD panel for bonding the touch panel and the LCD panel, the optical bonding apparatus comprising: a transparent pressure sensitive bonding layer; a transparent thermal flow pressure sensitive bonding layer; and an organic substrate placed between the transparent pressure sensitive bonding layer and the transparent thermal flow pressure sensitive bonding layer for bonding the transparent pressure sensitive bonding layer and the transparent thermal flow pressure sensitive bonding layer, wherein: the organic substrate is in direct contact with the transparent pressure sensitive bonding layer and the transparent thermal flow pressure sensitive bonding layer, the transparent pressure sensitive bonding layer has viscidity at room temperature and the transparent thermal flow pressure sensitive bonding layer has no viscidity at room temperature, the transparent thermal flow pressure sensitive bonding layer is configured to substantially uniformly contact the rough surface of the touch panel or the LCD panel, the transparent thermal flow pressure sensitive bonding layer fills a plurality of gaps on the rough surface of the touch panel or the LCD panel, and the transparent thermal flow pressure sensitive bonding layer is an anisotropic conductive film. 2. The touch sensitive display according to claim 1 , wherein the rough surface is a surface of the LCD panel. 3. The touch sensitive display according to claim 2 , wherein the transparent thermal flow pressure sensitive bonding layer completely covers the rough surface of the LCD panel. 4. The touch sensitive display according to claim 1 , wherein the rough surface is a surface of the touch panel. 5. The touch sensitive display according to claim 4 , wherein the transparent thermal flow pressure sensitive bonding layer completely covers the rough surface of the touch panel. 6. The touch sensitive display according to claim 1 , wherein a material of the organic substrate is polyethylene terephthalate. 7. The touch sensitive display according to claim 1 , wherein the organic substrate is 25 μm to 100 μm thick. 8. The touch sensitive display according to claim 1 , wherein the transparent pressure sensitive bonding layer is 25 μm to 50 μm thick. 9. The touch sensitive display according to claim 1 , wherein: the touch panel has a first width, the LCD panel has a second width different than the first width, and the optical bonding apparatus has a third width different than the first width and the second width.

Assignees

Inventors

Classifications

  • Up to 3 mils · CPC title

  • Methods of surface bonding and/or assembly therefor · CPC title

  • Input devices, e.g. touch panels · CPC title

  • of base or substrate · CPC title

  • Heat or solvent activated or sealable · CPC title

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Frequently asked questions

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What does patent US10558071B2 cover?
The present invention is directed to an optical bonding apparatus with multiple layer structure including a pressure sensitive bonding layer and a thermal flow pressure sensitive bonding layer. The thermal flow pressure sensitive bonding layer is used for bonding to a rough surface of an object and superposing on the pressure sensitive bonding layer.
Who is the assignee on this patent?
Lee Yuhwen, Xu Xianbin, Yuan Qiong, and 2 more
What technology area does this patent fall under?
Primary CPC classification G02F1/13338. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).