Optical module

US10558063B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10558063-B2
Application numberUS-201615223594-A
CountryUS
Kind codeB2
Filing dateJul 29, 2016
Priority dateFeb 14, 2014
Publication dateFeb 11, 2020
Grant dateFeb 11, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a connection surface of another end portion of the wiring are different from each other.

First claim

Opening claim text (preview).

What is claimed is: 1. An optical module comprising: an optical path formed by a laser light source, a wavelength locker, a semiconductor optical modulator configured to be driven at a high frequency, and a polarization combiner; a circuit board arranged at a height higher than a height of the optical path; a wiring sub-mount including a wiring electrically connecting the optical element to the circuit board, such that a height of a connection surface of one end portion of the wiring connected to the circuit board is higher than a height of a connection surface of another end portion of the wiring connected to the optical element; and a housing, wherein the optical path, the circuit board, and the wiring sub-mount are arranged in a continuous space defined by the housing. 2. The optical module according to claim 1 , wherein the wiring includes a first wiring portion extending in a direction parallel to a surface where the semiconductor optical modulator is mounted, and a second wiring portion connected to the first wiring portion and extending in a direction crossing the surface where the semiconductor optical modulator is mounted. 3. The optical module according to claim 2 , wherein a curved surface is formed on a connection between the first wiring portion and the second wiring portion of the wiring. 4. The optical module according to claim 1 , further comprising: a wiring board electrically connecting the wiring sub-mount to the circuit board. 5. The optical module according to claim 4 , wherein the wiring board includes microstrip lines including a signal wiring formed on one surface of a substrate and a ground wiring formed on another surface of the substrate, the signal wiring includes a connection electrode provided at each of connections to the wiring sub-mount and the circuit board, and the ground wiring and the connection electrode are arranged such that a distance to the ground wiring from an end of the wiring board in a wiring direction is equal to or greater than a distance to the connection electrode from the end of the wiring board. 6. The optical module according to claim 4 , wherein the wiring sub-mount, the circuit board, and the wiring board are an integrated structure. 7. The optical module according to claim 1 , wherein the wiring sub-mount and the circuit board are electrically connected by a wire. 8. The optical module according to claim 1 , wherein the optical path is arranged to form a U-shape. 9. The optical module according to claim 1 , wherein the wiring sub-mount is a laminated board. 10. The optical module according to claim 1 , wherein the circuit board includes a termination resistor. 11. The optical module according to claim 1 , wherein the housing has a length of not more than 80 mm and a width of not more than 20 mm.

Assignees

Inventors

Classifications

  • G02F1/015Primary

    based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction (G02F1/03 takes precedence) · CPC title

  • Electrical aspects (G02B6/4263 and G02B6/4265 take precedence) · CPC title

  • controlled by a high-frequency electromagnetic wave component in an electric waveguide (G02F1/0356, G02F1/05, G02F1/2255, G02F1/3134 take precedence) · CPC title

  • Coupling light guides with opto-electronic elements · CPC title

  • Combinations of two or more optical elements · CPC title

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Frequently asked questions

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What does patent US10558063B2 cover?
An optical module includes an optical element configured to be driven at a high frequency, a circuit board arranged at a height different from a height of the optical element, and a wiring sub-mount including a wiring electrically connecting the optical element and the circuit board, the wiring being such that a height of a connection surface of one end portion of the wiring and a height of a c…
Who is the assignee on this patent?
Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02F1/015. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).