Cutters comprising polycrystalline diamond attached to a hard metal carbide substrate

US10556832B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10556832-B2
Application numberUS-201515514429-A
CountryUS
Kind codeB2
Filing dateSep 25, 2015
Priority dateSep 26, 2014
Publication dateFeb 11, 2020
Grant dateFeb 11, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Superabrasive compacts and methods of making superabrasive compacts are disclosed. A superabrasive compact includes a polycrystalline diamond table and a substrate attached to the polycrystalline diamond table. The substrate includes a hard metal carbide and a binder having a compound with a composition of AxByCz, where A and B are transition metals, where C is carbon, and where 0≤x≤7, 0≤y≤7, x+y=7, and 0≤z≤3.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of making a superabrasive compact, comprising: positioning a plurality of superabrasive particles proximate to a substrate, wherein the substrate comprises hard metal carbides, a binder, and a species; and subjecting the substrate and the plurality of superabrasive particles to a high pressure high temperature process suitable for producing the superabrasive compact, wherein the species is selected from (i) the group of elements consisting of boron, aluminum, and manganese, (ii) the group of compounds consisting of a boron compound, an aluminum compound, and a manganese compound, and (iii) the group of eutectic alloys consisting of a boron alloy, an aluminum alloy, and a manganese alloy, and wherein in the high pressure high temperature process, the species in the substrate form a compound with a composition of A x B v C z , wherein A is a metal from the species, B is selected from the group consisting of W, Co, and Cr, and C is carbon, and wherein 0<x≤7, 0<y≤7, x+y=7, and 0≤z≤3. 2. The method of claim 1 , wherein the substrate comprises cemented tungsten carbide or nickel based tungsten carbide. 3. The method of claim 1 , wherein the superabrasive particles are selected from a group of cubic boron nitride, diamond, diamond composite materials, and diamond-like materials. 4. The method of claim 1 , further comprising dissolving the species into the binder in the substrate at the elevated temperature and pressure. 5. The method of claim 4 , wherein the dissolved species does not precipitate out of the binder after cooling down to room temperature and ambient pressure from the elevated temperature and pressure. 6. The method of claim 1 , wherein the high pressure high temperature process subjects the superabrasive particles and the substrate to an elevated temperature and pressure are more than about 600° C. and more than about 30 kbar, respectively. 7. The method of claim 1 , wherein the plurality of superabrasive particles are an at least partially leached polycrystalline diamond table. 8. The method of claim 7 , further comprising attaching the substrate to the at least partially leached polycrystalline diamond table. 9. The method of claim 1 , further comprising sweeping the binder from the substrate into the plurality of superabrasive particles. 10. The method of claim 9 , wherein the binder in the substrate comprises cobalt. 11. The method of claim 1 , wherein, after the high pressure high temperature process, the binder comprises a supersaturated solid solution of the at least one species in the binder. 12. The method of claim 1 , wherein, after the high pressure high temperature process, the binder contains a concentration of the at least one species that exceeds a saturation limit of the at least one species in the binder. 13. The method of claim 12 , wherein the substrate exhibits pore sizes of less than 10 microns in diameter. 14. The method of claim 1 , wherein the high pressure high temperature process subjects the superabrasive particles and the substrate to an elevated temperature of about 600° C. to about 1350° C. at an elevated pressure of about 30 kbar to about 100 kbar. 15. The method of claim 1 , wherein the species is selected from the group consisting of boron, a boron compound, and a boron alloy. 16. The method of claim 1 , wherein the species is selected from the group consisting of aluminum, an aluminum compound, and an aluminum alloy.

Assignees

Inventors

Classifications

  • obtained from carbonaceous particles with or without other non-organic components · CPC title

  • Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

  • based on carbides, but not containing other metal compounds · CPC title

  • of composite workpieces or articles from parts, e.g. to form tipped tools {(B22F7/002 takes precedence)} · CPC title

  • Refractory metals · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10556832B2 cover?
Superabrasive compacts and methods of making superabrasive compacts are disclosed. A superabrasive compact includes a polycrystalline diamond table and a substrate attached to the polycrystalline diamond table. The substrate includes a hard metal carbide and a binder having a compound with a composition of AxByCz, where A and B are transition metals, where C is carbon, and where 0≤x≤7, 0≤y≤7, x…
Who is the assignee on this patent?
Diamond Innovations Inc
What technology area does this patent fall under?
Primary CPC classification B22F3/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).