Additive manufacturing system for minimizing thermal stresses

US10556270B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10556270-B2
Application numberUS-201514689845-A
CountryUS
Kind codeB2
Filing dateApr 17, 2015
Priority dateMay 1, 2014
Publication dateFeb 11, 2020
Grant dateFeb 11, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A build plate for an additive manufacturing system is disclosed. The build plate includes a support structure, a sub-plate, and one or more transducers. The support structure is configured to support a stack of sintered layers of a pulverant material. Further, the support structure extends orthogonally to a build direction. The sub-plate is arranged along the support structure, and defines a transducer cavity. One or more transducers are arranged in the transducer cavities. The one or more transducers are operable to cause vibration of the support structure and the stack parallel to the build direction. Such vibration relieves internal stresses caused by sintering of the stack.

First claim

Opening claim text (preview).

The invention claimed is: 1. A build plate for an additive manufacturing system, the build plate comprising: a support structure configured to support a stack of sintered layers of a pulverant material, the support structure extending orthogonally to a build direction; a sub-plate arranged along the support structure, the sub-plate defining a transducer cavity; one or more ultrasonic transducers arranged in the transducer cavity, wherein the one or more ultrasonic transducers are operable to propagate ultrasonic waves through the support structure and the stack while the pulverant material is being sintered to provide Ultrasonic Impact Treatment (UIT) of the stack by creating standing waves within the stack to relieve internal stresses caused by sintering of the stack. 2. The build plate of claim 1 , wherein the one or more ultrasonic transducers are arranged throughout the sub-plate in a pattern corresponding to a shape of the stack. 3. The build plate of claim 1 , wherein the one or more ultrasonic transducers include a pin oriented in the build direction. 4. The build plate of claim 1 , wherein the build plate is coupled to a platform that is movable parallel to the build direction. 5. The build plate of claim 1 , wherein: the one or more ultrasonic transducers are each operable within a range of ultrasonic frequencies, and/or; the one or more ultrasonic transducers are each operable within a range of amplitudes. 6. The build plate of claim 5 , wherein an operating ultrasonic frequency and/or an operating amplitude of the one or more transducers are selected based on a shape of the stack. 7. An additive manufacturing system comprising: a pulverant material supply system configured to provide a pulverant material to a working surface; a movable platform movable parallel to a build direction; a build plate arranged on the movable platform, the build plate being movable from the working surface along with the movable platform, the build plate including one or more ultrasonic transducers operable to propagate ultrasonic waves through the build plate and the pulverant material parallel to the build direction while the pulverant is being sintered to provide Ultrasonic Impact Treatment (UIT) of the sintered pulverant material by creating standing waves within the sintered pulverant material to relieve internal stresses caused by sintering of the pulverant material; and a radiation system configured to provide a radiation beam to selectively sinter the pulverant material at the working surface to form a stack of sintered layers. 8. The additive manufacturing system of claim 7 , wherein the one or more ultrasonic transducers are arranged throughout the build plate in a pattern corresponding to a shape of the stack. 9. The additive manufacturing system of claim 7 , wherein the one or more ultrasonic transducers include a pin oriented in the build direction. 10. The additive manufacturing system of claim 7 , wherein: the one or more ultrasonic transducers are each operable within a range of ultrasonic frequencies, and/or; the one or more ultrasonic transducers are each operable within a range of amplitudes. 11. The additive manufacturing system of claim 10 , wherein an operating ultrasonic frequency and/or an operating amplitude of the one or more ultrasonic transducers is selected based on a shape of the stack. 12. The additive manufacturing system of claim 7 , wherein the pulverant material supply system includes a recoater blade. 13. The additive manufacturing system of claim 7 , wherein the radiation source is a laser. 14. The additive manufacturing system of claim 7 , wherein: the stack of layers of sintered pulverant material is arranged between the build plate and the working surface; and one or more retractable ultrasonic transducers are coupled to the stack of layers of sintered pulverant material. 15. The additive manufacturing system of claim 14 , wherein the one or more retractable transducers are operable to produce UIT of the stack.

Assignees

Inventors

Classifications

  • Aspects linked to processes or compositions used in powder metallurgy · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Apparatus, e.g. furnaces (in general F27B) · CPC title

  • Processes of additive manufacturing · CPC title

  • B22F3/1055Primary

    Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US10556270B2 cover?
A build plate for an additive manufacturing system is disclosed. The build plate includes a support structure, a sub-plate, and one or more transducers. The support structure is configured to support a stack of sintered layers of a pulverant material. Further, the support structure extends orthogonally to a build direction. The sub-plate is arranged along the support structure, and defines a tr…
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification B22F3/1055. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 11 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).