Microphone with encapsulated moving electrode

Patent metadata

Field	Value
Publication number	US-10555090-B2
Application number	US-201816000593-A
Country	US
Kind code	B2
Filing date	Jun 5, 2018
Priority date	Jun 5, 2017
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.

First claim

What is claimed is:

1. A Microelectromechanical System (MEMS) microphone system comprising:
a package housing having a first cavity; and
a MEMS sensor disposed within the cavity of the package housing, the MEMS sensor comprising:
a substrate;
a first movable membrane and a second movable membrane spaced apart from the first movable membrane, wherein the first and second movable membranes are arranged above the substrate;
a plug; and
an access channel to a second cavity located between the first and second movable membranes and formed through at least one of the first movable membrane or the second movable membrane, the access channel configured to receive at least a portion of the plug therein.

2. The MEMS microphone system of claim 1 , the MEMS sensor further comprising a vacuum formed in the second cavity, the vacuum having a pressure different from the first cavity.

3. The MEMS microphone system of claim 2 further comprising an assembly formed in the second cavity.

4. The MEMS microphone system of claim 3 , the assembly comprising:
a plurality of connections; and
a plurality of posts.

5. The MEMS microphone system of claim 4 , the assembly further comprising a coupling configured to stiffen the first and second movable membranes.

6. The MEMS microphone system of claim 5 wherein the first and second movable membranes comprise respective central portions above a hole in the substrate portion and the coupling is located between the respective central portions.

7. The MEMS microphone system of claim 2 , the MEMS sensor further comprising an electrode assembly having a movable electrode and a stationary electrode.

8. The MEMS microphone system of claim 7 wherein the movable electrode is mechanically coupled to at least one of the first movable membrane and the second movable membrane.

9. The MEMS microphone system of claim 8 wherein the movable electrode overlaps the stationary electrode.

10. The MEMS microphone system of claim 7 wherein the movable electrode is formed between the first and second movable membranes.

11. The MEMS microphone system of claim 10 wherein the first and second movable membranes comprise a respective central portion above a hole in the substrate and the movable electrode is located between the respective central portions.

12. The MEMS microphone system of claim 7 , the electrode assembly further comprising a stationary counter electrode.

13. The MEMS microphone system of claim 12 wherein the stationary counter electrode is disposed above the movable electrode.

14. The MEMS microphone system of claim 12 wherein the stationary counter electrode forms part of at least one of the first or the second movable membrane.

15. A Microelectromechanical System (MEMS) microphone comprising:
a substrate;
a first movable membrane and a second movable membrane spaced apart from the first movable membrane, wherein the first and second movable membranes are arranged above the substrate;
a plug; and
an access channel formed through at least one of the first or the second movable membranes, the access channel opening to a cavity located between the first and second movable membranes and configured to receive at least a portion of the plug therein.

16. The MEMS microphone of claim 15 further comprising a vacuum formed in the cavity, the vacuum having a pressure.

17. The MEMS microphone of claim 16 wherein the pressure of the vacuum is different from a pressure outside the MEMS microphone.

18. The MEMS microphone of claim 15 further comprising an assembly formed in the cavity.

19. The MEMS microphone system of claim 18 , the assembly comprising:
a plurality of connections; and
a plurality of posts.

20. The MEMS microphone system of claim 18 , the assembly comprising a coupling configured to stiffen the first and second movable membranes at allocation directly above a hole in the substrate.

Assignees

• Akustica Inc
• Bosch Gmbh Robert

Inventors

• Reinmuth Jochen
• Rajaraman Vijaye
• Meisel Daniel
• Gehl Bernhard

Classifications

• H04R2201/003

  Mems transducers or their use · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R7/04

  Plane diaphragms · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title