Apparatus for manufacturing thermoelectric module

US10553772B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10553772-B2
Application numberUS-201615156685-A
CountryUS
Kind codeB2
Filing dateMay 17, 2016
Priority dateMar 29, 2016
Publication dateFeb 4, 2020
Grant dateFeb 4, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for manufacturing a thermoelectric module in which a thermoelectric element is disposed between a lower substrate with a lower electrode and an upper substrate with an upper electrode, the apparatus comprising: a first block configured to support the lower substrate; a second block configured to move vertically with respect to the first block and support the upper substrate; a jig configured to position the thermoelectric element in connection with the upper electrode and the lower electrode; a shielding wall installed on an exterior side surface of the first block and the second block; a first heater embedded within the first block, the first heater configured to apply heat to a first bonding material disposed between the lower electrode and the thermoelectric element; and a second heater embedded within the second block, the second heater configured to apply heat to a second bonding material disposed between the upper electrode and the thermoelectric element, wherein the first heater extends in a direction parallel to a longitudinal axis of the lower substrate, and the second heater extends in a direction parallel to a longitudinal axis of the upper substrate, wherein the first block has a seating groove configured to receive the lower substrate, and wherein the first block has a guide portion formed to protrude around the seating groove. 2. The apparatus according to claim 1 , wherein the jig includes a slot to receive the thermoelectric element. 3. The apparatus according to claim 2 , wherein the jig includes a plurality of jigs vertically arranged, and the slots of the plurality of jigs are arranged to intersect with each other at a predetermined angle and the slots have an overlapping area with each other. 4. The apparatus according to claim 1 , wherein the second block has a seating groove configured to receive the upper substrate. 5. The apparatus according to claim 1 , wherein a guide structure configured to guide a vertical movement of the second block is installed between the first block and the second block, and the guide structure has a one guide bar that extends in an upward direction from the first block and a guide aperture formed in the second block. 6. An apparatus for manufacturing a thermoelectric module including a lower substrate, a lower electrode, a thermoelectric element, an upper electrode, and an upper substrate, the apparatus comprising: a first block configured to support the lower substrate; a second block spaced apart from an upper part of the first block and configured to press the upper substrate to the lower substrate; a jig configured to position the thermoelectric element between the first block and the second block and retain the positioned state thereof; a first heater embedded within the first block, the first heater configured to apply heat to a first bonding material disposed between the lower electrode and the thermoelectric element; a second heater embedded within the second block, the second heater configured to apply heat to a second bonding material disposed between the upper electrode and the thermoelectric element; and a shielding wall installed on an exterior side surface of the first block and the second block, wherein the first heater extends in a direction parallel to a longitudinal axis of the lower substrate, and the second heater extends in a direction parallel to a longitudinal axis of the upper substrate, wherein the first block has a seating groove configured to receive the lower substrate, and wherein the first block has a guide portion formed to protrude around the seating groove. 7. The apparatus according to claim 6 , wherein the jig includes a first jig having a first slot that extends along a first direction and a second jig having a second slot that extends along a second direction, and the first jig and the second jig are arranged to intersect the first slot and the second slot with each other at a predetermined angle. 8. The apparatus according to claim 7 , wherein both ends of the first jig include a pair of first steps configured to be inserted into an edge of the second jig. 9. The apparatus according to claim 7 , wherein both ends of the second jig are provided with a pair of second steps configured to be inserted into an edge of the first jig.

Assignees

Inventors

Classifications

  • Electricity · mapped topic

  • Electricity · mapped topic

  • H01L35/34Primary

    Electricity · mapped topic

  • Constructional details · CPC title

  • characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

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Frequently asked questions

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What does patent US10553772B2 cover?
An apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertical…
Who is the assignee on this patent?
Hyundai Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01L35/34. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).