Methods of forming a silicon layer, methods of forming patterns, and methods of manufacturing semiconductor devices using the same

Patent metadata

Field	Value
Publication number	US-10553449-B2
Application number	US-201715700491-A
Country	US
Kind code	B2
Filing date	Sep 11, 2017
Priority date	Oct 12, 2016
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

A method of forming a pattern includes forming an etch target layer on a substrate, forming sacrificial patterns on the etch target layer, the sacrificial patterns including a carbon-containing material, providing a silicon-sulfur compound or a sulfur-containing gas onto the sacrificial patterns to form a seed layer, providing a silicon precursor onto the seed layer to form silicon-containing mask patterns, and at least partially etching the etch target layer using the mask patterns.

First claim

What is claimed is:

1. A method of forming a silicon layer, the method comprising:
providing a silicon-sulfur compound or a sulfur-containing gas onto a carbon-containing material layer to form a seed layer; and
providing a silicon precursor onto the seed layer to form the silicon layer.

2. The method as claimed in claim 1 , wherein the silicon-sulfur compound includes a compound represented by at least one of the following Chemical Formulae 1 to 4,

wherein in Chemical Formulae 1 to 4,
R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are independently selected from R 7 , R 8 , —SR 7 , —NR 7 R 8 , —OR 7 , —SiR 7 , and —R 9 SR 8 , in which R 7 and R 8 are independently selected from hydrogen, halogen, C 1 -C 10 alkyl, C 3 -C 10 alkenyl, C 3 -C 10 alkynyl, C 6 -C 10 aryl, C 3 -C 10 heteroaryl, C 3 -C 10 cycloalkyl, C 3 -C 10 cycloalkenyl, C 3 -C 10 cycloalkynyl, C 3 -C 10 heterocycloalkyl, or a combination thereof, and R 9 is a divalent group of C 1 -C 10 alkyl, C 3 -C 10 alkenyl, C 3 -C 10 alkynyl, C 6 -C 10 aryl, C 3 -C 10 heteroaryl, C 3 -C 10 cycloalkyl, C 3 -C 10 cycloalkenyl, C 3 -C 10 cycloalkynyl, C 3 -C 10 heterocycloalkyl, or a combination thereof, provided that,
in Chemical Formula 1, at least one of R 1 , R 2 , R 3 , and R 4 is —SR 7 ,
in Chemical Formula 2, at least one of R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 is —SR 7 , and
in Chemical Formula 4, R 10 and R 11 are independently a single bond or a divalent group of C 1 -C 10 alkyl, C 3 -C 10 alkenyl, C 3 -C 10 alkynyl, C 6 -C 10 aryl, C 3 -C 10 heteroaryl, C 3 -C 10 cycloalkyl, C 3 -C 10 cycloalkenyl, C 3 -C 10 cycloalkynyl, C 3 -C 10 heterocycloalkyl, or a combination thereof, and n is an integer of 1 or more.

3. The method as claimed in claim 1 , wherein the silicon-sulfur compound includes at least two sulfur atoms.

4. The method as claimed in claim 1 , wherein the sulfur-containing gas includes hydrogen sulfide.

5. The method as claimed in claim 1 , wherein forming the seed layer includes pyrolyzing the silicon-sulfur compound to form an active silicon intermediate material.

6. The method as claimed in claim 5 , wherein the active silicon intermediate material includes a silicon-sulfur double bond or a silicon-sulfur cyclic structure.

7. The method as claimed in claim 1 , wherein forming the silicon layer includes providing a reaction gas together with the silicon precursor, the reaction gas including at least one of oxygen and nitrogen, and wherein the silicon layer includes at least one of silicon oxide, silicon nitride, and silicon oxynitride.

8. The method as claimed in claim 1 , wherein forming the silicon layer includes providing a dopant gas together with the silicon precursor, and wherein the silicon layer includes doped polysilicon.

9. The method as claimed in claim 8 , wherein the dopant gas includes boron or phosphorus.

10. The method as claimed in claim 1 , wherein forming the seed layer includes pyrolyzing a volatilized compound including a silicon-sulfur-silicon linkage to form a reactive silicon-sulfur species, the silicon-sulfur species being reacted with an exposed surface of the carbon-containing material layer to form a sulfur-containing surface, after which the silicon precursor is provided to the sulfur-containing surface.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Hwang Sun-Hye
• Cho Youn-Joung
• Chung Won-Woong
• Kim Nam-Gun
• Lee Kong-Soo
• Im Badro
• Cho Yoon-Chul

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P50/695

  characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P14/416

  of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers · CPC title