Transparent conductive films with embedded metal grids

Patent metadata

Field	Value
Publication number	US-10550490-B2
Application number	US-201615097919-A
Country	US
Kind code	B2
Filing date	Apr 13, 2016
Priority date	May 22, 2015
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

A transparent conductive film with a metal mesh embedded in a substrate and a method of fabrication thereof is provided. The metal mesh has a cap that is pressed and embedded in a substrate or a deformable material on a substrate, providing superior mechanical stability by mechanical interlocking. The embedding mechanism also provides superior chemical and environmental stability. A fabrication method is provided and includes a vacuum-free and low-cost process for large-volume manufacturing of the transparent conductive film with tunable performance.

First claim

What is claimed is:

1. A transparent conductive film, comprising:
a transparent substrate; and
a metal mesh comprising a plurality of metal lines embedded in the transparent substrate,
wherein the metal mesh has a cap embedded in the substrate, the cap being disposed between two metal lines, of the plurality of metal lines, respectively extending away from the cap,
wherein the cap has a linewidth that is 1.2 to 1.5 times greater than the linewidth of each of the two metal lines extending away from the cap,
wherein a side surface of the metal mesh is entirely embedded in the transparent substrate such that the side surface of the metal mesh is not exposed, and
wherein the transparent substrate is a thermoplastic film such that the metal mesh is pressed into the transparent substrate when heated.

2. The transparent conductive film according to claim 1 , wherein the transparent substrate is a flexible plastic film.

3. The transparent conductive film according to claim 1 , further comprising a rigid glass panel on which the transparent substrate is disposed.

4. The transparent conductive film according to claim 2 , wherein a surface of the cap has a rounded shape.

5. The transparent conductive film according to claim 1 , wherein the transparent substrate is a cyclic olefin copolymer film.

6. The transparent conductive film according to claim 1 , wherein the transparent substrate is an ultraviolet light curable material.

7. The transparent conductive film according to claim 1 , wherein the metal grid lines have a linewidth between 100 nm and 5000 nm, a grid opening size between 1 μm and 100 μm, and the ratio between the grid opening and the linewidth is between 5 and 100.

8. The transparent conductive film according to claim 1 , wherein the metal mesh is tapered in a direction that is opposite the cap.

9. The transparent conductive film according to claim 1 , wherein a linewidth of the metal grid gradually increases going away from the cap in one direction.

10. The transparent conductive film according to claim 1 , wherein a side of the metal grid is flush with the transparent substrate.

11. The transparent conductive film according to claim 1 , wherein a height of the metal grid is from 0.3 to 3 times its linewidth.

12. The transparent conductive film according to claim 1 , wherein the metal grid is made of one of copper, gold, silver, nickel, zinc, tin, and alloy of any of these metals.

13. A transparent conductive film, comprising:
a transparent substrate; and
a metal mesh that is embedded in the transparent substrate, the metal mesh comprising a plurality of metal lines,
wherein the metal mesh has a portion that is suitable for anchoring the metal mesh in the substrate,
wherein the portion of the metal mesh is disposed between two metal lines, of the plurality of metal lines, respectively extending away from the portion,
wherein the portion of the metal mesh has a linewidth that is 1.2 to 1.5 times greater than the linewidth of each of the two metal lines extending away from the portion,
wherein a side surface of the metal mesh is entirely embedded in the transparent substrate such that the side surface of the metal mesh is not exposed, and
wherein the transparent substrate is a thermoplastic film such that the metal mesh is pressed into the transparent substrate when heated.

14. The transparent conductive film of claim 13 , wherein the metal mesh has an exposed top surface.

15. The transparent conductive film of claim 14 , wherein a linewidth of the mesh decreases going towards the exposed top surface.

Assignees

• Versitech Ltd

Inventors

• Li Wendi
• Khan Arshad

Classifications

• H01B13/0026

  Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal · CPC title

• H01B1/02

  mainly consisting of metals or alloys · CPC title

• C25D1/04

  Wires; Strips; Foils · CPC title

• C25D5/48

  After-treatment of electroplated surfaces · CPC title

• C25D1/08

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title