Core-shell, oxidation-resistant, electrically conducting particles for low temperature conductive applications

US10550291B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10550291-B2
Application numberUS-201615243847-A
CountryUS
Kind codeB2
Filing dateAug 22, 2016
Priority dateAug 25, 2015
Publication dateFeb 4, 2020
Grant dateFeb 4, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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Oxidation-resistant electrically-conductive metal particles (ORCMP) are disclosed. ORCMPs are comprised of a base-metal core, an oxidation-resistant first shell, and an optional conductive second shell. ORCMPs are low cost alternatives to silver particles in metal fillers for low-temperature, electrically-conductive adhesives. Adhesives including ORCMPs, organic vehicles, and optional conductive metal particles such as silver were formulated to yield conductive films upon curing at low temperatures. Such films can be used in many electronic devices where low-temperature, low cost films are needed.

First claim

Opening claim text (preview).

We claim: 1. An electrically-conductive film comprising: a plurality of oxidation-resistant, core-shell metal particles, each oxidation-resistant core-shell metal particle comprising: a base-metal core particle; and a first shell coating the base-metal core particle, the first shell comprising a nickel alloy; and a plurality of silver particles; wherein the core-shell metal particles and the silver particles are interspersed in an organic matrix. 2. The electrically-conductive film of claim 1 , wherein base-metal core particle comprises a material selected from the group consisting of aluminum, copper, tin, zinc, antimony, nickel, cobalt, magnesium, molybdenum, tungsten, tantalum, iron, and alloys, composites, and other combinations thereof. 3. The electrically-conductive film of claim 1 , wherein the oxidation-resistant, core-shell metal particles are spherical and have a D50 between 100 nm and 5 μm. 4. The electrically-conductive film of claim 1 , wherein the oxidation-resistant, core-shell metal particles have flake shapes that are 1-100 μm wide and less than 500 nm thick, on average. 5. The electrically-conductive adhesive of claim 1 , wherein the nickel alloy contains less than 15 wt % of a metal selected from the group consisting of copper, tin, zinc, lead, bismuth, antimony, cobalt, iron, boron, phosphorus, magnesium, molybdenum, manganese, tungsten, tantalum, and composites, and other combinations thereof. 6. The electrically-conductive film of claim 1 , wherein the nickel alloy comprises a nickel-boron alloy with a boron content between 0.1 and 10 wt %. 7. The electrically-conductive film of claim 1 , wherein the first shell has a thickness less than 500 nm. 8. The electrically-conductive film of claim 1 , wherein the oxidation-resistant, core-shell metal particles comprise between 5 and 75 wt % of the electrically-conductive film. 9. The electrically-conductive film of claim 1 , further comprising a second shell coating the first shell, the second shell comprising silver. 10. An electrically-conductive adhesive comprising: a plurality of oxidation-resistant, core-shell metal particles, each oxidation-resistant, core-shell metal particle comprising; a base-metal core particle; and a first shell coating the base-metal core particle, the first shell comprising a nickel alloy; a plurality of silver particles; and an organic vehicle, comprising: a curable resin; a curing agent; and a solvent; wherein the oxidation-resistant, core-shell metal particles and the silver particles are mixed together in the organic vehicle. 11. The electrically-conductive adhesive of claim 10 , wherein base-metal core particle comprises a metal selected from the group consisting of aluminum, copper, tin, zinc, antimony, nickel, cobalt, magnesium, molybdenum, tungsten, tantalum, iron, and alloys, composites, and other combinations thereof. 12. The electrically-conductive adhesive of claim 10 , wherein the oxidation-resistant core-shell metal particles are spherical and have a D50 between 100 nm and 100 μm. 13. The electrically-conductive adhesive of claim 10 , wherein the oxidation-resistant core-shell metal particles have flake shapes that are 1-100 μm wide and less than 500 nm thick, on average. 14. The electrically-conductive adhesive of claim 10 , wherein the first shell comprises a nickel alloy that contains less than 15 wt % of a metal selected from the group consisting of copper, tin, zinc, lead, bismuth, antimony, cobalt, iron, boron, phosphorus, magnesium, molybdenum, manganese, tungsten, tantalum, and composites, and other combinations thereof, and the balance being nickel. 15. The electrically-conductive adhesive of claim 10 , wherein the first shell is less than 500 nm thick. 16. The electrically-conductive adhesive of claim 10 , wherein the oxidation-resistant, core-shell metal particle further comprises a second shell coating the first shell, the second shell comprising a metal selected from the group consisting of silver, copper, aluminum, tungsten, zinc, nickel, platinum, titanium, tin, gold, and alloys, composites, and other combinations thereof. 17. The electrically-conductive adhesive of claim 16 , wherein the second shell is less than 1000 nm thick. 18. The electrically-conductive adhesive of claim 10 , wherein the oxidation-resistant core-shell metal particles and silver particles comprise between 5 and 65 wt % of the electrically-conductive adhesive. 19. The electrically-conductive adhesive of claim 10 , wherein the silver particles comprise less than 30 wt % of the electrically-conductive adhesive. 20. An electrically-conductive film comprising: a plurality of oxidation-resistant core-shell metal particles, each oxidation-resistant core-shell metal particle comprising: a base-metal core particle; a first shell coating the base-metal core particle, the first shell comprising a nickel alloy; and a second shell coating the first shell, the second shell comprising silver; and silver particles; wherein the core-shell metal particles and the silver particles are mixed together in an organic vehicle. 21. The electrically-conductive film of claim 20 , wherein base-metal core particle comprises a material selected from the group consisting of aluminum, copper, tin, zinc, antimony, nickel, cobalt, magnesium, molybdenum, tungsten, tantalum, iron, and alloys, composites, and other combinations thereof. 22. The electrically-conductive adhesive of claim 20 , wherein the nickel alloy contains less than 15 wt % of a metal selected from the group consisting of copper, tin, zinc, lead, bismuth, antimony, cobalt, iron, boron, phosphorus, magnesium, molybdenum, manganese, tungsten, tantalum, and composites, and other combinations thereof. 23. The electrically-conductive film of claim 20 , wherein the nickel alloy comprises a nickel-boron alloy with a boron content between 0.1 and 10 wt %. 24. The electrically-conductive film of claim 20 , wherein the first shell has a thickness less than 500 nm. 25. The electrically-conductive film of claim 20 , wherein the second shell is less than 1000 nm thick. 26. The electrically-conductive film of claim 20 , wherein the oxidation-resistant core-shell metal particles and the silver particles comprise between 5 and 65 wt % of the electrically-conductive film. 27. The electrically-conductive film of claim 20 , wherein the silver particles comprise less than 30 wt % of the film.

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What does patent US10550291B2 cover?
Oxidation-resistant electrically-conductive metal particles (ORCMP) are disclosed. ORCMPs are comprised of a base-metal core, an oxidation-resistant first shell, and an optional conductive second shell. ORCMPs are low cost alternatives to silver particles in metal fillers for low-temperature, electrically-conductive adhesives. Adhesives including ORCMPs, organic vehicles, and optional conductiv…
Who is the assignee on this patent?
Hitachi Chemical Co Ltd
What technology area does this patent fall under?
Primary CPC classification C09J9/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 04 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).