Copper/ceramic bonded body and insulating circuit substrate
US-2024203819-A1 · Jun 20, 2024 · US
US10549371B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10549371-B2 |
| Application number | US-201615064653-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 9, 2016 |
| Priority date | Sep 20, 2013 |
| Publication date | Feb 4, 2020 |
| Grant date | Feb 4, 2020 |
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A method of manufacture of a ceramic metallization for ceramic metal transition, and ceramic metal transition itself, for the use in low, medium and high-voltage techniques, which may avoid a brazing foil, and/or overcome problems with the use of thin brazing foils, and/or to make the manufacture easier, but also more effective, wherein, on top of the Ni-layer will be placed an Ag-layer as a third layer, and then the metal part will be laid on top and connected by brazing or tempering.
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The invention claimed is: 1. A method of manufacturing a ceramic metallization for a ceramic metal transition for use with components of a low-, medium-, and/or high-voltage device, switch, or switching unit by which a ceramic body is connected to a metal part, the method comprising: covering a ceramic body, comprising a Al 2 O 3 material, with at least a first layer comprising MoMn and a second layer comprising Ni; placing a third layer comprising Ag on top of the second layer; laying the metal part on top of the third layer; and connecting the metal part to one or more of the first, second, and third layers at a connecting region, wherein the connecting comprises brazing, and the brazing comprises in-situ tempering under an inert gas environment, and wherein the connecting takes place at a temperature above an alloying point so as to provide an in-situ alloying process by diffusion of metals in the connecting region. 2. The method of claim 1 , wherein the ceramic body mainly comprises the Al 2 O 3 material. 3. The method of claim 1 , wherein the connecting connects the metal part to the ceramic body. 4. The method of claim 1 , wherein the first layer mainly comprises MoMn. 5. The method of claim 1 , wherein the first layer comprises tungsten. 6. The method of claim 1 , wherein the second layer mainly comprises Ni. 7. The method of claim 1 , wherein the third layer mainly comprises Ag. 8. The method of claim 1 , wherein the placing of the third layer is at least partially carried out galvanically. 9. The method of claim 1 , wherein the placing of the third layer is at least partially carried out by cold gas spraying. 10. A method of manufacturing a ceramic metallization for a ceramic metal transition for use with components of a low-, medium-, and/or high-voltage device, switch, or switching unit by which a ceramic body is connected to a metal part, the method comprising: covering a ceramic body, comprising a Al 2 O 3 material, with at least a first layer comprising MoMn and a second layer comprising Ni; placing a third layer comprising Ag on top of the second layer; laying the metal part on top of the third layer; and connecting the metal part to one or more of the first, second, and third layers at a connecting region, wherein the connecting comprises brazing, and the brazing comprises in-situ tempering under an active gas environment, and wherein the connecting takes place at a temperature above an alloying point so as to provide an in-situ alloying process by diffusion of metals in the connecting region. 11. A method of manufacturing a ceramic metallization for a ceramic metal transition for use with components of a low-, medium-, and/or high-voltage device, switch, or switching unit by which a ceramic body is connected to a metal part, the method comprising: covering a ceramic body, comprising a Al 2 O 3 material, with at least a first layer comprising MoMn and a second layer comprising Ni; placing a third layer comprising Ag on top of the second layer; laying the metal part on top of the third layer; and connecting the metal part to one or more of the first, second, and third layers at a connecting region, wherein the connecting comprises brazing, and the brazing comprises in-situ tempering under a hydrogen environment, and wherein the connecting takes place at a temperature above an alloying point so as to provide an in-situ alloying process by diffusion of metals in the connecting region.
based on noble metals, e.g. silver · CPC title
including at least one metal alloy layer · CPC title
Alumina or aluminates · CPC title
for welded joints · CPC title
consisting of metals or metal salts · CPC title
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