Multi-component adhesive for producing an adhesive hydrogel
US-2016130484-A1 · May 12, 2016 · US
Tape adhesive for an insulating tape in an insulation system and an insulation system
US10544338B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10544338-B2 |
| Application number | US-201615560652-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2016 |
| Priority date | Mar 24, 2015 |
| Publication date | Jan 28, 2020 |
| Grant date | Jan 28, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Tape adhesives suitable for impregnating processes for insulation systems are described. Embodiments of the tape adhesives include solid insulation material such as mica, anhydride-free impregnating resins and accelerators for the anhydride-free impregnating resins. The tape adhesives may be adjusted with respect to the reactivity of the accelerators for the anhydride-free impregnating resins in relation for the storage stability of the overall insulation systems.
First claim
Opening claim text (preview).
What is claimed is: 1. An insulation system comprising a solid insulation material, an anhydride-free impregnating resin, an accelerator, and an oxirane group free tape adhesive having a viscosity of about 5 to about 20 Pa*s at about 70° C., wherein the tape adhesive comprises an addition product formed from an A(OH) n segment comprising bisphenols, diols, triols, and/or higher alcohols, with a Cy segment comprising at least one compound selected from the group consisting of a cyclohexene oxide and a cyclohexene oxide derivative. 2. The system of claim 1 , wherein the accelerator comprises a tri-N-methylpiperazine derivative of trimethylolpropane trimethacrylate. 3. The system of claim 1 , wherein the tape adhesive is present together with the accelerator in a blend, wherein the blend comprises from about 50% to about 99.5% tape adhesive by weight. 4. The system of claim 1 , wherein the tape adhesive is present together with the accelerator in a blend, wherein the blend comprises from about 60% to about 95% tape adhesive by weight. 5. The system of claim 1 , wherein the tape adhesive is present together with the accelerator in a blend, wherein the blend comprises from about 70% to about 90% tape adhesive by weight. 6. The system of claim 1 , wherein the solid insulation material comprises mica. 7. An insulation system comprising a solid insulation material comprising mica, an anhydride-free impregnating resin, an accelerator comprising a tri-N-methylpiperazine derivative of trimethylolpropane trimethacrylate, and an oxirane group free tape adhesive having a viscosity of about 5 to about 20 Pa*s at about 70° C., wherein the tape adhesive comprises an addition product formed from an A(OH) n segment comprising bisphenols, diols, triols, and/or higher alcohols, with a Cy segment comprising at least one compound selected from the group consisting of a cyclohexene oxide and a cyclohexene oxide derivative. 8. The system of claim 7 , wherein the tape adhesive is present together with the accelerator in a blend, wherein the blend comprises from about 50% to about 99.5% tape adhesive by weight. 9. The system of claim 7 , wherein the tape adhesive is present together with the accelerator in a blend, wherein the blend comprises from about 60% to about 95% tape adhesive by weight. 10. The system of claim 7 , wherein the tape adhesive is present together with the accelerator in a blend, wherein the blend comprises from about 70% to about 90% tape adhesive by weight.
Assignees
Inventors
Classifications
epoxy resins · CPC title
Polyethers · CPC title
- C09J171/02Primary
Polyalkylene oxides · CPC title
containing aromatic or arylaliphatic hydroxyl groups · CPC title
containing hydroxyl groups · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10544338B2 cover?
- Tape adhesives suitable for impregnating processes for insulation systems are described. Embodiments of the tape adhesives include solid insulation material such as mica, anhydride-free impregnating resins and accelerators for the anhydride-free impregnating resins. The tape adhesives may be adjusted with respect to the reactivity of the accelerators for the anhydride-free impregnating resins i…
- Who is the assignee on this patent?
- Siemens Ag
- What technology area does this patent fall under?
- Primary CPC classification C09J171/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).