Composition for pressure-sensitive adhesive, pressure-sensitive adhesive resin tape, and wire harness

US10544336B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10544336-B2
Application numberUS-201815954031-A
CountryUS
Kind codeB2
Filing dateApr 16, 2018
Priority dateApr 17, 2017
Publication dateJan 28, 2020
Grant dateJan 28, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a composition for a pressure-sensitive adhesive comprising 100 parts by mass (non-volatile fraction) of a main agent comprising a mixture of a natural rubber latex and a synthetic rubber latex, 40 to 120 parts by mass of a rosin-based tackifier resin having a softening point of 130 to 135° C. and 1 to 15 parts by mass of low-molecular-weight polyisoprene having a weight-average molecular weight of 15,000 to 40,000.

First claim

Opening claim text (preview).

What is claimed is: 1. A composition for a pressure-sensitive adhesive, comprising: 100 parts by mass (non-volatile fraction) of a main agent comprising a mixture of a natural rubber latex and a synthetic rubber latex; 60 to 100 parts by mass of a rosin-based tackifier resin having a softening point of 130 to 135° C.; and 3 to 7 parts by mass of low-molecular-weight polyisoprene having a weight-average molecular weight of 15,000 to 40,000. 2. A pressure-sensitive adhesive resin tape comprising: a pressure-sensitive adhesive layer; and a resin substrate, wherein the pressure-sensitive adhesive layer comprises the composition for a pressure-sensitive adhesive according to claim 1 . 3. The pressure-sensitive adhesive resin tape according to claim 2 , wherein the resin substrate comprises a polyvinyl chloride resin. 4. The pressure-sensitive adhesive resin tape according to claim 2 , wherein the pressure-sensitive adhesive layer has a thickness of 5 μm to 20 μm. 5. A wire harness comprising the pressure-sensitive adhesive resin tape according to claim 2 .

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What does patent US10544336B2 cover?
The present invention relates to a composition for a pressure-sensitive adhesive comprising 100 parts by mass (non-volatile fraction) of a main agent comprising a mixture of a natural rubber latex and a synthetic rubber latex, 40 to 120 parts by mass of a rosin-based tackifier resin having a softening point of 130 to 135° C. and 1 to 15 parts by mass of low-molecular-weight polyisoprene having …
Who is the assignee on this patent?
Yazaki Corp
What technology area does this patent fall under?
Primary CPC classification C09J107/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).