Heat conductive paste and method for producing the same

Patent metadata

Field	Value
Publication number	US-10544334-B2
Application number	US-201615548614-A
Country	US
Kind code	B2
Filing date	Feb 1, 2016
Priority date	Feb 4, 2015
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

A heat conductive paste including silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5, an aliphatic primary amine and a compound having at least one phosphoric acid group. The heat conductive paste includes 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group based on 100 parts by mass of the silver fine particles. The heat conductive paste has a high conductivity.

First claim

The invention claimed is:

1. A heat conductive paste comprising:
silver fine particles having an average particle diameter of primary particles of 40 to 350 nm, a crystallite diameter of 20 to 70 nm, and a ratio of the average particle diameter to the crystallite diameter of 1 to 5,
an aliphatic primary amine, which is coordinated around the silver fine particles, and
a compound having at least one phosphoric acid group.

2. The heat conductive paste according to claim 1 , wherein the paste contains 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group, based on 100 parts by mass of the silver fine particles.

3. The heat conductive paste according to claim 1 , which is produced by:
mixing a silver salt of a carboxylic acid and the aliphatic primary amine, then,
adding a reducing agent thereto, to produce a reaction mixture containing the silver fine particles, and
mixing the compound having at least one phosphoric acid group with the reaction mixture containing the silver fine particles.

4. The heat conductive paste according to claim 1 , wherein the compound having at least one phosphoric acid group is at least one substance selected from the group consisting of a phosphoric acid, a pyrophosphoric acid, a polyphosphoric acid, a salt of a phosphoric acid, a salt of a pyrophosphoric acid, a salt of a polyphosphoric acid and a phosphoric acid-based surfactant.

5. The heat conductive paste according to claim 1 , wherein the compound having at least one phosphoric acid group is a compound represented by the following formula (I):

wherein m is 1 to 10.

6. The heat conductive paste according to claim 1 , wherein the aliphatic primary amine is at least one aliphatic primary amine selected from the group consisting of 2-methoxyethylamine, 3-methoxypropylamine, 3-ethoxypropylamine and 1, 2-diaminocyclohexane.

7. The heat conductive paste according to claim 1 , wherein the aliphatic primary amine is at least one aliphatic primary amine selected from the group consisting of 3-methoxypropylamine and 1, 2-diaminocyclohexane.

8. The heat conductive paste according to claim 1 , which is for die attachment of a semiconductor device.

9. The heat conductive paste according to claim 1 , which is for formation of a bump of a semiconductor device.

10. A semiconductor device comprising the heat conductive paste according to claim 1 for bonding parts.

11. A method for producing a heat conductive paste comprising the steps of:
(1) mixing a silver salt of a carboxylic acid and an aliphatic primary amine to form a mixture,
(2) adding a reducing agent to the mixture of step (1) at a reaction temperature of 20 to 80° C. to form a reaction mixture,
(3) separating layers of the reaction mixture of step (2) and recovering a layer containing silver fine particles with the aliphatic primary amine, which is coordinated around the silver fine particles, and
(4) mixing a compound having at least one phosphoric acid group with the layer containing the silver fine particles and the aliphatic primary amine coordinated around the silver fine particles.

12. The method for producing a heat conductive paste according to claim 11 , wherein a heat conductive paste containing 1 to 40 parts by mass of the aliphatic primary amine and 0.001 to 2 parts by mass of the compound having at least one phosphoric acid group, based on 100 parts by mass of the silver fine particles, is obtained.

13. The heat conductive paste according to claim 2 , wherein the compound having at least one phosphoric acid group is at least one substance selected from the group consisting of a phosphoric acid, a pyrophosphoric acid, a polyphosphoric acid, a salt of a phosphoric acid, a salt of a pyrophosphoric acid, a salt of a polyphosphoric acid and a phosphoric acid-based surfactant.

14. The heat conductive paste according to claim 2 , wherein the compound having at least one phosphoric acid group is a compound represented by the following formula (I):

wherein m is 1 to 10.

15. The heat conductive paste according to claim 2 , wherein the aliphatic primary amine is at least one aliphatic primary amine selected from the group consisting of 2-methoxyethylamine, 3-methoxypropylamine, 3-ethoxypropylamine and 1, 2-diaminocyclohexane.

16. The heat conductive paste according to claim 2 , wherein the aliphatic primary amine is at least one aliphatic primary amine selected from the group consisting of 3-methoxypropylamine and 1, 2-diaminocyclohexane.

17. The method for producing a heat conductive paste according to claim 11 , wherein the reducing agent is at least one reducing agent selected from a group consisting of formic acid, formaldehyde, ascorbic acid and hydrazine.

18. The method for producing a heat conductive paste according to claim 11 , wherein the silver salt of a carboxylic acid is at least one silver salt of a carboxylic acid, wherein the carboxylic acid is selected from a group consisting of acetic acid and propionic acid.

Assignees

• Namics Corp

Inventors

• Sasaki Koji
• Maruyama Hiroki

Classifications

• B22F9/24

  starting from liquid metal compounds, e.g. solutions · CPC title

• B22F2998/10

  Processes characterised by the sequence of their steps · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title