Soft hand copolyamide composition

Patent metadata

Field	Value
Publication number	US-10544263-B2
Application number	US-201515126492-A
Country	US
Kind code	B2
Filing date	Mar 5, 2015
Priority date	Mar 17, 2014
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

Composition comprising, on a weight basis, the total being equal to 100%:
from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 90 to about 150° C., in particular from about 100° C. to about 125° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,

for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

First claim

The invention claimed is:

1. A method of using a heat-sensitive adhesive in the textile industry, comprising the steps of:
a) forming a heat-sensitive adhesive composition of a HMA (hot-melt adhesive), consisting of on a weight basis, the total being equal to 100%:
from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 100° C. to about 125° C., and having a flexural modulus less than 100 MPa, as determined according to standard ISO 178 (2010); the said amide unit being 6/12, with a weight proportion of the long chain aliphatic repeat unit C12 of the amide unit being from 70% to 80%, the polyether units being derived from polytetramethtylene glycol (PTMG), the weight proportion of polyether units in the copolyamide being greater than 50%,
from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof wherein said heat-sensitive adhesive is selected from the group consisting a veil, a film, in granules, a filament, and a grate;

b) melting said heat-sensitive composition by heating;
c) applying said adhesive to two parts of a textile;
d) allowing said heat-sensitive adhesive composition to cool.

2. The method of claim 1 , wherein said method results in end-to-end bonding of the two parts of a textile.

3. The method of claim 1 , wherein said Method results in two parts of a textile joined together without stitching.

4. The method according to claim 1 , said adhesive having a thickness of from 5 to 30 micrometers for a veil, 20 to 100 micrometers for a film and 10 to 50 micrometers for a grate, and said adhesive having an adherence to a textile, of greater than 3 N/cm, as determined by the T peel test at 100 mm/min.

5. The method according to claim 4 , said adhesive having an adherence to a textile, of greater than 5 N/cm, as determined by the T peel test at 100 mm/min.

6. The method according to claim 4 , wherein the adherence is determined at a lamination temperature of from 120 to 180° C.

7. The method according to claim 1 , having a loss of adherence after at least two washes at 40° C. from about 2% to about 18%.

8. The method according to claim 1 having a loss of adherence after at least two washes at 60° C. from about 2% to about 30%.

Assignees

• Arkema France

Inventors

• Pineau Quentin
• D'Herbecourt Bruno

Classifications

• C08L77/12 Primary

  Polyester-amides · CPC title

• C09J177/00

  Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09J179/06; based on polyamide-imides C09J179/08); Adhesives based on derivatives of such polymers · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C09J177/12 Primary

  Polyester-amides · CPC title

• C08G69/40

  Polyamides containing oxygen in the form of ether groups (C08G69/12, C08G69/32 take precedence) · CPC title