Preparation and application of dicyclopentadiene-phenol and 2,6-dimethyl phenol copolymer epoxy resin

US10544254B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10544254-B2
Application numberUS-201715414582-A
CountryUS
Kind codeB2
Filing dateJan 24, 2017
Priority dateJan 24, 2017
Publication dateJan 28, 2020
Grant dateJan 28, 2020

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288° C. soldering test and 2 hours pressure cooking test.

First claim

Opening claim text (preview).

What we claimed is: 1. A dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin having the following Formula I: wherein, X is equal to an integer from 1-5, Y is equal to an integer from 1-5, and R represents hydrogen, C 1 -C 10 alkyl group, phenyl group, or phenyl hydroxyl group.

Assignees

Inventors

Classifications

  • Epoxynovolacs · CPC title

  • Epoxidised polymerised polyenes · CPC title

  • Diluents or solvents · CPC title

  • C09D5/18Primary

    Fireproof paints {including high temperature resistant paints} · CPC title

  • C08G59/063Primary

    with epihalohydrins · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10544254B2 cover?
This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) …
Who is the assignee on this patent?
Nanya Plastics Corp
What technology area does this patent fall under?
Primary CPC classification C09D5/18. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 28 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).