Microfluidic system with single drive signal for multiple nozzles

Patent metadata

Field	Value
Publication number	US-10543504-B2
Application number	US-201715636491-A
Country	US
Kind code	B2
Filing date	Jun 28, 2017
Priority date	Jun 20, 2014
Publication date	Jan 28, 2020
Grant date	Jan 28, 2020

Abstract

A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.

First claim

The invention claimed is:

1. A microfluidic component, comprising:
a microfluidic die having a first number of electrical contacts; and
a support substrate, the microfluidic die coupled to the support substrate, the support substrate including:
a second number of electrical contacts;
a third number of electrical contacts electrically connected to the first number of electrical contacts of the microfluidic die; and
a plurality of traces, each of the plurality of traces electrically connected to one of the second number of electrical contacts and at least two of the third number of electrical contacts.

2. The microfluidic component of claim 1 wherein the second number of electrical contacts is less than the first number of electrical contacts.

3. The microfluidic component of claim 2 wherein the second number of electrical contacts are configured to receive drive signals that are transmitted to the microfluidic die through the plurality of traces, through the third number of electrical contacts and through the first number of electrical contacts.

4. The microfluidic component of claim 1 wherein the support substrate is a printed circuit board.

5. The microfluidic component of claim 1 wherein the microfluidic die is positioned at a first end of the support substrate and the second number of electrical contacts are positioned at a second end of the support substrate opposite the first end of the support substrate.

6. The microfluidic component of claim 5 wherein the support substrate includes an opening at the first end of the support substrate aligned with an inlet path into the microfluidic die.

7. The microfluidic component of claim 5 , further comprising a plurality of wires coupled between the first number of electrical contacts of the microfluidic die and the third number of electrical contacts of the substrate.

8. The microfluidic component of claim 7 wherein the plurality of wires extend from one side of the die, the one side of the die being positioned between nozzles of the die and the second end of the support substrate.

9. The microfluidic component of claim 8 , further comprising an encapsulant positioned over the wires.

10. A microfluidic component, comprising:
a microfluidic die having a first number of electrical contacts; and
a support substrate, the microfluidic die on the support substrate, the support substrate including:
a second number of electrical contacts, at least two of the first number of electrical contacts electrically connected to each of the second number of electrical contacts; and
a third number of electrical contacts electrically connected between the first number of electrical contacts and the second number of electrical contacts, the third number of electrical contacts being greater than or equal to the second number of electrical contacts.

11. The microfluidic component of claim 10 wherein the microfluidic die is positioned at a first end of the support substrate and the second number of electrical contacts are positioned at a second end of the support substrate.

12. The microfluidic component of claim 11 , further comprising a notch in the second end of the support substrate.

13. The microfluidic component of claim 12 wherein the notch is positioned between groups of the second number of electrical contacts.

14. The microfluidic component of claim 10 , further comprising a plurality of wires coupled between the third number of electrical contacts and the second number of electrical contacts, pairs of the plurality of wires being electrically connected between pairs of the third number of electrical contacts and one of the second number of electrical contacts.

15. The microfluidic component of claim 10 wherein the support substrate further comprises:
a plurality of traces, each of the plurality of traces electrically connected to one of the second number of electrical contacts and at least two of the third number of electrical contacts.

16. A microfluidic component, comprising:
a microfluidic die having a first number of contact pads;
a support substrate, the microfluidic die on the support substrate, the support substrate including:
a second number of contact pads, each of the second number of contact pads electrically connected to one of the first number of contact pads; and
a third number of contact pads, each of the third number of contact pads electrically connected to at least two of the second number of contact pads.

17. The microfluidic component of claim 16 wherein the first number of contact pads are all positioned on one side of the microfluidic die.

18. The microfluidic component of claim 16 wherein the support substrate includes an opening aligned with an inlet path of the microfluidic die.

19. The microfluidic component of claim 16 wherein the support substrate includes a circular hole and an oval shaped hole though the substrate.

20. The microfluidic component of claim 16 wherein the support substrate further comprises:
a plurality of traces, each of the plurality of traces connected to one of the third number of contact pads and at least two of the second number of contact pads.

Assignees

• St Microelectronics Inc
• St Microelectronics Srl
• St Microelectronics Int Nv

Inventors

• Dodd Simon
• Scheffelin Joe
• Hunt Dave
• Giere Matt
• Gruenbacher Dana
• Sherman Faiz

Classifications

• H05K1/181

  associated with surface mounted components · CPC title

• Y10T29/49119

  Brush · CPC title

• B05B17/0684

  Wicks or the like · CPC title

• B41J2/17526

  Electrical contacts to the cartridge · CPC title

• H05K1/0212

  Printed circuits or mounted components having integral heating means · CPC title