Multilayer stack with enhanced conductivity and stability

Patent metadata

Field	Value
Publication number	US-10541065-B2
Application number	US-201715851002-A
Country	US
Kind code	B2
Filing date	Dec 21, 2017
Priority date	Dec 21, 2017
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

First claim

What is claimed is:

1. A method comprising:
depositing an insulating layer on a substrate;
forming a conductive polymer layer on the insulating layer; and
repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers, wherein each respective conductive polymer layer has a respective electrical resistance, and wherein the respective conductive polymer layers are electrically connected in parallel, such that a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance, and wherein repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form the multilayer stack comprises forming the multilayer stack to modify electrical resistivity over the substrate, such that a first location over the multilayer stack has an electrical resistivity that is different from a respective electrical resistivity at a second location over the multilayer stack, wherein forming the multilayer stack to modify the electrical resistivity over the substrate comprises: (i) depositing a number of conductive polymer layers at the first location that is different from a respective number of conductive polymer layers at the second location in a longitudinal direction over the substrate, (ii) depositing conductive polymer layers having a type of conductive polymer at the first location that is different from a respective type of conductive polymer at the second location, or (iii) depositing conductive polymer layers having a thickness at the first location that is different from a respective thickness of conductive polymer layers at the second location.

2. The method of claim 1 , wherein repeating the deposition of the respective insulating layer and the formation of the respective conductive polymer layer comprises:
repeating the deposition of the respective insulating layer and the formation of the respective conductive polymer layer until the resultant electrical resistance is substantially equal to a predetermined electrical resistance.

3. The method of claim 1 , wherein repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack comprises forming the multilayer stack to include each respective conductive polymer layer interfacing with two insulating layers, one insulating layer on each side of the respective conductive polymer layer.

4. The method of claim 1 , further comprising:
treating the respective conductive polymer layers with a conductivity enhancer to enhance electrical conductivity of the respective conductive polymer layers.

5. The method of claim 4 , wherein treating the respective conductive polymer layers with the conductivity enhancer comprises treating with a morphology enhancer or band modifier.

6. The method of claim 1 , further comprising:
forming a first electrical contact on a first edge of each conductive polymer layer; and
forming a second electrical contact on a second edge of each conductive polymer layer, wherein the first electrical contact and the second electrical contact of the conductive polymer layers facilitate connecting the conductive polymer layers to a power source.

7. The method of claim 1 , wherein forming the conductive polymer layer comprises forming the conductive polymer layer to include an intrinsic or extrinsic conductive polymer.

8. The method of claim 1 , wherein depositing the insulating layer comprises depositing a resin layer including polyurethane, epoxy, thermoplastic, phenolic, or silicone material.

9. The method of claim 1 , wherein forming the conductive polymer layer comprises forming a layer of Polyaniline-Dinonylnaphthalene sulfonic acid (PANI-DNNSA), poly(ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT-PSS), Polyaniline-dodecylbenzene sulfonic acid (PANI-DBSA), polypyrrole, graphene paint, carbon nanotubes paint, carbon black, conductive oxide, or metallic particles.

10. The method of claim 1 , further comprising:
curing the insulating layer prior to forming the conductive polymer layer.

11. A device comprising:
a substrate; and
a multilayer stack disposed on the substrate, wherein the multilayer stack comprises a plurality of conductive polymer layers, each conductive polymer layer being interposed between respective insulating layers, wherein each conductive polymer layer has a respective electrical resistance, wherein the plurality of conductive polymer layers are electrically connected in parallel, and wherein a number of conductive polymer layers of the plurality of conductive polymer layers at a first location over the substrate is different from a respective number of conductive polymer layers of the plurality of conductive polymer layers at a second location in a longitudinal direction over the substrate, such that an electrical resistivity at the first location over the multilayer stack is different from a respective electrical resistivity at the second location over the multilayer stack.

12. The device of claim 11 , wherein the conductive polymer layers are treated with a conductivity enhancer to enhance electrical conductivity of the conductive polymer layers.

13. The device of claim 12 , wherein the conductivity enhancer comprises a morphology enhancer or band modifier.

14. A component of an aircraft, the component comprising:
a multilayer stack disposed on or proximate to a surface of the component, wherein the multilayer stack comprises a plurality of conductive polymer layers, each conductive polymer layer being interposed between respective insulating layers, wherein each conductive polymer layer has a respective electrical resistance, wherein the plurality of conductive polymer layers are electrically connected in parallel to a power source, such that a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance, and wherein a number of the conductive polymer layers of the multilayer stack at a first location of the component is different from a number of the conductive polymer layers of the multilayer stack at a second location in a longitudinal direction over the component so as to generate a different amount of heat at the first location over the multilayer stack compared to the second location over the multilayer stack.

15. The component of claim 14 , wherein a number of conductive polymer layers of the plurality of conductive polymer layers is selected such that the resultant electrical resistance of the conductive polymer layers is substantially equal to a predetermined electrical resistance.

16. The device of claim 11 , wherein the electrical resistivity at the first location over the multilayer stack is different from the respective electrical resistivity at the second location over the multilayer stack further based on a type of conductive polymer at the first location being different from a respective type of conductive polymer at the second location.

17. The device of claim 11 , wherein the electrical resistivity at the first location over the multilayer stack is different from the respective electrical resistivity at the second location over the multilayer stack further based on a thickness of conductive polymer layers at the first location being different from a respective thickness of conductive polymer layers at the second location.

18. The device of claim 11 , further c

Assignees

• Boeing Co

Inventors

• Kinlen Patrick John
• Flack Matthew
• Bruton Eric Alan

Classifications

• H01C7/028

  consisting of organic substances · CPC title

• H05B2214/02

  Heaters specially designed for de-icing or protection against icing · CPC title

• H01C7/005

  Polymer thick films · CPC title

• B64D45/02

  Lightning protectors; Static dischargers · CPC title

• H01C17/28

  adapted for applying terminals · CPC title