Electrode structure, fingerprint recognition module and manufacturing method thereof, display device

Patent metadata

Field	Value
Publication number	US-10540534-B2
Application number	US-201615524074-A
Country	US
Kind code	B2
Filing date	Oct 24, 2016
Priority date	Oct 29, 2015
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

Disclosed is an electrode structure including an electrode body, a composite layer disposed on the electrode body; a surface of the composite layer away from the electrode body being set to be a finger contact surface in a case of fingerprint recognition, wherein the composite layer is made from composite materials formed by a cured main body glue and one-dimensional nano-conductor materials distributed in the main body glue; and an end of each of the one-dimensional nano-conductor materials exposed from the finger contact surface of the composite layer, and the other of each of the one-dimensional nano-conductor materials makes contact with the electrode body. A fingerprint recognition module including the electrode structure and a manufacturing method thereof are also disclosed.

First claim

The invention claimed is:

1. An electrode structure, comprising: an electrode body, a composite layer disposed on the electrode body; a surface of the composite layer away from the electrode body being set to be a finger contact surface in a case of fingerprint recognition, wherein
the composite layer is made from composite materials formed by a cured main body glue and one-dimensional nano-conductor materials distributed in the main body glue;
an end of each of the one-dimensional nano-conductor materials is exposed from the finger contact surface of the composite layer, and the other end of each of the one-dimensional nano-conductor materials makes contact with the electrode body; and
the axial direction of each of the one-dimensional nano-conductor materials is inclined relative to an upper surface of the electrode body, the axial direction of each of the one-dimensional nano-conductor materials is at an angle with the upper surface of the electrode body, and the angle is greater than 70° and less than 90°.

2. The electrode structure according to claim 1 , wherein the one-dimensional nano-conductor materials have a structure including at least one of nano wire, nanobelt, nanotube, or nanorod.

3. The electrode structure according to claim 1 , wherein the one-dimensional nano-conductor materials include any one of carbon, elemental metal, or alloy;
metallic elements for forming the elemental metal element include: any one selected from the group consisted of gold, silver, copper, cobalt, nickel, zinc, iron, platinum, ruthenium, molybdenum, niobium, iridium, palladium, titanium, cadmium, tungsten, vanadium, and bismuth; and
metallic elements in the alloy include: at least one selected from gold, silver, copper, cobalt, nickel, zinc, iron, platinum, ruthenium, molybdenum, niobium, iridium, palladium, titanium, cadmium, tungsten, vanadium, and bismuth.

4. The electrode structure according to claim 3 , wherein the one-dimensional nano-conductor materials are carbon nanotubes.

5. The electrode structure according to claim 1 , wherein the main body glue is ultraviolet (UV) curing adhesive or heat curing adhesive.

6. The electrode structure according to claim 1 , wherein the electrode body is made from any material of transparent conductive material, metal, or alloy.

7. The electrode structure according to claim 1 , wherein the one-dimensional nano-conductor materials are arranged in parallel.

8. The electrode structure according to claim 1 , wherein a thickness of the composite layer is ranged from 20 μm to 200 μm.

9. A fingerprint recognition module, comprising the electrode structure according to claim 1 .

10. A fingerprint recognition module comprising an electrode structure, the electrode structure comprising an electrode body, and a composite layer disposed on the electrode body, a surface of the composite layer away from the electrode body being set to be a finger contact surface in a case of fingerprint recognition,
wherein the composite layer is made from composite materials formed by a cured main body glue and one-dimensional nano-conductor materials distributed in the main body glue,
wherein an end of each of the one-dimensional nano-conductor materials is exposed from the finger contact surface of the composite layer, and the other end of each of the one-dimensional nano-conductor materials makes contact with the electrode body, and
wherein the electrode bodies of a plurality of electrode structures are arranged with interval, and the composite layers of the plurality of electrode structures have an integrated structure.

11. The A fingerprint recognition module comprising an electrode structure, the electrode structure comprising an electrode body, and a composite layer disposed on the electrode body, a surface of the composite layer away from the electrode body being set to be a finger contact surface in a case of fingerprint recognition,
wherein the composite layer is made from composite materials formed by a cured main body glue and one-dimensional nano-conductor materials distributed in the main body glue,
wherein an end of each of the one-dimensional nano-conductor materials is exposed from the finger contact surface of the composite layer, and the other end of each of the one-dimensional nano-conductor materials makes contact with the electrode body, and
wherein a plurality of electrode structures are arranged with interval.

12. A method for manufacturing the fingerprint recognition module according to claim 10 , comprising:
forming a conductive film on a substrate;
forming a composite film for covering the conductive film, in which the composite film is made from composite materials formed by a main body glue and one-dimensional nano-conductor materials distributed in the main body glue; the one-dimensional nano-conductor materials are arranged in parallel; one end of each of the one-dimensional nano-conductor materials is exposed on a finger contact surface of the main body glue, and the other end of each of the one-dimensional nano-conductor materials makes contact with the conductive film;
curing the main body glue; and
performing patterning process on the conductive film and the composite film, forming a plurality of spaced electrode bodies and composite layers disposed on upper surfaces of the electrode bodies, and forming the electrode structures by the electrode bodies and the composite layers.

13. A method for manufacturing the fingerprint recognition module according to claim 10 , comprising:
forming a conductive film on a substrate;
performing patterning process on the conductive film, and forming a plurality of spaced electrode bodies;
forming a composite film for covering the substrate and the electrode bodies, in which the composite film is made from composite materials formed by main body glue and one-dimensional nano-conductor materials distributed in the main body glue; the one-dimensional nano-conductor materials are arranged in parallel; one end of each of the one-dimensional nano-conductor materials is exposed on a finger contact surface of the main body glue, and the other end of each of the one-dimensional nano-conductor materials makes contact with the conductive film; and
curing the main body glue, and forming the plurality of electrode structures, in which the plurality of electrode structures are formed by the plurality of spaced electrode bodies and the composite film disposed on upper surfaces of the electrode bodies, and the composite film is an integrated structure.

14. A display device, comprising the fingerprint recognition module according to claim 9 .

15. A display device, comprising the fingerprint recognition module according to claim 10 .

16. A display device, comprising the fingerprint recognition module according to claim 11 .

Assignees

• Boe Technology Group Co Ltd

Inventors

• Li Yingyi

Classifications

• H01B1/18 Primary

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• G06V40/1306

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title

• C09J9/02

  Electrically-conducting adhesives · CPC title

• H01B13/0036

  Details · CPC title

• C09J11/04

  inorganic · CPC title