Liquid-cooled assembly

Patent metadata

Field	Value
Publication number	US-10539753-B1
Application number	US-201816175977-A
Country	US
Kind code	B1
Filing date	Oct 31, 2018
Priority date	Oct 31, 2018
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

The present disclosure provides a liquid-cooled transceiver assembly. The liquid-cooled transceiver assembly comprises a removable communications module and a receiving bay assembly. The removable communications module includes a faceplate connector to receive a signal from an external device, a signal conversion chip that is coupled to the faceplate connector, and a lever assembly. The lever assembly can engage the receiving bay assembly such that the signal conversion chip is aligned with and makes an electrical connection with an electrical socket disposed on the receiving bay assembly. The removable communications module is inserted into the receiving bay assembly which when fully assembled functions as a liquid-cooled transceiver assembly.

First claim

What is claimed is:

1. A removable communications module assembly, comprising:
a faceplate connector to receive a signal from an external device;
a signal conversion chip coupled to the faceplate connector; and
a lever assembly that is operable to engage a receiving bay assembly having an electrical socket such that the signal conversion chip is aligned with and makes an electrical connection with the electrical socket,
wherein the lever assembly is operable to provide positive pressure such that the signal conversion chip can maintain a thermal connection with a cold-plate component of an assembly, and
wherein the lever assembly includes a lever hook that fits a compression spring which is operable to provide positive pressure such that the signal conversion chip can maintain a thermal connection with a cold-plate component of a receiving cage assembly.

2. The removable communications module assembly of claim 1 , wherein the signal conversion chip is a component of a co-packaged assembly.

3. The removable communications module assembly of claim 1 , wherein the faceplate connector is integrated within an interchangeable connector bulkhead.

4. A receiving assembly to receive a removable communications module, comprising:
a system board;
an electrical socket disposed on a surface of the system board;
an alignment assembly disposed on the system board and configured to engage the removable communications module so as to align the electrical contacts on a bottom surface of a module board with the electrical socket;
a heat extraction assembly having a cold-plate device which is disposed above the electrical socket; and
an engagement assembly having an engagement arm coupled to the heat extraction assembly, the engagement assembly being operable to engage with a lever assembly of the removable communications module as the removable communications module is engaged with the alignment assembly such that the lever assembly forces the engagement arm downwards such that the cold-plate device contacts and applies a positive pressure on a signal conversion chip of the removable communications module.

5. The receiving assembly of claim 4 , wherein the heat extraction assembly further comprises a flexible liquid line coupled to the cold-plate device.

6. The receiving bay assembly of claim 4 , wherein the positive pressure applied to the cold-plate device establishes thermal contact with the signal conversion chip that is disposed on a removable communications assembly that is fitted into the receiving assembly.

7. The receiving bay assembly of claim 4 , wherein the alignment assembly comprises a pair of guide rails.

8. The receiving bay assembly of claim 4 , wherein the system board is an adaptor input/output card.

9. The receiving bay assembly of claim 4 , wherein the engagement assembly comprises a pivotable mounting bracket that is operable to move the engagement arm to engage with a lever assembly.

10. A liquid-cooled transceiver assembly, comprising:
a hot-pluggable assembly, comprising:
an electrical or optical transceiver faceplate connector unit;
a System-on-Chip device, comprising:
a signal conversion chip;
an optical connector; and
an optical jumper cable that is coupled between the signal conversion unit and the optical connector to transmit light signals there between; and

a lever assembly which is operable to engage a receiving bay assembly such that the signal conversion chip is aligned and makes contact with an electrical socket; and

the receiving bay assembly, comprising:
a system board;
an electrical socket disposed on a surface of the system board;
a heat extraction assembly having a cold-plate device which is disposed above the electrical socket; and
an engagement assembly having an engagement arm coupled to the heat extraction assembly, the engagement assembly being operable to engage with the lever assembly of the hot-pluggable assembly as the hot-pluggable assembly is engaged with an alignment assembly such that lever assembly forces the engagement arm downwards such that the cold-plate device contacts and applies a positive pressure on the signal conversion chip of the hot-pluggable assembly.

11. The liquid-cooled transceiver assembly of claim 10 , wherein the lever hook fits a compression spring that is operable to provide positive pressure such that the signal conversion chip can contact and maintain an electrical connection with the electrical socket.

12. The liquid-cooled transceiver assembly of claim 10 , further comprising a pair of latch tabs on the electrical or optical transceiver faceplate connector unit that cooperate with the compression spring to latch and unlatch the lever assembly.

13. The liquid-cooled transceiver assembly of claim 10 , wherein an engagement of the lever assembly creates an electrical blind mate between the hot-pluggable assembly and the receiving bay assembly.

14. The liquid-cooled transceiver assembly of claim 10 , wherein the electrical or optical transceiver faceplate connector unit is an interchangeable unit.

15. The liquid-cooled transceiver assembly of claim 10 , wherein the liquid line is coupled to a liquid source.

16. The liquid-cooled transceiver assembly of claim 10 , wherein the alignment member is to align the signal conversion chip with the electrical socket during an insertion sequence of the hot-pluggable assembly into the receiving bay assembly, the alignment assembly comprises a first alignment member disposed on the hot-pluggable assembly which is to physically cooperate with a second alignment member that is disposed on the receiving bay assembly.

17. The liquid-cooled transceiver assembly of claim 16 , wherein the second alignment member comprises a back wall that limits a lateral movement of the hot-pluggable assembly into the receiving bay assembly during the insertion sequence.

18. The liquid-cooled transceiver assembly of 10 , wherein the alignment assembly comprises guide rails disposed on the system board which allow the hot pluggable assembly to engage the receiving bay assembly without interfering with the electrical socket and other components on the system board.

19. The liquid-cooled transceiver assembly of claim 10 , wherein a downward motion of a pivoted lever arm of the lever assembly causes a module board upon which the System-on-Chip device is disposed on to move in a vertical direction which causes the module board to move along an inner wall of the alignment assembly of the receiving bay assembly.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Leigh Kevin B
• Bala Sunil Rao Ganta Papa Rao
• Norton John

Classifications

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/4278

  related to pluggable or demountable opto-electronic or electronic elements · CPC title

• G02B6/4261

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title