Sintered heat tube and semiconductor cooling refrigerator provided with same

Patent metadata

Field	Value
Publication number	US-10539356-B2
Application number	US-201515521894-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Feb 3, 2015
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

A sintered heat tube and a semiconductor cooling refrigerator having the same, the sintered heat tube comprises: a main tube segment with its both ends closed, and a manifold tube segment/manifold tube segments extending from one or more portions of one side of the main tube segment (respectively), wherein a work chamber of each manifold tube segment communicates with that of the main tube segment. In the sintered heat tube and the semiconductor cooling refrigerator having the sintered heat tube of the present invention, as the sintered heat tube includes manifold tube segments, the sintered heat tube of the present invention greatly improves the heat radiating or cold transferring efficiency. The sintered heat tube is particularly suitable for heat radiation of heat sources of a high heat flow density such as semiconductor cooling plates.

First claim

The invention claimed is:

1. A heat tube, comprising: a main tube segment having closed ends; and at least one manifold tube segment extending from one or more portions of one side of the main tube segment, wherein a work chamber of each of said at least one manifold tube segment communicates with that of the main tube segment and a work liquid flowing in the work chamber of the each of said at least one manifold tube segment and the work chamber of the main tube segment;
wherein the main tube segment comprises a first straight tube portion, and a second straight tube portion which extends from one end of the first straight tube portion and perpendicularly thereto and having a closed tip end;
a starting end of the each of said at least one manifold tube segment is located on the first straight tube portion;
a projection of the each of said at least one manifold tube segment in a plane perpendicular to the first straight tube portion overlaps with that of the second straight tube portion in the plane;
wherein the main tube segment further comprises:
a third straight tube portion having a closed tip end and which is arranged to be parallel with the first straight tube portion; and
a connecting straight tube portion connected between the first and third straight tube portions with an angle between 100 degrees and 170 degrees relative to the first and third straight tube portions respectively;

wherein the first, third and connecting straight tube portions are located in a same plane which is perpendicular to the second straight tube portion.

2. The heat tube of claim 1 , wherein a liquid absorption core of the each of said at least one manifold tube segment communicates with that of the main tube segment.

3. The heat tube of claim 1 , wherein a tube axis of the main tube segment is a space curve.

4. The heat tube of claim 1 , wherein the each of said at least one manifold tube segment extends outwards and perpendicularly to the main tube segment from a corresponding portion of the main tube segment.

5. The heat tube of claim 1 , wherein a diameter of the each of at least one manifold tube segment is equal to that of the main tube segment.

6. A semiconductor cooling refrigerator, comprising an inner tank, a semiconductor cooling plate and a heat exchanger, wherein the heat exchanger comprises multiple heat tubes, each heat tube comprises: a main tube segment having closed ends; and at least one manifold tube segment extending from one or more portions of one side of the main tube segment, wherein a work chamber of each of said at least one manifold tube segment communicates with that of the main tube segment and a work liquid flowing in the work chamber of the each of said at least one manifold tube segment and the work chamber of the main tube segment;
a part or all of the main tube segment of the each heat tube is thermally connected to a hot or cold end of the semiconductor cooling plate; and
the each of said at least one manifold tube segment of the each heat tube is configured to radiate heat to ambient air or to transfer cold to a storage compartment of the inner tank;
wherein the main tube segment comprises a first straight tube portion, and a second straight tube portion which extends from one end of the first straight tube portion and perpendicularly thereto and having a closed tip end;
a starting end of the each of said at least one manifold tube segment is located on the first straight tube portion;
a projection of the each of said at least one manifold tube segment in a plane perpendicular to the first straight tube portion overlaps with that of the second straight tube portion in the plane;
wherein the main tube segment further comprises:
a third straight tube portion having a closed tip end and which is arranged to be parallel with the first straight tube portion; and
a connecting straight tube portion connected between the first and third straight tube portions with an angle between 100 degrees and 170 degrees relative to the first and third straight tube portions respectively;

wherein the first, third and connecting straight tube portions are located in a same plane which is perpendicular to the second straight tube portion.

7. The semiconductor cooling refrigerator of claim 6 , wherein a liquid absorption core of the each of said at least one manifold tube segment communicates with that of the main tube segment.

8. The semiconductor cooling refrigerator of claim 6 , wherein a tube axis of the main tube segment is a space curve.

9. The semiconductor cooling refrigerator of claim 6 , wherein the each of said at least one manifold tube segment extends outwards and perpendicularly to the main tube segment from a corresponding portion of the main tube segment.

10. The semiconductor cooling refrigerator of claim 6 , wherein a diameter of the each of said at least one manifold tube segment is equal to that of the main tube segment.

Assignees

• Qingdao Haier Joint Stock Co Ltd

Inventors

• Tao Haibo
• Zhang Kui
• Liu Jianru
• Li Peng
• Li Chunyang
• Qi Feifei
• Ji Lisheng

Classifications

• F28F2255/18

  sintered · CPC title

• F25B39/00

  Evaporators; Condensers · CPC title

• F25D11/00

  Self-contained movable devices, e.g. domestic refrigerators · CPC title

• F25D3/005 Primary

  combined with heat exchangers · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title