Autonomic cooling system

US10539346B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10539346-B2
Application numberUS-201615274591-A
CountryUS
Kind codeB2
Filing dateSep 23, 2016
Priority dateSep 25, 2015
Publication dateJan 21, 2020
Grant dateJan 21, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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Autonomic cooling of a substrate is achieved using a porous thermal protective layer to provide evaporative cooling combined with capillary pumping. The porous thermal protective layer is manufactured onto the substrate. A vascular network is integrated between the substrate and the protective layer. Applied heat causes fluid contained in the protective layer to evaporate, removing heat. The fluid lost to evaporation is replaced by capillary pressure, pulling fluid from a fluid-containing reservoir through the vascular network. Cooling occurs as liquid evaporates from the protective layer.

First claim

Opening claim text (preview).

What is claimed is: 1. An autonomic cooling system comprising a fluid-containing reservoir connected to a material containing the fluid, the fluid comprising a cooling liquid; and the material comprising: (a) a porous thermal protective layer; (b) a structural or non-structural substrate: (i) the structural substrate comprising a metal, ceramic, polymer matrix composite (PMC), or a combination thereof; and (ii) the non-structural substrate comprising a non-natural elastomer; and (c) a vascularized layer integrated between the protective layer and the substrate, such that the vascularized layer is in direct contact with the protective layer; where the system autonomically cools the material upon an application of sufficient heat from a heat source to the material, whereby the vascularized layer disperses the cooling liquid throughout enough of the protective layer to produce a pressure gradient between the reservoir and the pores of the protective layer, the cooling liquid in the protective layer evaporates to remove the applied heat, and the cooling liquid lost by the evaporation is replaced via capillary pressure drawing fluid from the reservoir to the vascularized layer. 2. The system of claim 1 , where the fluid comprises water, an alcohol, a glycol, an aldehyde, an amine, an amide, or a combination thereof. 3. The system of claim 2 , where the fluid comprises water. 4. The system of claim 1 , where the substrate comprises the PMC. 5. The system of claim 4 , where the PMC comprises fiber-glass, carbon fiber, an epoxy resin, or a combination thereof. 6. The system of claim 5 , where the PMC comprises a combination of the epoxy resin with the fiber-glass or the carbon fiber. 7. The system of claim 6 , where the PMC has been bonded to the protective layer via an epoxy adhesive. 8. The system of claim 6 , where the vascularized layer has been integrated into the system by (i) bonding a sacrificial template of the vascularized layer to the protective layer, (ii) bonding the PMC to the sacrificial template on the protective layer, and (iii) removing the sacrificial template to form the vascularized layer integrated between the PMC and the protective layer. 9. The system of claim 8 , where the sacrificial template comprises polylactic acid (PLA)/tin (II) oxalate (SnOx). 10. The system of claim 1 , where the protective layer comprises a metal, alloy, polymer, traditional ceramic, advanced ceramic, or a combination thereof. 11. The system of claim 10 , where the protective layer comprises titanium (Ti), aluminum (Al), stainless steel, alumina (Al 2 O 3 ), titania (TiO 2 ), zirconia (ZrO 2 ), or a combination thereof. 12. The system of claim 10 , which is formed by (i) filling the pores of the protective layer with a pore filler, (ii) bonding a sacrificial template of the vascularized layer to the protective layer, (iii) bonding the substrate to the sacrificial template on the protective layer, (iv) removing the pore filler, and (v) removing the sacrificial template to form the vascularized layer integrated between the substrate and the protective layer. 13. The system of claim 12 , where the pore filler comprises an alcohol. 14. The system of claim 13 , where the pore filler comprises isomalt. 15. The system of claim 1 , where the vascularized layer is in direct contact with both the protective layer and the substrate. 16. The system of claim 15 , wherein the vascularized layer: (i) comprises a top surface and a bottom surface, the top surface being in direct contact with the protective layer and the bottom surface being in direct contact with the substrate; (ii) is in direct contact with the fluid-containing reservoir; and (iii) contains a portion of the fluid from the reservoir. 17. A method of autonomically cooling a material exposed to a heat source, comprising: A. providing the heat source; B. providing a fluid-containing reservoir connected to the material; and C. filling the material with the fluid from the reservoir; where, the fluid comprises a cooling liquid; and the material comprises: (a) a porous thermal protective layer; (b) a structural or non-structural substrate: (i) the structural substrate comprising a metal, ceramic, polymer matrix composite (PMC), or a combination thereof; and (ii) the non-structural substrate comprising a non-natural elastomer; and (c) a vascularized layer integrated between the protective layer and the substrate, such that the vascularized layer is in direct contact with the protective layer; and where the system autonomically cools the material upon an application of sufficient heat from the heat source to the material, whereby the vascularized layer disperses the cooling liquid throughout enough of the protective layer to produce a pressure gradient between the reservoir and the pores of the protective layer, the cooling liquid in the protective layer evaporates to remove the applied heat, and the cooling liquid lost by the evaporation is replaced via capillary pressure drawing fluid from the reservoir to the vascularized layer. 18. The method of claim 17 , where the fluid comprises water. 19. An autonomic cooling system comprising a fluid-containing reservoir connected to a material containing the fluid, the fluid comprising a cooling liquid; and the material comprising: (a) a porous thermal protective layer; (b) a structural or non-structural substrate: (i) the structural substrate comprising a metal, ceramic, polymer matrix composite (PMC), or a combination thereof; and (ii) the non-structural substrate comprising a non-natural elastomer; and (c) a vascularized layer integrated between the protective layer and the substrate, such that the vascularized layer is in direct contact with the protective layer, the vascularized layer comprising channels in direct contact with the pores of the protective layer; where the system autonomically cools the material upon an application of sufficient heat from a heat source to the material, whereby the vascularized layer disperses the fluid cooling liquid throughout enough of the protective layer to produce a pressure gradient between the reservoir and the pores of the protective layer, the cooling liquid in the protective layer evaporates to remove the applied heat, and the cooling liquid lost by the evaporation is replaced via capillary pressure drawing fluid from the reservoir to the vascularized layer. 20. The system of claim 19 , wherein the substrate comprises the PMC.

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What does patent US10539346B2 cover?
Autonomic cooling of a substrate is achieved using a porous thermal protective layer to provide evaporative cooling combined with capillary pumping. The porous thermal protective layer is manufactured onto the substrate. A vascular network is integrated between the substrate and the protective layer. Applied heat causes fluid contained in the protective layer to evaporate, removing heat. The fl…
Who is the assignee on this patent?
Univ Illinois
What technology area does this patent fall under?
Primary CPC classification F25B19/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 21 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).