Deposition mask, method of manufacturing deposition mask and metal plate

Patent metadata

Field	Value
Publication number	US-10538838-B2
Application number	US-201615763595-A
Country	US
Kind code	B2
Filing date	Sep 29, 2016
Priority date	Sep 30, 2015
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.

First claim

The invention claimed is:

1. A deposition mask for depositing a deposition material on a deposition target substrate, the deposition mask comprising:
a mask body; and
a through-hole provided in the mask body and through which the deposition material passes when the deposition material is deposited on the deposition target substrate,
wherein the mask body satisfies
y≥ 950 and y≥ 23 x− 1280

when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa),
wherein a thickness of the mask body is 15 μm or less,
wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa, and
wherein the mask body has a first plated metal layer including an iron alloy containing nickel and a second plated metal layer including an iron alloy containing nickel provided on the first plated metal layer.

2. A deposition mask for depositing a deposition material on a deposition target substrate, the deposition mask comprising:
a mask body; and
a through-hole provided in the mask body and through which the deposition material passes when the deposition material is deposited on the deposition target substrate,
wherein the mask body satisfies
z≥ 3.7 and z≥ 0.1 x− 6.0

when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa),
wherein a thickness of the mask body is 15 μm or less,
wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa, and
wherein the mask body has a first plated metal layer including an iron alloy containing nickel and a second plated metal layer including an iron alloy containing nickel provided on the first plated metal layer.

3. A method of manufacturing a deposition mask for depositing a deposition material on a deposition target substrate, the method comprising:
a step of forming a mask body, provided with a through-hole through which the deposition material passes when the deposition material is deposited on the deposition target substrate, on a base material by a plating process; and
a step of separating the mask body from the base material,
wherein the mask body satisfies
y≥ 950 and y≥ 23 x− 1280

when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa),
wherein a thickness of the mask body is 15 μm or less,
wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa, an
wherein the mask body has a first plated metal layer including an iron alloy containing nickel and a second plated metal layer including an iron alloy containing nickel provided on the first metal layer, and
wherein the step of forming the mask body includes: a first film formation step of forming the first metal layer provided with a first opening forming the through-hole; and a second film formation step of forming the second metal layer provided with a second opening communicating with the first opening on the first metal layer, the second film formation step to obtain the mask body having the first metal layer and the second metal layer.

4. The method of manufacturing a deposition mask according to claim 3 , wherein
the second film formation step includes: a resist formation step of forming a resist pattern on the base material and on the first metal layer with a predetermined gap therebetween; and a plating process step of precipitating the second metal layer on the first metal layer in the gap of the resist pattern, and
the resist formation step is performed such that the first opening of the first metal layer is covered with the resist pattern and the gap of the resist pattern is positioned on the first metal layer.

5. The method of manufacturing a deposition mask according to claim 4 , wherein
the plating process step of the second film formation step includes an electrolytic plating process step of causing an electric current to flow through the first metal layer to precipitate the second metal layer on the first metal layer.

6. The method of manufacturing a deposition mask according to claim 3 , wherein
the base material has an insulating property,
a conductive pattern having a pattern corresponding to the first metal layer is formed on the base material, and
the first film formation step includes a plating process step of precipitating the first metal layer on the conductive pattern.

7. The method of manufacturing a deposition mask according to claim 6 , wherein
the plating process step of the first film formation step includes an electrolytic plating process step of causing an electric current to flow through the conductive pattern to precipitate the first metal layer on the conductive pattern.

8. The method of manufacturing a deposition mask according to claim 3 , wherein
the first film formation step includes a resist formation step of forming a resist pattern on the base material with a predetermined gap therebetween and a plating process step of precipitating the first metal layer on the base material in the gap of the resist pattern, and
a portion of a front surface of the base material on which the first metal layer is precipitated is formed of a conductive layer having conductivity.

9. The method of manufacturing a deposition mask according to claim 8 , wherein
the plating process step of the first film formation step includes an electrolytic plating process step of causing an electric current to flow through the base material to precipitate the first metal layer on the base material.

10. A method of manufacturing a deposition mask for depositing a deposition material on a deposition target substrate, the method comprising:
a step of forming a mask body, provided with a through-hole through which the deposition material passes when the deposition material is deposited on the deposition target substrate, on a base material by a plating process; and
a step of separating the mask body from the base material,
wherein the mask body satisfies
z≥ 3.7 and z≥ 0.1 x− 6.0

when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa),
wherein a thickness of the mask body is 15 μm or less,
wherein the indentation elastic modulus is 52.8 GPa-109.1 GPa,
wherein the mask body has a first plated metal layer including an iron alloy containing nickel and a second plated metal layer including an iron alloy containing nickel provided on the first metal layer, and
wherein the step of forming the mask body includes: a first film formation step of forming the first metal layer provided with a first opening forming the through-hole; and a second film formation step of forming the second metal layer provided with a second opening communicating with the first opening on the first metal layer, the second film formation step to obtain the mask body having the first metal layer and the second metal layer.

11. The method of manufacturing a deposition mask according to claim 10 , wherein
the second film formation step includes: a resist formation step of forming a resist pattern on the base material and on the first metal layer with a predetermined gap therebetween; and a plating process step of precipitating the second metal layer on the first metal layer in the gap of the resist pattern, and
the resist formation step is performed such that the first opening of the first metal layer is covered with the resist pattern and the gap of the resist pattern is positioned on the first metal layer.

12. The method of manufacturing a deposition mask according to claim 11 , wherein
the plating process step of the second film formation step includes an electrolytic plating process step of causing an electric current to flow through the first metal layer to precipitate the second metal layer on the first metal layer.

13. Th

Assignees

• Dainippon Printing Co Ltd

Inventors

• Ikenaga Chikao
• Shimazaki Yo
• Seki Kentarou
• Furushou Hiroki
• Hatsuta Chiaki

Classifications

• C23F1/02

  Local etching · CPC title

• G03F7/0015

  Production of aperture devices, microporous systems or stamps · CPC title

• C25D1/10

  Moulds; Masks; Masterforms · CPC title

• C23C14/042 Primary

  using masks · CPC title

• C25D1/08

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title