Deterministic assembly of complex, three-dimensional architectures by compressive buckling

Patent metadata

Field	Value
Publication number	US-10538028-B2
Application number	US-201514944039-A
Country	US
Kind code	B2
Filing date	Nov 17, 2015
Priority date	Nov 17, 2014
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

Origami- and Kirigami-inspired assembly of predetermined three-dimensional forms is presented in comprehensive theoretical and experimental studies, with examples of a broad range of topologies and material compositions. The resulting engineering options in the construction of functional 3D structures have important implications for advanced microsystem technologies.

First claim

We claim:

1. A structure comprising:
a thin film structure having a complex shape held under strain by at least partial contact with a supporting material; wherein:
the thin film structure is characterized by at least one region with a mode ratio greater than or equal to 0.1, wherein the mode ratio of the at least one region corresponds to a ratio of average twisting curvature of the at least one region to the average bending curvature of the at least one region;
the thin film structure is characterized by a thickness less than or equal to 300 μm;
the thin film structure is bound to the supporting material at a plurality of bonding regions and not bound to the supporting material at a plurality of non-bonding regions; and
the complex shape of the thin film structure is non-linear and helical.

2. A structure comprising:
a thin film structure characterized by a plurality of cut-outs configured to allow said thin film structure to form a predetermined three-dimensional shape upon application of a compressive force provided by relaxation of a deformable substrate; wherein said predetermined three-dimensional shape is a rigid structure characterized by at least one region with a mode ratio greater than or equal to 0.1; wherein the mode ratio of the at least one region corresponds to a ratio of average twisting curvature of the at least one region to the average bending curvature of the at least one region;
the thin film structure is characterized by a thickness less than or equal to 300 μm; and
the three-dimensional shape is a complex shape characterized as non-linear and helical.

3. A structure comprising:
a deformable substrate having a surface; and
a thin film structure supported by said surface; wherein said thin film structure is bound to said surface at a plurality of bonding regions and not bound to said surface at a plurality of non-bonding regions; wherein relaxation of said deformable substrate provides a compressive force that generates a predetermined three-dimensional form of said thin film structure; wherein said predetermined three-dimensional form is characterized by at least one region with a mode ratio greater than or equal to 0.1; wherein the mode ratio of the at least one region corresponds to a ratio of average twisting curvature of the at least one region to the average bending curvature of the at least one region;
the thin film structure is characterized by a thickness less than or equal to 300 μm; and
the thin film structure has a complex shape characterized as non-linear and helical.

4. The structure of claim 3 further comprising:
an encapsulation layer at least partially encapsulating said predetermined three-dimensional form.

5. The structure of claim 4 , wherein said encapsulation layer is rigid.

6. The structure of claim 4 , wherein said deformable substrate is rigid.

7. The structure of claim 6 , wherein said thin film structure is an insulator.

8. A structure comprising:
a deformable substrate having a surface; and
a thin film structure supported by said surface; wherein said thin film structure is bound to said surface at a plurality of bonding regions and not bound to said surface at a plurality of non-bonding regions; wherein an overall shape of said thin film structure is non-linear and no bonding region exists at corners of a square or termini of a four-way intersection formed by said thin film structure;
wherein each of said non-bonding regions physically contacts said deformable substrate when said deformable substrate is in an expanded state and none of said non-bonding regions physically contacts said deformable substrate when said deformable substrate is in a contracted state; wherein:
wherein said overall shape is characterized by at least one region with a mode ratio greater than or equal to 0.1, wherein the mode ratio of the at least one region corresponds to a ratio of average twisting curvature of the at least one region to the average bending curvature of the at least one region;
the thin film structure is characterized by a thickness less than or equal to 300 μm; and
the overall shape is a complex shape characterized as non-linear and helical.

9. The structure of claim 6 , wherein said predetermined three-dimensional form is a space-filling shape.

10. A template for a three-dimensional structure comprising:
a deformable substrate having a surface; and
a two-dimensional thin film structure substantially parallel with and supported by said surface; wherein said two-dimensional thin film structure comprises a pattern of cut-outs configured to allow said two-dimensional thin film structure to convert into a predetermined three-dimensional complex shape upon application of a compressive force provided by relaxation of said substrate; wherein:
the three-dimensional complex shape is characterized by at least one region with a mode ratio greater than or equal to 0.1, wherein the mode ratio of the at least one region corresponds to a ratio of average twisting curvature of the at least one region to the average bending curvature of the at least one region;
the thin film structure is characterized by a thickness less than or equal to 300 μm;
the thin film structure is bound to the substrate at a plurality of bonding regions and not bound to the substrate at a plurality of non-bonding regions; and
the three-dimensional complex shape is characterized as non-linear and helical.

11. A structure comprising:
a thin film structure characterized by a plurality of cut-outs configured to allow said thin film structure to form a predetermined three-dimensional shape upon application of a compressive force provided by relaxation of a deformable substrate; wherein:
the three-dimensional shape is characterized by at least one region with a mode ratio greater than or equal to 0.1, wherein the mode ratio of the at least one region corresponds to a ratio of average twisting curvature of the at least one region to the average bending curvature of the at least one region;
the thin film structure is characterized by a thickness less than or equal to 300 μm;
the thin film structure is bound to the substrate at a plurality of bonding regions and not bound to the substrate at a plurality of non-bonding regions; and
the three-dimensional shape is a complex shape characterized as non-linear and helical.

12. The structure of claim 6 wherein said predetermined three-dimensional form is a multilayered three-dimensional structure.

13. The structure of claim 6 wherein said predetermined three-dimensional form comprises an additional three-dimensional structure disposed inside said predetermined three-dimensional form.

14. The structure of claim 6 wherein said predetermined three-dimensional form displays chirality.

15. The structure of claim 6 further comprising:
a functional device or functional device component integrated into or disposed upon a non-bonding region of said thin film structure.

16. A spatially varying structure comprising:
a deformable substrate having a surface; and
a thin film structure supported by said surface; wherein said thin film structure is bound to said surface at a plurality of bonding regions and not bound to said surface at a plurality of non-bonding regions; wherein relaxation of said deformable substrate provides a compressive force that generates a predetermined three-dimensional form of said thin film structure having a plurality of buckled regions characterized by an anisotropic distribution of periodicities, amplitudes or both; wherein:
the three-dimensional form is characterized by at least one region with a mode

Assignees

• Univ Illinois
• Univ Northwestern

Inventors

• Rogers John A
• Xu Sheng
• Yan Zheng
• Zhang Yihui
• Huang Yonggang

Classifications

• B32B1/00

  Layered products having a non-planar shape · CPC title

• B32B27/285

  comprising polyethers · CPC title

• B29L2031/756

  Microarticles, nanoarticles · CPC title

• B32B27/40

  comprising polyurethanes · CPC title

• H05K1/0283

  Stretchable printed circuits · CPC title