Method for evenly distributing plastic melt in a hot runner system using strain gauges

US10538023B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10538023-B2
Application numberUS-201715616240-A
CountryUS
Kind codeB2
Filing dateJun 7, 2017
Priority dateJun 30, 2016
Publication dateJan 21, 2020
Grant dateJan 21, 2020

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A hot runner injection molding apparatus, and method of use, is disclosed in which strain gauges are provided in the temperature zones of the hot runner injection molding apparatus and a hot runner controller creates a target strain profile, detects deviations from the target strain profile in any temperature zone based on the strain readings provided by the strain gauges in each temperature zone, and instructs correction of deviations from the target strain profile in any deviating temperature zone by adjusting the heat produced by a heater or heaters in the deviating temperature zone. The target strain profile may be based on a median or average of strain readings provided over time by the strain gauges in each temperature zone. A hollow installation tube for placing the strain gauges in the hot runner injection molding apparatus is also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. An injection molding apparatus, comprising: a mold comprising one or more mold cavities; a ram arranged to form a shot of molten thermoplastic material; a system nozzle arranged to inject the shot of molten thermoplastic material through a hot runner manifold; a plurality of hot runner nozzles adapted to receive the molten thermoplastic material from the hot runner manifold and inject the molten thermoplastic material into a plurality of mold cavities that are a part of the one or more mold cavities, each mold cavity connected to one hot runner nozzle; a plurality of temperature zones, each temperature zone associated with one of the plurality of mold cavities and including at least a portion of the hot runner manifold, the associated mold cavity, and the one hot runner nozzle connected to the associated mold cavity; a plurality of heaters, each heater connected to a hot runner controller, each temperature zone including at least one heater; and a plurality of strain gauges, each strain gauge in communication with the hot runner controller and each temperature zone provided with at least one of the plurality of strain gauges, wherein the hot runner controller comprises a set of instructions that are stored on a non-transitory machine-readable medium to create a target strain profile, to detect deviations from the target strain profile in any one of the plurality of temperature zones based on the strain readings provided by the strain gauges in each of the plurality of temperature zones, and to instruct correction of deviations from the target strain profile in the deviating temperature zone by adjusting the heat produced by the at least one heater in the deviating temperature zone; and wherein at least one of the at least one strain gauge provided for each temperature zone is located in an aperture provided in the portion of the hot runner manifold associated with the temperature zone or in the hot runner nozzle connected to the mold cavity associated with the temperature zone, and wherein an alternative material insert made from a material that amplifies the strain experienced by the strain gauge fills the aperture. 2. The injection molding apparatus of claim 1 , wherein the target strain profile is based on a median or average of strain readings provided over time by the strain gauges in each temperature zone. 3. The injection molding apparatus of claim 1 , wherein the target strain profile is predetermined. 4. The injection molding apparatus of claim 1 , further comprising a plurality of thermocouples, each of the plurality of heaters associated with one of the plurality of thermocouples which is connected to the hot runner controller. 5. The injection molding apparatus of claim 1 , wherein the alternative material insert has a lower flex modulus than the surrounding hot runner manifold. 6. The injection molding apparatus of claim 1 , wherein the alternative material insert is one of aluminum, brass, titanium, thermoset plastic, composite, and steel with a lower flex modulus than base steel or a combination of two or more of these materials. 7. The injection molding apparatus of claim 1 , wherein a minimum distance must be maintained between a bottom or a side of the aperture and an internal melt flow conduit wall to avoid cracking or leaking through the internal melt flow conduit wall. 8. The injection molding apparatus of claim 7 , wherein the minimum distance is at least 0.5 mm. 9. The injection molding apparatus of claim 1 , further comprising; a hollow strain gauge installation tube connected to one of the plurality of strain gauges; a removable insulator fitted around the top of the hollow strain gauge installation tube; a wire channel connected to a hollow interior of the hollow strain gauge installation tube. 10. The injection molding apparatus of claim 9 , wherein the hollow strain gauge installation tube is connected to an extension of one of the plurality of hot runner nozzles. 11. The injection molding apparatus of claim 1 , wherein the alternative material insert is formed from a metallurgy that expands at the same rate as steel.

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What does patent US10538023B2 cover?
A hot runner injection molding apparatus, and method of use, is disclosed in which strain gauges are provided in the temperature zones of the hot runner injection molding apparatus and a hot runner controller creates a target strain profile, detects deviations from the target strain profile in any temperature zone based on the strain readings provided by the strain gauges in each temperature zo…
Who is the assignee on this patent?
Imflux Inc
What technology area does this patent fall under?
Primary CPC classification B29C45/78. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 21 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).