Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US10535519B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10535519-B2 |
| Application number | US-201715618868-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 9, 2017 |
| Priority date | Feb 9, 2012 |
| Publication date | Jan 14, 2020 |
| Grant date | Jan 14, 2020 |
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It is intended to provide a photocured product that is prepared using the photo-imprint method and has favorable pattern precision and improvement in pattern defects. The present invention provides a photocured product obtained by irradiating a coating film in contact with a mold with light, the photocured product containing a fluorine atom-containing surfactant, wherein of secondary ion signals obtained by the surface analysis of the photocured product based on time-of-flight secondary ion mass spectrometry, the intensity of a C2H5O+ ion signal is higher than that of a C3H7O+ ion signal.
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The invention claimed is: 1. A photocurable composition for obtaining a photocured product by irradiating the photocurable composition in contact with a mold with light, the photocurable composition comprising: at least a polymerizable monomer; a photopolymerization initiator; and a fluorine atom-containing surfactant represented by: R 1 - x 1 -R 2 - x 2 -R 3 (1), wherein R 1 represents a perfluoroalkyl group, R 2 represents a divalent substituent containing ethylene oxide, R 3 represents a polar functional group selected from an alkylhydroxyl group, a carboxyl group, a thiol group, a pyridyl group, a silanol group, and a sulfo group, and x 1 and x 2 each represent a single bond or a divalent substituent, wherein a ratio of the fluorine atom-containing surfactant to the photocured product is 0.001% by weight to 5% by weight, and wherein of secondary ion signals obtained by a surface analysis of the photocured product based on time-of-flight secondary ion mass spectrometry, an intensity of a C 2 H 5 O + ion signal is higher than that of a C 3 H 7 O + ion signal. 2. The photocurable composition according to claim 1 , wherein the fluorine atom-containing surfactant is F(CF 2 ) 6 CH 2 (OCH 2 CH 2 ) 6 OH. 3. A method for forming a photocured product having a predetermined pattern shape on a substrate, the method comprising: coating the substrate with a photocurable composition; contacting the photocurable composition with a mold; irradiating the photocurable composition with light via the mold; and demolding the mold from the photocurable composition, wherein the photocured product contains a fluorine atom-containing surfactant represented by: R 1 - x 1 -R 2 - x 2 -R 3 (1), wherein R 1 represents a perfluoroalkyl group, R 2 represents a divalent substituent containing ethylene oxide, R 3 represents a polar functional group selected from an alkylhydroxyl group, a carboxyl group, a thiol group, a pyridyl group, a silanol group, and a sulfo group, and x 1 and x 2 each represent a single bond or a divalent substituent, wherein a ratio of the fluorine atom-containing surfactant to the photocured product is 0.001% by weight to 5% by weight, and wherein of secondary ion signals obtained by a surface analysis of the photocured product based on time-of-flight secondary ion mass spectrometry, an intensity of a C 2 H 5 O + ion signal is higher than that of a C 3 H 7 O + ion signal. 4. A method for producing a circuit substrate, the method comprising: applying a photocurable composition onto a substrate material; pressing a mold against the photocurable composition to form a pattern in the photocurable composition; irradiating the photocurable composition having the pattern with light to prepare a cured product having the pattern; and releasing the mold from the cured product to form, on the substrate material, a circuit structure based on the pattern in the cured product, wherein the cured product contains a fluorine atom-containing surfactant represented by: R 1 - x 1 -R 2 - x 2 -R 3 (1), wherein R 1 represents a perfluoroalkyl group, R 2 represents a divalent substituent containing ethylene oxide, R 3 represents a polar functional group selected from an alkylhydroxyl group, a carboxyl group, a thiol group, a pyridyl group, a silanol group, and a sulfo group, and x 1 and x 2 each represent a single bond or a divalent substituent, wherein a ratio of the fluorine atom-containing surfactant to the photocured product is 0.001% by weight to 5% by weight, and wherein of secondary ion signals obtained by a surface analysis of the photocured product based on time-of-flight secondary ion mass spectrometry, an intensity of a C 2 H 5 O + ion signal is higher than that of a C 3 H 7 O + ion signal. 5. The method according to claim 4 , wherein the circuit substrate is a semiconductor device. 6. A method for producing a cured product having an elevation/depression pattern, the method comprising: applying a photocurable composition onto a base material; contacting a mold having an elevated/depressed surface with the photocurable composition to form a corresponding elevation/depression pattern in the photocurable composition; irradiating the photocurable composition having the elevation/depression pattern with light to prepare a photocured product; and releasing the mold from the photocured product to produce the cured product having the elevation/depression pattern, wherein the photocured product contains a fluorine atom-containing surfactant represented by: R 1 - x 1 -R 2 - x 2 -R 3 (1), wherein R 1 represents a perfluoroalkyl group, R 2 represents a divalent substituent containing ethylene oxide, R 3 represents a polar functional group selected from an alkylhydroxyl group, a carboxyl group, a thiol group, a pyridyl group, a silanol group, and a sulfo group, and x 1 and x 2 each represent a single bond or a divalent substituent, wherein a ratio of the fluorine atom-containing surfactant to the photocured product is 0.001% by weight to 5% by weight, and wherein of secondary ion signals obtained by a surface analysis of the photocured product based on time-of-flight secondary ion mass spectrometry, an intensity of a C 2 H 5 O + ion signal is higher than that of a C 3 H 7 O + ion signal. 7. A method for forming a pattern, the method comprising: applying a photocurable composition onto a base material; contacting a mold having an elevated/depressed surface with the photocurable composition to form a corresponding elevation/depression pattern in the photocurable composition; irradiating the photocurable composition having the elevation/depression pattern with light to prepare a cured product having the elevation/depression pattern; and releasing the mold from the cured product to form the pattern in the cured product, wherein the cured product contains a fluorine atom-containing surfactant represented by: R 1 - x 1 -R 2 - x 2 -R 3 (1), wherein R 1 represents a perfluoroalkyl group, R 2 represents a divalent substituent containing ethylene oxide, R 3 represents a polar functional group selected from an alkylhydroxyl group, a carboxyl group, a thiol group, a pyridyl group, a silanol group, and a sulfo group, and x 1 and x 2 each represent a single bond or a divalent substituent, wherein a ratio of the fluorine atom-containing surfactant to the photocured product is 0.001% by weight to 5% by weight, and wherein of secondary ion signals obtained by a surface analysis of the photocured product based on time-of-flight secondary ion mass spectrometry, an intensity of a C 2 H 5 O + ion signal is higher than that of a C 3 H 7 O + ion signal.
characterised by their composition, e.g. multilayer masks or materials · CPC title
Photolithographic processes · CPC title
having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title
Manufacture or treatment of nanostructures · CPC title
Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title
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