Medical electrical lead joints and methods of manufacture

US10535446B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10535446-B2
Application numberUS-201615231485-A
CountryUS
Kind codeB2
Filing dateAug 8, 2016
Priority dateNov 29, 2008
Publication dateJan 14, 2020
Grant dateJan 14, 2020

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A joint between an insulative sidewall of a medical electrical lead subassembly and an underlying fluoropolymer layer includes an interfacial layer. A first section of the interfacial layer is bonded to the fluoropolymer layer and is formed by a thermoplastic fluoropolymer; a second section of the interfacial layer extends adjacent the first section and is bonded to the insulative sidewall. The insulative sidewall, of the subassembly, and the second section, of the interfacial layer, are each formed from a material that is not a fluoropolymer. A recess is formed in the first section of the interfacial layer and the second section of the interfacial layer extends within the recess.

First claim

Opening claim text (preview).

We claim: 1. A method for manufacturing a joint in a medical electrical lead, the joint being between an inner surface of an insulative sidewall of the lead and an outer surface of a tubular fluoropolymer layer, the method comprising: thermally bonding a thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer, and providing an outer surface of the thermoplastic fluoropolymer layer with a recess formed therein; assembling a layer of another material into the recess formed in the outer surface of the thermoplastic fluoropolymer layer; thereafter adhesively bonding the other material layer in the recess formed in the outer surface of the thermoplastic fluoropolymer layer to the inner surface of the insulative sidewall; wherein the other material layer and the insulative sidewall are each formed from a material that does not comprise a fluoropolymer; and wherein the step of adhesively bonding the other material layer to the inner surface of the insulative sidewall comprises placing an adhesive between the inner surface of the insulative sidewall and the layer of the other material. 2. The method of claim 1 , wherein the recess formed within the thermoplastic fluoropolymer layer extends circumferentially around the thermoplastic fluoropolymer layer. 3. The method of claim 2 wherein the recess formed within the thermoplastic fluoropolymer layer comprises a groove. 4. The method of claim 1 wherein the recess formed within the thermoplastic fluoropolymer layer comprises a groove. 5. The method of claim 1 wherein the adhesive is formed from a material that does not comprise a fluoropolymer. 6. The method of claim 1 wherein the step of assembling the layer of the other material into the recess formed in the outer surface of the thermoplastic fluoropolymer layer is performed after the step of thermally bonding the thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer. 7. The method of claim 1 wherein thermally bonding the thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer is performed prior to providing the recess in the outer surface of the thermoplastic fluoropolymer layer. 8. The method of claim 1 wherein thermally bonding the thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer is performed concurrent with providing the recess in the outer surface of the thermoplastic fluoropolymer layer. 9. A method for manufacturing a joint in a medical electrical lead, the joint being between an inner surface of an insulative sidewall of the lead and an outer surface of a tubular fluoropolymer layer, the method comprising: thermally bonding a thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer, and providing an outer surface of the thermoplastic fluoropolymer layer with a recess formed therein; assembling a layer of another material into the recess formed in the outer surface of the thermoplastic fluoropolymer layer; thereafter adhesively bonding the other material layer in the recess formed in the outer surface of the thermoplastic fluoropolymer layer to the inner surface of the insulative sidewall; wherein the other material layer and the insulative sidewall are each formed from a material that does not comprise a fluoropolymer; and wherein the recess formed within the thermoplastic fluoropolymer layer comprises a spiral groove. 10. The method of claim 9 wherein the step of adhesively bonding the other material layer to the inner surface of the insulative sidewall comprises placing an adhesive between the inner surface of the insulative sidewall and the layer of the other material into the recess formed in the outer surface of the thermoplastic fluoropolymer layer. 11. The method of claim 9 wherein the step of adhesively bonding the other material layer to the inner surface of the insulative sidewall comprises placing an adhesive between the inner surface of the insulative sidewall and the layer of the other material, wherein the adhesive is formed from a material that does not comprise a fluoropolymer. 12. The method of claim 9 wherein the step of assembling the layer of the other material into the recess formed in the outer surface of the thermoplastic fluoropolymer layer is performed after the step of thermally bonding the thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer. 13. The method of claim 9 wherein thermally bonding the thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer is performed prior to providing the recess in the outer surface of the thermoplastic fluoropolymer layer. 14. The method of claim 9 wherein thermally bonding the thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer is performed concurrent with providing the recess in the outer surface of the thermoplastic fluoropolymer layer.

Assignees

Inventors

Classifications

  • of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account · CPC title

  • of different melting point, i.e. the melting point of one of the parts to be joined being different from the melting point of the other part · CPC title

  • Avoiding burr formation · CPC title

  • Mechanical pre-treatments, e.g. reshaping · CPC title

  • Forming single grooves or ribs, e.g. tear lines, weak spots (by moulding B29C37/0057; folding lines B29C53/06; in metal articles B21D17/00; by cutting B26D3/08) · CPC title

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What does patent US10535446B2 cover?
A joint between an insulative sidewall of a medical electrical lead subassembly and an underlying fluoropolymer layer includes an interfacial layer. A first section of the interfacial layer is bonded to the fluoropolymer layer and is formed by a thermoplastic fluoropolymer; a second section of the interfacial layer extends adjacent the first section and is bonded to the insulative sidewall. The…
Who is the assignee on this patent?
Medtronic Inc
What technology area does this patent fall under?
Primary CPC classification A61N1/056. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jan 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).