Dielectric film

US10529494B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10529494-B2
Application numberUS-201515512920-A
CountryUS
Kind codeB2
Filing dateSep 24, 2015
Priority dateSep 30, 2014
Publication dateJan 7, 2020
Grant dateJan 7, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tan δ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00. The present invention provides a film capacitor that includes a resin film as a dielectric film, the resin film exhibiting excellent heat resistance, excellent withstand voltage properties, and excellent workability.

First claim

Opening claim text (preview).

The invention claimed is: 1. A dielectric film comprising a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, wherein a ratio of racemo diads in the crystalline hydrogenated dicyclopentadiene ring-opening polymer is 60% or more, the resin film has a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tan δ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00, and the resin film is obtained by stretching the unstretched film at a stretching temperature of 95 to 135° C., a stretching ratio of 1.2 to 10, and a stretching speed of 100 to 30,000 mm/min, and heating the resulting stretched film at a heating temperature of 150 to 240° C. for a heating time of 0.1 to 600 minutes.

Assignees

Inventors

Classifications

  • Manufacture of films or sheets · CPC title

  • successively · CPC title

  • Capacitors · CPC title

  • H01G4/33Primary

    Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

  • Use of polymers of unsaturated cyclic compounds having no unsaturated aliphatic groups in a side-chain, e.g. coumarone-indene resins or derivatives thereof, as moulding material · CPC title

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What does patent US10529494B2 cover?
The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5…
Who is the assignee on this patent?
Zeon Corp
What technology area does this patent fall under?
Primary CPC classification H01G4/33. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).