Catalysts and methods for ring opening metathesis polymerization
US-2015240008-A1 · Aug 27, 2015 · US
US10529494B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10529494-B2 |
| Application number | US-201515512920-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 24, 2015 |
| Priority date | Sep 30, 2014 |
| Publication date | Jan 7, 2020 |
| Grant date | Jan 7, 2020 |
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The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tan δ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00. The present invention provides a film capacitor that includes a resin film as a dielectric film, the resin film exhibiting excellent heat resistance, excellent withstand voltage properties, and excellent workability.
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The invention claimed is: 1. A dielectric film comprising a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, wherein a ratio of racemo diads in the crystalline hydrogenated dicyclopentadiene ring-opening polymer is 60% or more, the resin film has a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tan δ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00, and the resin film is obtained by stretching the unstretched film at a stretching temperature of 95 to 135° C., a stretching ratio of 1.2 to 10, and a stretching speed of 100 to 30,000 mm/min, and heating the resulting stretched film at a heating temperature of 150 to 240° C. for a heating time of 0.1 to 600 minutes.
Manufacture of films or sheets · CPC title
successively · CPC title
Capacitors · CPC title
Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title
Use of polymers of unsaturated cyclic compounds having no unsaturated aliphatic groups in a side-chain, e.g. coumarone-indene resins or derivatives thereof, as moulding material · CPC title
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