Heat control method and device

Patent metadata

Field	Value
Publication number	US-10528101-B2
Application number	US-201515570594-A
Country	US
Kind code	B2
Filing date	Aug 6, 2015
Priority date	Apr 28, 2015
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

A heat control method and device are provided. In the method, a distance or distances between one or more regions of a terminal and a predetermined detection object may be detected (S102); heat insulation processing may be performed in a first region of the terminal, where the first region may be a region of which the distance to the predetermined detection object is smaller than a first predetermined threshold; and/or, heat dissipation processing may be performed in a second region of the terminal, where the second region may be a region of which the distance to the predetermined detection object is larger than a second predetermined threshold (S104).

First claim

What is claimed is:

1. A heat control method, comprising:
detecting a distance or distances between one or more regions of a terminal and a predetermined detection object;
further comprising:
performing heat insulation processing in a first region of the terminal, wherein the distance between the predetermined detection object and the first region is smaller than a first predetermined threshold; or,
performing heat dissipation processing in a second region of the terminal, wherein the distance between the predetermined detection object and the second region is larger than a second predetermined threshold.

2. The method as claimed in claim 1 , wherein performing heat insulation processing in the first region of the terminal comprises:
performing stepped heat insulation processing in the first region according to distances to the predetermined detection object.

3. The method as claimed in claim 2 , wherein performing stepped heat insulation processing in the first region according to the distances to the predetermined detection object comprises:
performing stepped heat insulation processing in a manner of respectively controlling each grid sub-block in the first region, wherein the first region comprises a predetermined number of grid sub-blocks, and electrodes configured to control heat are arranged in the grid sub-blocks.

4. The method as claimed in claim 3 , wherein detecting the distance or distances between the one or more regions of the terminal and the predetermined detection object comprises:
determining the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

5. The method as claimed in claim 3 , wherein an electrode is arranged on each of upper and lower sides of each grid sub-block, and heat insulation or heat dissipation processing is performed by virtue of migration of electrons between the electrodes.

6. The method as claimed in claim 2 , wherein detecting the distance or distances between the one or more regions of the terminal and the predetermined detection object comprises:
determining the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

7. The method as claimed in claim 1 , after detecting a distance or distances between the one or more regions of a terminal and a predetermined detection object:
when a distance between each region of the terminal and the predetermined detection object is larger than a third predetermined threshold, performing heat equalization processing in the terminal.

8. The method as claimed in claim 7 , wherein detecting the distance or distances between the one or more regions of the terminal and the predetermined detection object comprises:
determining the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

9. The method as claimed in claim 1 , wherein detecting the distance or distances between the one or more regions of the terminal and the predetermined detection object comprises:
determining the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

10. A terminal having a main Central Processing Unit (CPU), comprising:
a detection module, configured to detect a distance or distances between one or more regions of the terminal and a predetermined detection object;
further comprising:
a first processing module, configured to perform heat insulation processing in a first region of the terminal, wherein the distance between the predetermined detection object and the first region is smaller than a first predetermined threshold; or,
a second processing module, configured to perform heat dissipation processing in a second region of the terminal, wherein the distance between the predetermined detection object and the second region is larger than a second predetermined threshold.

11. The device as claimed in claim 10 , wherein the first processing module comprises:
a control chip, configured to perform stepped heat insulation processing in the first region according to distances to the predetermined detection object.

12. The device as claimed in claim 11 , wherein the control chip is configured to:
perform stepped heat insulation processing in a manner of respectively controlling each grid sub-block in the first region, wherein the first region comprises a predetermined number of grid sub-blocks, and electrodes configured to control heat are arranged in the grid sub-blocks.

13. The device as claimed in claim 12 , wherein the detection module is configured to:
determine the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

14. The device as claimed in claim 11 , wherein the detection module is configured to:
determine the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

15. The device as claimed in claim 10 , further comprising:
a third processing module, configured to, when a distance between each region of the terminal and the predetermined detection object is larger than a third predetermined threshold, perform heat equalization processing in the terminal.

16. The device as claimed in claim 15 , wherein the detection module is configured to:
determine the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

17. The device as claimed in claim 10 , wherein the detection module is configured to:
determine the distance or distances between the one or more regions of the terminal and the predetermined detection object based on a change of a numerical value in a proximity sensor or a change of a numerical value in a capacitive sensor.

18. An intelligent heat dissipation device, comprising: a heat equalization element layer, a heat insulation and heat conduction element layer and a control chip of the heat insulation and heat conduction element layer, wherein
the heat equalization element layer is filled with a layer of substance with a high specific heat capacity for implementing absorption of heat;
the heat insulation and heat conduction element layer is a layer, of which a thickness is smaller than a predetermined value, formed by a plurality of transversely and vertically divided grids, and
the control chip is configured to control each grid to convert between heat conduction and heat insulation attributes.

19. The intelligent heat dissipation device as claimed in claim 18 , wherein positive and negative electrodes are arranged on upper and lower sides of each grid, and the control chip is configured to convert an attribute of the grid between heat insulation a

Assignees

• Zte Corp
• Xian Zhongxing New Software Co Ltd

Inventors

• Yuan Biao

Classifications

• F28F2013/005

  Thermal joints · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• F28F2013/008

  Variable conductance materials; Thermal switches · CPC title

• H05K7/20 Primary

  Modifications to facilitate cooling, ventilating, or heating · CPC title