Film forming apparatus

US10526704B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10526704-B2
Application numberUS-201514609758-A
CountryUS
Kind codeB2
Filing dateJan 30, 2015
Priority dateJan 30, 2015
Publication dateJan 7, 2020
Grant dateJan 7, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A film forming apparatus includes a chamber having a processing space, a stage provided in the processing space and having a substrate placed thereon, a diffusion tube connected to the chamber so that a diffusion space communicating with the processing space is provided right above the stage, and a gas supply tube extending from the outside of the diffusion tube into the diffusion space through a portion of the diffusion tube and having a gas supply orifice in a portion thereof inside of the diffusion space. The gas supply orifice is formed so as to eject a material gas in a direction away from the stage.

First claim

Opening claim text (preview).

What is claimed is: 1. A film forming apparatus comprising: a chamber having a processing space; a stage provided in the processing space and having a substrate placed thereon; an electrode provided above the stage and having openings formed therein; an intermediate plate provided above the electrode, having openings formed therein, and formed of an insulating material; a diffusion tube positioned above the electrode and the intermediate plate and connected to the chamber so that a diffusion space communicating with the processing space is provided right above the stage; and a gas supply tube extending from the outside of the diffusion tube into the diffusion space through a portion of the diffusion tube and having a gas supply orifice in a portion thereof inside of the diffusion space, wherein the gas supply orifice is formed so as to eject a material gas in a direction away from the stage, and the gas supply orifice is provided only at a center of the diffusion space as viewed in plan. 2. The film forming apparatus according to claim 1 , wherein the gas supply orifice is formed so as to eject a gas toward an upper wall surface of the diffusion tube. 3. The film forming apparatus according to claim 1 , wherein the opening area of the gas supply orifice is smaller than the sectional area of a hollow space in the gas supply tube. 4. The film forming apparatus according to claim 1 , wherein the apparatus is constructed as a plasma film forming apparatus that applies a voltage between the electrode and the stage.

Assignees

Inventors

Classifications

  • Elongated nozzles, tubes with holes · CPC title

  • using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} · CPC title

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What does patent US10526704B2 cover?
A film forming apparatus includes a chamber having a processing space, a stage provided in the processing space and having a substrate placed thereon, a diffusion tube connected to the chamber so that a diffusion space communicating with the processing space is provided right above the stage, and a gas supply tube extending from the outside of the diffusion tube into the diffusion space through…
Who is the assignee on this patent?
Asm Ip Holding Bv
What technology area does this patent fall under?
Primary CPC classification C23C16/45578. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).