Plating method

Patent metadata

Field	Value
Publication number	US-10526497-B2
Application number	US-201715599473-A
Country	US
Kind code	B2
Filing date	May 19, 2017
Priority date	May 27, 2016
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.

First claim

What is claimed is:

1. A plating method comprising:
a bulge forming process of forming a bulge on an object to be plated by ejecting first ink drops of first UV-curable ink from a first inkjet head such that the ejected first ink drops land on the object; and
a plating process of plating the object having the bulge formed thereon, after the bulge forming process;
wherein, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated, and the first surface of the object to be plated has a different glossiness than the second surface of the bulge to be plated.

2. The plating method according to claim 1 , further comprising:
a heating process of heating the object having the bulge formed thereon, thereby removing an internal stress of the bulge, after the bulge forming process and before the plating process.

3. The plating method according to claim 2 , wherein:
in the heating process, the object is heated at a temperature lower than a glass-transition temperature of the first UV-curable ink.

4. A plating method comprising:
a bulge forming process of forming a bulge on an object to be plated by ejecting first ink drops of first UV-curable ink from a first inkjet head such that the ejected first ink drops land on the object;
a mask forming process of forming a plating mask on the object by ejecting second ink drops of second UV-curable ink from a second inkjet head such that the ejected second ink drops land on the object;
a plating process of plating the object having the bulge formed thereon, after the bulge forming process; and
a mask removing process of removing the plating mask from the object, after the plating process, wherein the plating mask is formed to be spaced apart from the neighboring bulge by a predetermined distance,
and in the mask removing process, the plating mask is removed using an organic solvent for mask removal, in which the first UV-curable ink is insoluble in the organic solvent and the second UV-curable ink is soluble in the organic solvent.

5. The plating method according to claim 4 , wherein:
in the plating process, the object is dipped in a plating solution, wherein
the first UV-curable ink is insoluble in the plating solution and the organic solvent for mask removal, and
the second UV-curable ink is insoluble in the plating solution but is soluble in the organic solvent for mask removal.

6. The plating method according to claim 4 , wherein in the plating process, the plating is applied to a portion of the bulge including an edge part where the plating mask is not formed.

7. The plating method according to claim 4 , further comprising:
a heating process of heating the object having the bulge formed thereon, thereby removing an internal stress of the bulge, after the bulge forming process and before the plating process.

8. The plating method according to claim 7 , wherein:
in the heating process, the object is heated at a temperature lower than a glass-transition temperature of the first UV-curable ink.

9. A plating method comprising:
a bulge forming process of forming a bulge on an object to be plated by ejecting first ink drops of first UV-curable ink from a first inkjet head such that the ejected first ink drops land on the object; and
a plating process of plating the object having the bulge formed thereon, after the bulge forming process;
wherein the bulge forming process includes:
a semi-hardened-layer forming process of semi-hardening the first ink drops landed on the object by irradiation with ultraviolet light, thereby forming a semi-hardened layer; and
a completely-hardened-layer forming process of further ejecting the first ink drops to land on the semi-hardened layer, and completely hardening the semi-hardened layer and the first ink drops landed on the semi-hardened layer at the same time by irradiation with ultraviolet light having intensity higher than that in the semi-hardened-layer forming process, thereby forming a completely hardened layer;
wherein, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated, and the first surface of the object to be plated has a different glossiness than the second surface of the bulge to be plated.

10. The plating method according to claim 9 , further comprising:
a heating process of heating the object having the bulge formed thereon, thereby removing an internal stress of the bulge, after the bulge forming process and before the plating process.

11. The plating method according to claim 10 , wherein:
in the heating process, the object is heated at a temperature lower than a glass-transition temperature of the first UV-curable ink.

Assignees

• Mimaki Eng Co Ltd

Inventors

• Ohnishi Masaru
• Ito Toshiya

Classifications

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C25D5/022

  using masking means · CPC title

• C23C18/1605

  by masking · CPC title

• C23C18/30

  Activating {or accelerating or sensitising with palladium or other noble metal} · CPC title

• C23C18/1662

  Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires · CPC title