Polyamide resin composition having thermal aging resistance and method for enhancing thermal aging resistance of polyamide resin

Patent metadata

Field	Value
Publication number	US-10526485-B2
Application number	US-201615742170-A
Country	US
Kind code	B2
Filing date	Jul 22, 2016
Priority date	Jul 29, 2015
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

The present invention is a polyamide resin composition having a thermal aging resistance in a level which is resistant to a high-temperature and long-term environment of 200° C. and longer than 1000 hours. According to the present invention, there is provided a polyamide resin composition containing a polyamide resin (A) and another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40, and wherein, to 100 parts by mass of the total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part (s) by mass of a metal cyanide salt of a composition formula (1) is compounded.

First claim

The invention claimed is:

1. A polyamide resin composition comprising a polyamide resin (A), another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), and a metal cyanide salt of Formula (1):
A x [M(CN) y ],  Formula (1)

wherein in the Formula (1), M is at least one member of transition metal elements in groups 5 to 10 and periods 4 to 6 of a periodic table; A is at least one member of alkali metal and alkaline earth metal; y is an integer of from 3 to 6; and x is a number calculated by (y−m)/a, wherein m is a valence of M and a is a valence of A,
wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40,
wherein the polyamide resin composition comprises 0.5 to 20 part(s) by mass of the metal cyanide salt of Formula (1) with respect to 100 parts by mass of a total amount of the polyamide resin (A) and the polyamide resin (B), and
wherein the polyamide resin composition excludes clay.

2. The polyamide resin composition according to claim 1 , wherein M in the Formula (1) is iron.

3. The polyamide resin composition according to claim 1 , wherein the metal cyanide salt in the Formula (1) is one or more member(s) selected from the group consisting of alkali metal hexacyanoferrate (II) and alkali metal hexacyanoferrate (III).

4. The polyamide resin composition according to claim 1 , wherein, to 100 parts by mass of the total amount of the polyamide resin (A) and the polyamide resin (B), a copper compound is compounded in an amount of 0.0001 to 1 part by mass as copper.

5. The polyamide resin composition according to claim 1 , wherein, the polyamide resin (A) is polyhexamethyleneadipamide.

6. A method for enhancing thermal aging resistance of a polyamide resin composition, wherein the polyamide resin composition contains a polyamide resin (A) and another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40,
said method comprising adding to the polyamide resin composition 0.5 to 20 part(s) by mass of a metal cyanide salt of Formula (1) with respect to 100 parts by mass of a total amount of the polyamide resin (A) and the polyamide resin (B):
A x [M(CN) y ],  Formula (1)

wherein in the Formula (1), M is at least one member of transition metal elements in groups 5 to 10 and periods 4 to 6 of a periodic table; A is at least one member of alkali metal and alkaline earth metal; y is an integer of from 3 to 6; and x is a number calculated by (y−m)/a, wherein m is a valence of M and a is a valence of A and
wherein the polyamide resin composition excludes clay.

Assignees

• Toyo Boseki

Inventors

• Yoshimura Nobuhiro

Classifications

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K2003/085

  Copper · CPC title

• C08L77/00 Primary

  Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers · CPC title

• C08K2003/0856

  Iron · CPC title

• C08K3/28

  Nitrogen-containing compounds · CPC title