Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device

Patent metadata

Field	Value
Publication number	US-10526448-B2
Application number	US-201715852992-A
Country	US
Kind code	B2
Filing date	Dec 22, 2017
Priority date	Jun 30, 2015
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.

First claim

What is claimed is:

1. A photosensitive resin composition comprising:
at least one kind of heterocycle-containing polymer precursor, and
a photoradical polymerization initiator,
wherein the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor, and
the dispersity, which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor, is from 2.5 to 3.1, wherein the heterocycle-containing polymer precursor has a polymerizable unsaturated group.

2. The photosensitive resin composition according to claim 1 ,
wherein the dispersity is from 2.8 to 3.1.

3. The photosensitive resin composition according to claim 1 ,
wherein two or more kinds of heterocycle-containing polymer precursors having a difference in at least one of the weight-average molecular weight or a constituting repeating unit are included as the heterocycle-containing polymer precursor.

4. The photosensitive resin composition according to claim 1 ,
wherein the at least one kind of heterocycle-containing polymer precursor is a precursor having a repeating unit represented by General Formula (1-1),

in General Formula (1-1), A 1 and A 2 each independently represent an oxygen atom or NH, R 111 represents a divalent organic group, R 112 represents a single bond or a divalent group, and R 113 and R 114 each independently represent a hydrogen atom or a monovalent organic group.

5. The photosensitive resin composition according to claim 4 ,
wherein at least one of A 1 or A 2 is an oxygen atom.

6. The photosensitive resin composition according to claim 4 ,
wherein R 112 is a single bond, or a group selected from a hydrocarbon group having 1 to 10 carbon atoms, which may be substituted with a fluorine atom, —O—, —C(═O)—, —S—, —SO 2 —, —NHCO—, and a combination thereof.

7. The photosensitive resin composition:
according to claim 1 , further comprising a photoacid generator.

8. The photosensitive resin composition according to claim 1 , further comprising:
a curable compound.

9. The photosensitive resin composition according to claim 8 ,
wherein the curable compound includes a compound having an ethylenically unsaturated bond.

10. The photosensitive resin composition according to claim 8 ,
wherein the curable compound is a compound having two or more ethylenically unsaturated groups.

11. The photosensitive resin composition according to claim 1 , which is used for forming an interlayer insulating film for a re-wiring layer.

12. A method for producing the precursor composition according to claim 1 , comprising:
using two or more kinds of heterocycle-containing polymer precursors having different weight-average molecular weights as the heterocycle-containing polymer precursor,
wherein the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor.

13. A cured film formed by curing the precursor composition according to claim 1 .

14. The cured film according to claim 13 , which is an interlayer insulating film for a re-wiring layer.

15. A method for producing a cured film, comprising:
using the precursor composition according to claim 1 .

16. The method for producing a cured film according to claim 15 , comprising:
applying the precursor composition or the photosensitive resin composition onto a substrate; and
curing the precursor composition or the photosensitive resin composition applied onto the substrate.

17. A semiconductor device comprising:
the cured film according to claim 13 .

Assignees

• Fujifilm Corp

Inventors

• Shibuya Akinori
• Iwai Yu
• Kawabata Takeshi
• Koyama Ichiro

Classifications

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• G03F7/037

  the binders being polyamides or polyimides · CPC title

• C08G73/1007

  from tetracarboxylic acids or derivatives and diamines · CPC title

• G03F7/0388

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• C08G73/1042

  Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds · CPC title